Kioxia corporation (20240094244). SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the socket board handle different sizes of semiconductor devices?
- 1.11 What is the expected lifespan of the heat conductive material in the socket board?
- 1.12 Original Abstract Submitted
SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Tsunehiro Kita of Fujisawa Kanagawa (JP)
Soichiro Ibaraki of Yokohama Kanagawa (JP)
SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240094244 titled 'SOCKET BOARD AND METHOD FOR INSPECTING A SEMICONDUCTOR DEVICE
Simplified Explanation
The abstract describes a socket board for testing a semiconductor device by raising its temperature to a predetermined level. The socket board includes a substrate, a socket for holding the semiconductor device, a pin for contacting the device's terminals, and a heat conductive material with macromolecular gel and electrically-insulating metal-containing particles.
- Substrate: The base on which the socket board is built.
- Socket: Holds the semiconductor device securely in place.
- Pin: Contacts the terminals of the semiconductor device.
- Heat conductive material: Contains macromolecular gel and metal-containing particles for efficient heat transfer.
Potential Applications
The technology can be used in semiconductor testing equipment, thermal management systems, and quality control processes.
Problems Solved
1. Ensures accurate testing of semiconductor devices by maintaining a consistent temperature. 2. Improves heat dissipation during testing, preventing overheating and damage to the device.
Benefits
1. Enhanced reliability and accuracy in semiconductor testing. 2. Efficient heat transfer for optimal performance. 3. Cost-effective solution for testing and quality control processes.
Potential Commercial Applications
Optimizing Semiconductor Testing with Heat Conductive Socket Board
Possible Prior Art
There may be prior art related to heat conductive materials in semiconductor testing equipment, but specific examples are not provided in the abstract.
Unanswered Questions
How does the socket board handle different sizes of semiconductor devices?
The abstract does not mention how the socket board accommodates various sizes of semiconductor devices. This information would be crucial for understanding the versatility of the technology.
What is the expected lifespan of the heat conductive material in the socket board?
The abstract does not provide details on the durability or longevity of the heat conductive material used in the socket board. Understanding this aspect would be important for assessing the overall cost-effectiveness of the technology.
Original Abstract Submitted
a socket board used for testing a semiconductor device having one or more terminals, by raising a temperature of the semiconductor device to a predetermined temperature, includes a substrate, a socket that is provided on the substrate and capable of holding the semiconductor device, a pin that penetrates a bottom portion of the socket, and has an upper portion that is to come into contact with a terminal of the semiconductor device, and a heat conductive material that is disposed on the bottom portion of the socket to come into contact with the terminals of the semiconductor device held in the socket. the heat conductive material includes a macromolecular gel, and electrically-insulating metal-containing particles added to the macromolecular gel.
