International business machines corporation (20240103065). ACTIVE BRIDGE FOR CHIPLET AND MODULE INTER-COMMUNICATION simplified abstract

ACTIVE BRIDGE FOR CHIPLET AND MODULE INTER-COMMUNICATION

Organization Name

international business machines corporation

Inventor(s)

Arvind Kumar of Chappaqua NY (US)

Ramachandra Divakaruni of Ossining NY (US)

Mukta Ghate Farooq of HOPEWELL JCT NY (US)

John W. Golz of HOPEWELL JCT NY (US)

JIN PING Han of Yorktown Heights NY (US)

Mounir Meghelli of Tarrytown NY (US)

ACTIVE BRIDGE FOR CHIPLET AND MODULE INTER-COMMUNICATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240103065 titled 'ACTIVE BRIDGE FOR CHIPLET AND MODULE INTER-COMMUNICATION

Simplified Explanation

The semiconductor integrated circuit device described in the abstract includes an active bridge, two chiplets mounted onto the active bridge, and a short-to-long converter circuit (SLCC) with analog and digital portions. The active bridge contains at least the analog portion of the SLCC and is electrically connected to the first chiplet. The first chiplet has a first logic core, a first chiplet interface connected to the SLCC, and a second chiplet interface connected to the second chiplet. The second chiplet includes a second logic core and a third chiplet interface connected to the second chiplet interface. The active bridge may also feature a built-in-self-test (BIST) circuit.

• Active bridge with SLCC and chiplets
• Short-to-long converter circuit with analog and digital portions
• Chiplets with logic cores and interfaces
• Built-in-self-test circuit in the active bridge

Potential Applications

The technology described in this patent application could be applied in various semiconductor devices, such as processors, memory modules, and communication systems.

Problems Solved

This technology solves the problem of efficiently connecting multiple chiplets on a semiconductor integrated circuit device while maintaining signal integrity and performance.

Benefits

The benefits of this technology include improved connectivity between chiplets, enhanced performance, and potentially reduced power consumption in semiconductor devices.

Potential Commercial Applications

This technology could be utilized in the development of advanced computing systems, networking equipment, and high-performance electronic devices.

Possible Prior Art

One possible prior art for this technology could be the use of active bridges in semiconductor devices to improve signal transmission and connectivity between components.

How does the SLCC circuit optimize signal transmission between chiplets?

The abstract mentions the SLCC circuit, but it does not provide specific details on how this circuit optimizes signal transmission between chiplets. Further information on the design and functionality of the SLCC circuit would be beneficial.

What are the specific testing capabilities of the built-in-self-test (BIST) circuit in the active bridge?

While the abstract mentions the presence of a BIST circuit in the active bridge, it does not elaborate on the specific testing capabilities of this circuit. Understanding the testing functionalities of the BIST circuit would provide insights into the device's reliability and maintenance features.

Original Abstract Submitted

a semiconductor integrated circuit device includes: an active bridge; a first chiplet and a second chiplet mounted onto the active bridge; and a short-to-long converter circuit (slcc) that has analog and digital portions. the active bridge includes at least the analog portion of the slcc, which is electrically connected to at least the first chiplet; and a short-reach physical layer that electrically connects the first chiplet and the second chiplet. the first chiplet includes a first logic core; a first chiplet interface that is electrically connected between the first logic core and the slcc; and a second chiplet interface that is electrically connected between the first logic core and the second chiplet. the second chiplet includes a second logic core; and a third chiplet interface that is electrically connected between the second logic core and the second chiplet interface. the active bridge also can include a built-in-self-test (bist) circuit.