17533194. LOGIC LOCKING WITH RANDOM KEY simplified abstract (International Business Machines Corporation)

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LOGIC LOCKING WITH RANDOM KEY

Organization Name

International Business Machines Corporation

Inventor(s)

Effendi Leobandung of Stormville NY (US)

LOGIC LOCKING WITH RANDOM KEY - A simplified explanation of the abstract

This abstract first appeared for US patent application 17533194 titled 'LOGIC LOCKING WITH RANDOM KEY

Simplified Explanation

The patent application describes a method for generating a unique identification key for a semiconductor chip during fabrication. This key is used to unlock the chip and enable its functionality.

  • The processor measures characteristic data of a structure in the chip, such as current or capacitance measurement.
  • This measurement is recorded as an internal chip fingerprint key, which serves as a unique identifier for the chip.
  • The fabrication of the chip is completed, including the inclusion of a hashing engine and a logic lock.
  • A die ID is generated based on the internal chip fingerprint key.
  • A first external key is generated using the die ID and the hash engine.
  • The first external key is inputted into the chip to unlock it.
  • The first external key, when hashed with the internal chip fingerprint key, creates an unlocking key for the logic lock.

Potential applications of this technology:

  • Semiconductor manufacturing industry
  • Integrated circuit design and fabrication
  • Chip security and authentication systems

Problems solved by this technology:

  • Ensures the uniqueness and authenticity of each chip by generating a unique identification key during fabrication.
  • Provides a secure method for unlocking and enabling the functionality of the chip.

Benefits of this technology:

  • Enhances chip security by using a combination of internal and external keys.
  • Simplifies the process of chip identification and unlocking.
  • Provides a reliable method for preventing unauthorized access to the chip.


Original Abstract Submitted

Aspects of the invention include measuring, by a processor, characteristic data of a structure in a first die of a wafer during fabrication, wherein the characteristic data of the structure comprises a current or capacitance measurement in the structure, recording the current or capacitance measurement as an internal chip fingerprint key for the first die, causing, by the processor, completion of fabrication of the first die in the wafer, wherein the first die comprises a hashing engine and a logic lock, generating a die ID for the first die based on the internal chip fingerprint key for the first die, generating a first external key based on the die ID and the hash engine, and inputting the first external key into the first die to unlock the first die, wherein the first external key hashed with the internal chip fingerprint key creates an unlocking key for the logic lock.

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