17530035. MODULAR AND ADJUSTABLE THERMAL LOAD TEST VEHICLE simplified abstract (MICROSOFT TECHNOLOGY LICENSING, LLC)

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MODULAR AND ADJUSTABLE THERMAL LOAD TEST VEHICLE

Organization Name

MICROSOFT TECHNOLOGY LICENSING, LLC

Inventor(s)

Dennis Trieu of Calgary (CA)

Bharath Ramakrishnan of Bellevue WA (US)

Husam Atallah Alissa of Redmond WA (US)

Robert Jason Lankston, Ii of Woodinville WA (US)

Xudong Tang of Sammamish WA (US)

MODULAR AND ADJUSTABLE THERMAL LOAD TEST VEHICLE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17530035 titled 'MODULAR AND ADJUSTABLE THERMAL LOAD TEST VEHICLE

Simplified Explanation

The abstract describes a device that simulates thermal loads. It consists of a platform and multiple nodes, with at least one node being movable. The movable node is connected to the platform through a movable stage, allowing it to move relative to the platform.

  • The device simulates thermal loads.
  • It includes a platform and multiple nodes.
  • At least one node is movable.
  • The movable node is connected to the platform through a movable stage.
  • The movable node can move relative to the platform.

Potential Applications

This technology has potential applications in various fields, including:

  • Testing and validation of thermal management systems in electronic devices.
  • Research and development of materials with specific thermal properties.
  • Calibration and verification of thermal sensors and instruments.
  • Training and education in thermal engineering and heat transfer.

Problems Solved

The device solves several problems related to simulating thermal loads, such as:

  • Providing a controlled and repeatable environment for testing thermal management systems.
  • Allowing researchers to study the effects of different thermal conditions on materials and devices.
  • Ensuring accurate calibration and verification of thermal sensors and instruments.
  • Enhancing the understanding and knowledge of thermal engineering principles through practical demonstrations.

Benefits

The device offers several benefits over existing methods of simulating thermal loads, including:

  • Increased flexibility and adjustability in creating specific thermal conditions.
  • Improved accuracy and precision in testing and research.
  • Time and cost savings by eliminating the need for complex and expensive setups.
  • Enhanced educational opportunities through hands-on experimentation and visualization of thermal concepts.


Original Abstract Submitted

A device for simulating thermal loads includes a platform and a plurality of nodes supported by the platform. At least one node is a movable node connected to the platform by a movable stage to move the movable node relative to the platform.

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