17979849. SEMICONDUCTOR SUBSTRATE AND ELECTRICAL INSPECTION METHOD simplified abstract (CANON KABUSHIKI KAISHA)
Contents
- 1 SEMICONDUCTOR SUBSTRATE AND ELECTRICAL INSPECTION METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR SUBSTRATE AND ELECTRICAL INSPECTION METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Abstract
- 1.6 Patent/Innovation Explanation
- 1.7 Potential Applications
- 1.8 Problems Solved
- 1.9 Benefits
- 1.10 Original Abstract Submitted
SEMICONDUCTOR SUBSTRATE AND ELECTRICAL INSPECTION METHOD
Organization Name
Inventor(s)
Masanori Shibata of Tokyo (JP)
Makoto Takagi of Kanagawa (JP)
SEMICONDUCTOR SUBSTRATE AND ELECTRICAL INSPECTION METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 17979849 titled 'SEMICONDUCTOR SUBSTRATE AND ELECTRICAL INSPECTION METHOD
Simplified Explanation
Abstract
A semiconductor substrate is described that includes an internal circuit, a plurality of first pads that are electrically connected to the internal circuit, and one or more second pads that have a lower surface hardness than the first pads and are not electrically connected to the internal circuit.
Patent/Innovation Explanation
- The semiconductor substrate has an internal circuit.
- It includes a plurality of first pads that are electrically connected to the internal circuit.
- It also includes one or more second pads that have a lower surface hardness than the first pads.
- The second pads are not electrically connected to the internal circuit.
Potential Applications
- This technology can be used in the manufacturing of electronic devices and integrated circuits.
- It can be applied in the production of semiconductor chips and microprocessors.
- The lower surface hardness of the second pads can be beneficial in certain applications where a softer material is required.
Problems Solved
- The inclusion of second pads with lower surface hardness provides flexibility in the design and functionality of the semiconductor substrate.
- It allows for the use of different materials with varying hardness properties, which can be advantageous in specific applications.
- The second pads being not electrically connected to the internal circuit avoids any interference or unintended electrical connections.
Benefits
- The internal circuit can be connected to a variety of external components through the first pads, providing versatility in the use of the semiconductor substrate.
- The lower surface hardness of the second pads can prevent damage or scratching of delicate components during assembly or handling.
- The ability to use different materials for the second pads allows for customization and optimization of the substrate's properties for specific applications.
Original Abstract Submitted
A semiconductor substrate has an internal circuit, a plurality of first pads electrically connected to the internal circuit, and one or a plurality of second pads that have a surface hardness lower than that of the plurality of first pads and are not electrically connected to the internal circuit.
