18232056. SEMICONDUCTOR WAFER TEST SYSTEM BY FEEDBACK CONTROL simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR WAFER TEST SYSTEM BY FEEDBACK CONTROL
Organization Name
Inventor(s)
SEMICONDUCTOR WAFER TEST SYSTEM BY FEEDBACK CONTROL - A simplified explanation of the abstract
This abstract first appeared for US patent application 18232056 titled 'SEMICONDUCTOR WAFER TEST SYSTEM BY FEEDBACK CONTROL
Simplified Explanation
The patent application describes a wafer test system that includes two heat source units with different refrigerants and temperature ranges, a wafer chuck with a heating member and channel for refrigerant circulation, supply lines for each heat source unit to supply refrigerant to the channel, and a controller to control the supply of refrigerant based on a target temperature for testing the wafer.
- The system includes two heat source units with different refrigerants and temperature ranges.
- The wafer chuck has a heating member and channel for refrigerant circulation.
- Supply lines connect each heat source unit to the channel to supply refrigerant.
- A controller is used to selectively control the supply of refrigerant based on a target temperature for testing the wafer.
- Potential Applications
- Semiconductor wafer testing
- Quality control in semiconductor manufacturing
- Problems Solved
- Ensures precise temperature control during wafer testing
- Allows for testing under different temperature conditions
- Benefits
- Improved accuracy and reliability in wafer testing
- Enhanced quality control in semiconductor manufacturing operations
Original Abstract Submitted
A wafer test system includes: a first heat source unit including a first refrigerant having a first temperature range; a second heat source unit including a second refrigerant having a second temperature range; a wafer chuck to support a wafer, which: a heating member to heat the wafer, and a channel to circulate the first refrigerant and the second refrigerant; a first supply line connected to the first heat source unit, the first supply line to circulate and supply the first refrigerant to the channel; a second supply line connected to the second heat source unit, the second supply line to circulate and supply the second refrigerant to the channel; and a controller to selectively control supply of the first refrigerant and the second refrigerant based on a target temperature for testing the wafer on the wafer chuck.
