Apple inc. (20240094779). PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST simplified abstract
Contents
- 1 PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the heat generated during the self-test procedure impact the overall performance and reliability of the semiconductor components in the package?
- 1.11 Are there any specific limitations or constraints in the implementation of this technology in different types of semiconductor packages or environments?
- 1.12 Original Abstract Submitted
PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST
Organization Name
Inventor(s)
Krishna Prasad Vummidi Murali of Sunnyvale CA (US)
PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240094779 titled 'PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST
Simplified Explanation
The semiconductor component package described in the patent application includes circuitry that serves dual purposes: mitigating radio-frequency interference of signals in the package and performing self-test procedures of components within the package. The circuitry consists of chokes positioned between the I/O pads of the package and a sensor module to reduce high-frequency RF interference and safeguard sensors in the package. During self-test procedures, such as testing a sensor's temperature coefficient of offset, the chokes can be decoupled from the I/O pads and sensor module and connected between a current source and ground. By supplying a current to the chokes, the package's temperature can be increased for the self-test procedure, with high-resistance windings in the chokes enhancing heat generation.
- Chokes placed between I/O pads and sensor module to reduce RF interference and protect sensors
- Chokes can be decoupled for self-test procedures, raising package temperature for testing
- High-resistance windings in chokes increase heat generation during self-test
Potential Applications
The technology described in this patent application could be applied in various industries where semiconductor components are used, such as electronics manufacturing, automotive, aerospace, and telecommunications.
Problems Solved
1. Mitigating radio-frequency interference in semiconductor component packages 2. Facilitating self-test procedures for components within the package
Benefits
1. Improved signal integrity within the package 2. Enhanced protection for sensors and other components 3. Streamlined self-test procedures for efficient testing
Potential Commercial Applications
Optimizing Semiconductor Component Packages for RF Interference Mitigation and Self-Testing
Possible Prior Art
There may be prior art related to using chokes for RF interference mitigation in semiconductor packages or for self-test procedures, but specific examples are not provided in this patent application.
Unanswered Questions
How does the heat generated during the self-test procedure impact the overall performance and reliability of the semiconductor components in the package?
The article does not delve into the potential effects of increased temperature on the long-term functionality and durability of the components within the semiconductor package.
Are there any specific limitations or constraints in the implementation of this technology in different types of semiconductor packages or environments?
The patent application does not address any potential limitations or challenges that may arise when implementing this technology in various semiconductor packages or operating conditions.
Original Abstract Submitted
a semiconductor component package includes circuitry that can be used both for mitigating radio-frequency interference of signals in the package and for performing self-test procedures of components in the package. the circuitry includes chokes between the i/o pads of the package and a sensor module in the package to attenuate high-frequency rf interference in the package and protect sensors in the package. each i/o pad may have a corresponding choke. during a self-test procedure, such as a test of a sensor's temperature coefficient of offset, the chokes can be decoupled from the i/o pads and the sensor module and coupled between a current source and a ground. a current can be supplied to the choke to raise the temperature of the package. the chokes may use high-resistance windings to increase heat generation during the self-test procedure.
