20240077531.SYSTEMS AND METHODS FOR SILICON CRACK DETECTION STRUCTURE simplified abstract (apple inc.)
Contents
- 1 SYSTEMS AND METHODS FOR SILICON CRACK DETECTION STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SYSTEMS AND METHODS FOR SILICON CRACK DETECTION STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SYSTEMS AND METHODS FOR SILICON CRACK DETECTION STRUCTURE
Organization Name
Inventor(s)
David A. Karol of San Francisco CA (US)
Date J.W. Noorlag of Fremont CA (US)
Scott D. Hector of Austin TX (US)
Vasu P. Ganti of Los Gatos CA (US)
SYSTEMS AND METHODS FOR SILICON CRACK DETECTION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240077531 titled 'SYSTEMS AND METHODS FOR SILICON CRACK DETECTION STRUCTURE
Simplified Explanation
The patent application describes systems and methods for detecting defects caused by cracks in an integrated circuit. Here are some key points from the abstract:
- Integrated circuits may develop cracks during or after the silicon wafer is divided into separate circuits.
- The integrated circuit includes crack detection circuitry with a metal circuit that can fracture due to crack propagation.
- Testing can identify the fracture of the metal circuit in the event of a crack.
- The crack detection circuitry can also verify the accurate operation of the integrated circuit's circuitry.
Potential Applications
This technology could be applied in the semiconductor industry for quality control and defect detection in integrated circuits.
Problems Solved
This technology helps in identifying defects caused by cracks in integrated circuits, ensuring the overall quality and reliability of the circuits.
Benefits
The benefits of this technology include improved quality control, early detection of defects, and enhanced reliability of integrated circuits.
Potential Commercial Applications
One potential commercial application of this technology could be in semiconductor manufacturing companies for ensuring the quality of their integrated circuits.
Possible Prior Art
One possible prior art could be the use of various testing methods to detect defects in integrated circuits, but the specific approach described in this patent application may be novel.
Unanswered Questions
How does this technology compare to existing crack detection methods in integrated circuits?
This article does not provide a direct comparison to existing crack detection methods in integrated circuits. Further research or a detailed analysis would be needed to understand the differences and advantages of this technology over existing methods.
What impact could this technology have on the overall reliability of integrated circuits in various applications?
The article does not delve into the potential impact of this technology on the reliability of integrated circuits in different applications. Further studies or real-world implementations would be necessary to assess the full extent of its impact.
Original Abstract Submitted
systems and methods are provided for detecting defects caused by cracks in an integrated circuit, which may arise during or after a silicon wafer is singulated into separate integrated circuits. an integrated circuit may include crack detection circuitry including a metal circuit. the metal circuit may fracture or break due to crack propagation through a portion of the integrated circuit. in the event of a crack, testing may detect the fracture of the metal circuit. the crack detection circuitry may also detect accurate operation of circuitry of the integrated circuit.
