18460495. SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)

SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE

Organization Name

Kioxia Corporation

Inventor(s)

Tsunehiro Kita of Fujisawa Kanagawa (JP)

Soichiro Ibaraki of Yokohama Kanagawa (JP)

SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18460495 titled 'SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE

Simplified Explanation

The patent application describes a socket board used for testing a semiconductor device by raising its temperature to a predetermined level. The socket board includes a substrate, a socket for holding the semiconductor device, a pin for contacting the device's terminals, and a heat conductive material with macromolecular gel and electrically-insulating metal-containing particles.

• Substrate: The socket board has a base on which the components are mounted.
• Socket: This part holds the semiconductor device securely during testing.
• Pin: It penetrates the socket to make contact with the device's terminals.
• Heat conductive material: Made of macromolecular gel and metal-containing particles, it helps in transferring heat to the device's terminals.

Potential Applications

The technology can be used in semiconductor testing equipment, manufacturing processes, and quality control systems.

Problems Solved

1. Ensures accurate testing by maintaining a consistent temperature of the semiconductor device. 2. Prevents damage to the device due to overheating during testing.

Benefits

1. Improved testing accuracy and reliability. 2. Enhanced thermal management for semiconductor devices. 3. Increased efficiency in testing processes.

Potential Commercial Applications

"Socket Board for Semiconductor Testing: Applications and Benefits"

Possible Prior Art

There may be prior art related to socket boards for semiconductor testing, but specific examples are not provided in the patent application.

Unanswered Questions

How does the heat conductive material with macromolecular gel and metal-containing particles compare to traditional heat transfer methods in semiconductor testing?

The patent application does not provide a direct comparison between the proposed heat conductive material and traditional methods. Further research or testing may be needed to evaluate the effectiveness of this innovation in comparison to existing technologies.

Are there any limitations or potential challenges in implementing this socket board technology in semiconductor testing equipment?

The patent application does not address any limitations or challenges that may arise in the implementation of this technology. It would be important to consider factors such as cost, compatibility with existing systems, and potential maintenance requirements when integrating this socket board into semiconductor testing equipment.

Original Abstract Submitted

A socket board used for testing a semiconductor device having one or more terminals, by raising a temperature of the semiconductor device to a predetermined temperature, includes a substrate, a socket that is provided on the substrate and capable of holding the semiconductor device, a pin that penetrates a bottom portion of the socket, and has an upper portion that is to come into contact with a terminal of the semiconductor device, and a heat conductive material that is disposed on the bottom portion of the socket to come into contact with the terminals of the semiconductor device held in the socket. The heat conductive material includes a macromolecular gel, and electrically-insulating metal-containing particles added to the macromolecular gel.