17550157. INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Mark D. Schultz of Ossining NY (US)

INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING - A simplified explanation of the abstract

This abstract first appeared for US patent application 17550157 titled 'INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED COOLING DURING CHIP TESTING

Simplified Explanation

The abstract describes a method for preparing an integrated circuit (IC) chip for testing operations. The method involves adding a back-surface topography to the back surface of the IC chip, with the topography having a larger surface area than the back surface itself.

  • The method involves accessing the back surface of an IC chip.
  • A back-surface topography is added to the back surface.
  • The surface area of the back-surface topography is greater than the surface area of the back surface.

Potential Applications:

  • This method can be used in the manufacturing and testing of integrated circuit chips.
  • It can help improve the efficiency and accuracy of testing operations on IC chips.

Problems Solved:

  • Traditional IC chip testing methods may not provide sufficient access to the back surface of the chip.
  • This method solves the problem of limited access by adding a back-surface topography, allowing for better testing capabilities.

Benefits:

  • The added back-surface topography increases the surface area available for testing, improving the accuracy and reliability of test operations.
  • This method can potentially reduce the time and cost required for testing IC chips.
  • It can help identify and address any issues or defects in the IC chip more effectively.


Original Abstract Submitted

Embodiments of the invention include a method of preparing an integrated circuit (IC) chip to participate in test operations. The method includes accessing a back surface of the IC chip and adding a back-surface topography to the back surface. A surface area of the back-surface topography is greater than a surface area of the back surface.

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