17850858. INTEGRATED CIRCUIT TEST SOCKET WITH INTEGRATED DEVICE PICKING MECHANISM simplified abstract (Western Digital Technologies, Inc.)

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INTEGRATED CIRCUIT TEST SOCKET WITH INTEGRATED DEVICE PICKING MECHANISM

Organization Name

Western Digital Technologies, Inc.

Inventor(s)

Yalaj Goyal of Indore (IN)

Shailesh R. Nayak of Bangalore (IN)

Joe Paul Moolanmoozha of Bangalore (IN)

INTEGRATED CIRCUIT TEST SOCKET WITH INTEGRATED DEVICE PICKING MECHANISM - A simplified explanation of the abstract

This abstract first appeared for US patent application 17850858 titled 'INTEGRATED CIRCUIT TEST SOCKET WITH INTEGRATED DEVICE PICKING MECHANISM

Simplified Explanation

The abstract describes a patent application for an integrated circuit (IC) device test socket with an integrated IC picking mechanism. The test socket consists of a base member and a cover member, where the base member has a recess to hold the IC device for testing. The cover member can be attached to the base member to secure the IC device in place. The cover member also includes an IC picking mechanism that uses suction to hold the IC device.

  • The patent application is for an IC test socket with an integrated IC picking mechanism.
  • The test socket consists of a base member and a cover member.
  • The base member has a recess to hold the IC device for testing.
  • The cover member can be attached to the base member to secure the IC device.
  • The cover member includes an IC picking mechanism that uses suction to hold the IC device.

Potential Applications

  • Testing and quality control of integrated circuit devices.
  • Manufacturing and production of integrated circuit devices.

Problems Solved

  • Simplifies the process of removing IC devices from test sockets after testing.
  • Reduces the risk of damage to IC devices during removal.

Benefits

  • Efficient and reliable removal of IC devices from test sockets.
  • Minimizes the potential for damage to IC devices.
  • Streamlines the testing and production process of integrated circuit devices.


Original Abstract Submitted

An integrated circuit (IC) device test socket has an integrally formed IC picking mechanism for removing an IC device from the test socket after testing. The test socket has a base member and a cover member. The base member includes a recess that is configured to receive an IC device for testing. The cover member is configured to removably engage the base member to secure the IC device between the cover member and the base member. The cover member includes an IC picking mechanism configured to use suction to retain the IC device to the cover member.

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