17541708. MIXED HIGH-RESOLUTION AND LOW-RESOLUTION INSPECTION FOR TAMPER DETECTION simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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MIXED HIGH-RESOLUTION AND LOW-RESOLUTION INSPECTION FOR TAMPER DETECTION

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Effendi Leobandung of Stormville NY (US)

MIXED HIGH-RESOLUTION AND LOW-RESOLUTION INSPECTION FOR TAMPER DETECTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 17541708 titled 'MIXED HIGH-RESOLUTION AND LOW-RESOLUTION INSPECTION FOR TAMPER DETECTION

Simplified Explanation

The abstract describes a computer-implemented method for using optical inspection tools to identify a tamper circuit on a reference die of a wafer and determine if the same tamper circuit is present on a second die of the wafer.

  • The method involves using a high-resolution optical inspection tool (HROIT) to identify a reference die tamper circuit.
  • A low-resolution optical inspection tool (LROIT) is then used to determine if the reference die tamper circuit is present on a second die of the wafer.
  • The processor controls both the HROIT and LROIT in this process.

Potential Applications

  • Semiconductor manufacturing: This technology can be used in the production of semiconductor wafers to detect tampering or unauthorized modifications in the circuitry.
  • Quality control: The method can help ensure the integrity and authenticity of semiconductor devices by identifying any tampering attempts during the manufacturing process.

Problems Solved

  • Tamper detection: The method provides a way to detect if a tamper circuit, which may indicate unauthorized modifications, is present on a semiconductor die.
  • High-resolution inspection: The use of a high-resolution optical inspection tool allows for detailed analysis and identification of the tamper circuit.
  • Low-resolution inspection: The low-resolution optical inspection tool provides a quicker and more cost-effective way to determine if the tamper circuit is present on other dies.

Benefits

  • Enhanced security: By detecting tamper circuits, this technology helps protect against counterfeiting, reverse engineering, or unauthorized modifications to semiconductor devices.
  • Efficient inspection: The combination of high-resolution and low-resolution inspection tools allows for a comprehensive and efficient analysis of multiple dies on a wafer.
  • Cost-effective: The use of a low-resolution optical inspection tool reduces the need for expensive high-resolution inspections on every die, saving time and resources.


Original Abstract Submitted

Embodiments of the invention include a computer-implemented method that includes controlling, using a processor, a high-resolution optical inspection tool (HROIT) to identify a reference die tamper circuit on a reference die of a wafer; and controlling, using the processor, a low-resolution optical inspection tool (LROIT) to use the reference die tamper circuit to determine that the reference die tamper circuit is on a second die of the wafer.

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