18521432. METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Ankita Patidar of Hsinchu (TW)
Sandeep Kumar Goel of Hsinchu (TW)
METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18521432 titled 'METHOD OF TESTING AN INTEGRATED CIRCUIT AND TESTING SYSTEM
Simplified Explanation
The abstract describes a method of testing an integrated circuit on a test circuit board by simulating heat distribution throughout the circuit design while simultaneously performing a burn-in test and automated test of the integrated circuit.
- Processor performs simulation of heat distribution in integrated circuit design
- Burn-in test includes minimum temperature or heat distribution across circuit blocks or heaters
- Simulation determines heat signature of integrated circuit design
- Heat signature includes distributed heat values throughout the design
Potential Applications
This technology could be applied in the semiconductor industry for testing integrated circuits before they are deployed in electronic devices.
Problems Solved
This method helps identify potential issues with heat distribution in integrated circuits, ensuring they function properly under various conditions.
Benefits
- Improved reliability of integrated circuits - Early detection of heat-related issues - Efficient testing process
Potential Commercial Applications
The technology could be used by semiconductor manufacturers, electronics companies, and testing laboratories for quality control and reliability testing of integrated circuits.
Possible Prior Art
One possible prior art could be the use of thermal imaging techniques to analyze heat distribution in integrated circuits during testing processes.
Unanswered Questions
1. How does the simulation of heat distribution impact the overall testing accuracy of the integrated circuit? 2. Are there any limitations to the burn-in test method described in the patent application?
Original Abstract Submitted
A method of testing an integrated circuit on a test circuit board includes performing, by a processor, a simulation of a first heat distribution throughout an integrated circuit design, and simultaneously performing a burn-in test of the integrated circuit and an automated test of the integrated circuit. The burn-in test has a minimum burn-in temperature of the integrated circuit or a burn-in heat distribution across the integrated circuit that includes a set of circuit blocks or a first set of heaters. The integrated circuit design corresponding to the integrated circuit. The performing the simulation includes determining a heat signature of the integrated circuit design from configured power information or location information for each circuit block of the set of circuit blocks or each heater of the set of heaters included in the integrated circuit design. The heat signature includes heat values distributed throughout the integrated circuit design.
