Taiwan semiconductor manufacturing co., ltd. (20240094281). METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM simplified abstract
Contents
- 1 METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Ankita Patidar of Hsinchu (TW)
Sandeep Kumar Goel of Hsinchu (TW)
METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240094281 titled 'METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM
Simplified Explanation
The abstract describes a method of testing an integrated circuit on a test circuit board by simulating heat distribution throughout the circuit design while simultaneously performing a burn-in test and automated test of the integrated circuit.
- The method involves performing a simulation of heat distribution throughout the integrated circuit design.
- The burn-in test includes a minimum burn-in temperature or a specific heat distribution across the integrated circuit.
- The simulation determines a heat signature of the integrated circuit design based on power and location information for each circuit block or heater.
- The heat signature includes heat values distributed throughout the integrated circuit design.
Potential Applications
This technology could be applied in the semiconductor industry for testing integrated circuits before they are deployed in electronic devices.
Problems Solved
This method helps identify potential heat distribution issues in integrated circuit designs, ensuring the reliability and performance of the final product.
Benefits
The simultaneous testing approach saves time and resources by combining burn-in testing, automated testing, and heat distribution simulation in one process.
Potential Commercial Applications
This technology could be valuable for semiconductor manufacturers, electronics companies, and quality control laboratories.
Possible Prior Art
Prior methods of testing integrated circuits may have involved separate processes for burn-in testing, automated testing, and heat distribution analysis.
Unanswered Questions
How does this method compare to traditional testing approaches for integrated circuits?
This article does not provide a direct comparison between this method and traditional testing approaches for integrated circuits.
What specific types of integrated circuits or electronic devices could benefit most from this testing method?
The article does not specify which types of integrated circuits or electronic devices could benefit the most from this testing method.
Original Abstract Submitted
a method of testing an integrated circuit on a test circuit board includes performing, by a processor, a simulation of a first heat distribution throughout an integrated circuit design, and simultaneously performing a burn-in test of the integrated circuit and an automated test of the integrated circuit. the burn-in test has a minimum burn-in temperature of the integrated circuit or a burn-in heat distribution across the integrated circuit that includes a set of circuit blocks or a first set of heaters. the integrated circuit design corresponding to the integrated circuit. the performing the simulation includes determining a heat signature of the integrated circuit design from configured power information or location information for each circuit block of the set of circuit blocks or each heater of the set of heaters included in the integrated circuit design. the heat signature includes heat values distributed throughout the integrated circuit design.
