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Category:G01R31/28
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Pages in category "G01R31/28"
The following 78 pages are in this category, out of 78 total.
1
- 17530035. MODULAR AND ADJUSTABLE THERMAL LOAD TEST VEHICLE simplified abstract (MICROSOFT TECHNOLOGY LICENSING, LLC)
- 17533194. LOGIC LOCKING WITH RANDOM KEY simplified abstract (International Business Machines Corporation)
- 17540835. LOCALIZED MAGNETIC FIELD TESTING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17541708. MIXED HIGH-RESOLUTION AND LOW-RESOLUTION INSPECTION FOR TAMPER DETECTION simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17550157. INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17643216. TESTING A SINGLE CHIP IN A WAFER PROBING SYSTEM simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17738272. TEST SOCKET FOR PERFORMING A TEST ON AN ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17808357. INTEGRATED CIRCUIT PACKAGE WITH INTERNAL CIRCUITRY TO DETECT EXTERNAL COMPONENT PARAMETERS AND PARASITICS simplified abstract (QUALCOMM Incorporated)
- 17832488. INTERCONNECT STRUCTURES IN INTEGRATED CIRCUIT CHIPS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17850858. INTEGRATED CIRCUIT TEST SOCKET WITH INTEGRATED DEVICE PICKING MECHANISM simplified abstract (Western Digital Technologies, Inc.)
- 17870034. FUSE LIFE EXPECTANCY PREDICTION DEVICE FOR ELECTRIC VEHICLE BATTERY AND PREDICTION METHOD THEREOF simplified abstract (Hyundai Motor Company)
- 17870034. FUSE LIFE EXPECTANCY PREDICTION DEVICE FOR ELECTRIC VEHICLE BATTERY AND PREDICTION METHOD THEREOF simplified abstract (Kia Corporation)
- 17873385. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17933739. SENSOR RELIABILITY DETECTION AND POWER MANAGEMENT simplified abstract (STMICROELECTRONICS S.R.L.)
- 17966456. METHOD AND APPARATUS FOR DIAGNOSING ELECTRONIC APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17979849. SEMICONDUCTOR SUBSTRATE AND ELECTRICAL INSPECTION METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18047366. SEMICONDUCTOR CHIP AND TEST METHOD OF THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18062125. BALL GRID ARRAY CURRENT METER WITH A CURRENT SENSE WIRE simplified abstract (International Business Machines Corporation)
- 18151959. TEST CIRCUIT AND METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18174865. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18177809. TEST SYSTEM, TEST METHOD, AND NON-TRANSITORY COMPUTER READABLE MEDIUM simplified abstract (Kioxia Corporation)
- 18183446. APPARATUS FOR TESTING IMAGE SENSOR AND OPERATING METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18191787. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18192745. Repackaging IC Chip For Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18192770. Forming Openings Through Carrier Substrate of IC Package Assembly for Fault Identification simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18232056. SEMICONDUCTOR WAFER TEST SYSTEM BY FEEDBACK CONTROL simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18240957. SEMICONDUCTOR TEST DEVICE AND SYSTEM AND TEST METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18264319. METHOD FOR SETTING UP TEST APPARATUS AND TEST APPARATUS simplified abstract (Tokyo Electron Limited)
- 18299265. WAFER-LEVEL MULTI-DEVICE TESTER AND SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18303845. TEST BOARD AND TEST DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18345469. INSPECTION DEVICE FOR DISPLAY APPARATUS AND INSPECTION METHOD FOR DISPLAY APPARATUS simplified abstract (Samsung Display Co., Ltd.)
- 18359298. PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST simplified abstract (Apple Inc.)
- 18363937. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18368195. 3D TAP & SCAN PORT ARCHITECTURES simplified abstract (Texas Instruments Incorporated)
- 18403623. SCAN ARCHITECTURE FOR INTERCONNECT TESTING IN 3D INTEGRATED CIRCUITS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18460495. SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18471624. WAFER LEVEL METHODS OF TESTING SEMICONDUCTOR DEVICES USING INTERNALLY-GENERATED TEST ENABLE SIGNALS simplified abstract (Samsung Electronics Co., Ltd.)
- 18516106. GALLIUM NITRIDE-BASED DEVICES AND METHODS OF TESTING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517260. CIRCUIT TEST STRUCTURE AND METHOD OF USING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18521432. METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18526497. TSV TESTING simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
2
- 20240036107. TEST DEVICE simplified abstract (teCat Technologies (Suzhou) Limited)
- 20240040701. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 20240077531.SYSTEMS AND METHODS FOR SILICON CRACK DETECTION STRUCTURE simplified abstract (apple inc.)
- 20240085478.WAFER-LEVEL MULTI-DEVICE TESTER AND SYSTEM INCLUDING THE SAME simplified abstract (samsung electronics co., ltd.)
A
B
I
- International business machines corporation (20240103065). ACTIVE BRIDGE FOR CHIPLET AND MODULE INTER-COMMUNICATION simplified abstract
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on February 1st, 2024
- International Business Machines Corporation patent applications on January 18th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 28th, 2024
K
S
- Samsung display co., ltd. (20240094246). INSPECTION DEVICE FOR DISPLAY APPARATUS AND INSPECTION METHOD FOR DISPLAY APPARATUS simplified abstract
- Samsung display co., ltd. (20240120345). DISPLAY DEVICE simplified abstract
- Samsung Display Co., Ltd. patent applications on April 11th, 2024
- Samsung Display Co., Ltd. patent applications on March 21st, 2024
- Samsung electronics co., ltd. (20240103070). SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240094281). METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240094282). CIRCUIT TEST STRUCTURE AND METHOD OF USING simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
U
- US Patent Application 17804658. BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE simplified abstract
- US Patent Application 18052538. WAFER TEST SYSTEM AND OPERATING METHOD THEREOF simplified abstract
- US Patent Application 18120213. WIRELESS CHANNEL REPRODUCTION DEVICE simplified abstract
- US Patent Application 18303401. Built-in Self-Test for Die-to-Die Physical Interfaces simplified abstract
- US Patent Application 18363143. TEST CIRCUIT AND METHOD simplified abstract