17643216. TESTING A SINGLE CHIP IN A WAFER PROBING SYSTEM simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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TESTING A SINGLE CHIP IN A WAFER PROBING SYSTEM

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Thomas Gentner of Boeblingen (DE)

Alejandro Alberto Cook Lobo of Stuttgart (DE)

Otto Andreas Torreiter of Leinfelden-Echterdingen (DE)

TESTING A SINGLE CHIP IN A WAFER PROBING SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 17643216 titled 'TESTING A SINGLE CHIP IN A WAFER PROBING SYSTEM

Simplified Explanation

The patent application describes a method for testing single chips in a wafer probing system using an adapter plate. The steps involved in the method are as follows:

  • An adapter plate is provided with an interface surface that contacts a vacuum chuck of the wafer probing system.
  • The adapter plate is designed to hold the single chip in a cutout, with the chip's rear surface flush with the interface surface.
  • The adapter plate, loaded with the single chip, is placed into the wafer probing system.
  • The exact position of the single chip in the adapter plate's search area is determined.
  • The single chip is tested using test routines stored in a controller of the wafer probing system.

Potential applications of this technology:

  • Semiconductor manufacturing industry
  • Quality control and testing of single chips
  • Research and development of new chip designs

Problems solved by this technology:

  • Efficient testing of single chips in a wafer probing system
  • Accurate positioning of the single chip for testing
  • Simplified and streamlined testing process

Benefits of this technology:

  • Improved productivity and efficiency in chip testing
  • Reduced time and effort required for chip testing
  • Enhanced accuracy and reliability of test results


Original Abstract Submitted

A method for testing at least one single chip in a wafer probing system, at least comprising: providing an adapter plate having an interface surface for contacting a vacuum chuck of the wafer probing system, the adapter plate being configured to accommodate the at least one single chip in a cutout with a chip rear surface being flush with the interface surface; loading the adapter plate with the at least one single chip into the wafer probing system; determining an exact position of the at least one single chip in the adapter plate in the search area; and testing the at least one single chip with test routines stored in a controller of the wafer probing system. A device and an adapter plate for testing at least one single chip in a wafer probing system

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