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Category:C23C16/458
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This category has the following 102 subcategories, out of 102 total.
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Pages in category "C23C16/458"
The following 198 pages are in this category, out of 198 total.
1
- 17702105. DEPOSITION APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 17714363. SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR PROCESSING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17833438. CHUCK ASSEMBLY, FABRICATION SYSTEM THEREWITH, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17837910. SEMICONDUCTOR PROCESS CHAMBER WITH IMPROVED REFLECTOR simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17839235. TAB ARRANGEMENT FOR RETAINING SUPPORT ELEMENTS OF SUBSTRATE SUPPORT simplified abstract (Applied Materials, Inc.)
- 17946947. BACKSIDE DEPOSITION FOR WAFER BOW MANAGEMENT simplified abstract (Applied Materials, Inc.)
- 17954960. SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17957610. STACKING TOOL FIXTURE FOR FORCED FLOW CHEMICAL VAPOR INFILTRATION simplified abstract (Raytheon Technologies Corporation)
- 17961214. LOAD LOCK CHAMBERS AND RELATED METHODS AND STRUCTURES FOR BATCH COOLING OR HEATING simplified abstract (Applied Materials, Inc.)
- 17971205. IMPEDANCE CONTROL OF LOCAL AREAS OF A SUBSTRATE DURING PLASMA DEPOSITION THEREON IN A LARGE PECVD CHAMBER simplified abstract (Applied Materials, Inc.)
- 18100326. ADJUSTABLE CROSS-FLOW PROCESS CHAMBER LID simplified abstract (Applied Materials, Inc.)
- 18122574. APPARATUS AND METHODS FOR CONTROLLING SUBSTRATE TEMPERATURE DURING PROCESSING simplified abstract (Applied Materials, Inc.)
- 18125435. SUBSTRATE PROCESSING TUBE, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18132861. SYSTEMS, APPARATUS, AND METHODS FOR MONITORING PLATE TEMPERATURE FOR SEMICONDUCTOR MANUFACTURING simplified abstract (Applied Materials, Inc.)
- 18136070. EDGE RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18158379. BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS simplified abstract (Applied Materials, Inc.)
- 18179503. Ceramic Pedestal Shaft with Heated/Cooled Gas Tube simplified abstract (Tokyo Electron Limited)
- 18181077. SEMICONDUCTOR CHAMBER COMPONENTS WITH ADVANCED COATING TECHNIQUES simplified abstract (Applied Materials, Inc.)
- 18224312. DEPOSITION APPARATUS simplified abstract (Samsung Display Co., Ltd.)
- 18228191. SUBSTRATE DEGASSING METHOD AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18278276. TRIPOLAR ELECTRODE ARRANGEMENT FOR ELECTROSTATIC CHUCKS simplified abstract (Lam Research Corporation)
- 18382421. LIFT PINS INCLUDING OPENING, AND RELATED COMPONENTS AND CHAMBER KITS, FOR PROCESSING CHAMBERS (Applied Materials, Inc.)
- 18395006. PROCESS CHAMBER VOLUME ADJUSTMENT simplified abstract (ASM IP Holding B.V.)
- 18397372. SHAFT MEMBERS, PROCESS KITS AND SEMICONDUCTOR PROCESSING SYSTEMS HAVING SHAFT MEMBERS, AND METHODS OF MAKING SEMICONDUCTOR PROCESSING SYSTEMS simplified abstract (ASM IP Holding B.V.)
- 18398995. METHOD, SYSTEM AND APPARATUS FOR FORMING EPITAXIAL TEMPLATE LAYER simplified abstract (ASM IP Holding B.V.)
- 18423636. Dynamic Phased Array Plasma Source For Complete Plasma Coverage Of A Moving Substrate simplified abstract (Applied Materials, Inc.)
- 18432699. MIST CVD FILM FORMATION DEVICE AND FILM FORMATION METHOD simplified abstract (Murata Manufacturing Co., Ltd.)
- 18434982. CYCLICAL DEPOSITION METHODS AND STRUCTURES FORMED USING THE METHODS simplified abstract (ASM IP Holding B.V.)
- 18460759. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18482560. ARC REDUCTION AND RF CONTROL FOR ELECTROSTATIC CHUCKS IN SEMICONDUCTOR PROCESSING (Applied Materials, Inc.)
- 18483965. COMPACT DYNAMIC LEVELING LIFT MECHANISM (Applied Materials, Inc.)
- 18484767. GAS FLOW IMPROVEMENT FOR PROCESS CHAMBER (Applied Materials, Inc.)
- 18493419. MULTIPLE INPUT POST MIX SHOWERHEAD (Tokyo Electron Limited)
- 18504007. WAFER CHUCK, METHOD FOR PRODUCING THE SAME, AND EXPOSURE APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18512923. METHOD AND SYSTEM FOR PROCESSING SUBSTRATES simplified abstract (Samsung Electronics Co., Ltd.)
- 18517387. SEMICONDUCTOR PROCESSING TOOL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18523394. SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION simplified abstract (Applied Materials, Inc.)
- 18536789. FILM FORMING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18536813. DEPOSITION APPARATUS AND PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18541164. SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18544315. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Samsung Display Co., LTD.)
- 18546140. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18555432. GAS SUPPLY SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND OPERATION METHOD FOR GAS SUPPLY SYSTEM simplified abstract (Tokyo Electron Limited)
- 18581154. SYSTEM AND METHOD FOR BACKSIDE DEPOSITION OF A SUBSTRATE simplified abstract (Tokyo Electron Limited)
- 18583059. DEPOSITION APPARATUS AND DEPOSITION METHOD simplified abstract (Tokyo Electron Limited)
- 18591336. SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18600219. ELECTROSTATIC CHUCK WITH MULTIPLE RADIO FREQUENCY MESHES TO CONTROL PLASMA UNIFORMITY simplified abstract (Applied Materials, Inc.)
- 18602099. CHAMBER ARCHITECTURE FOR EPITAXIAL DEPOSITION AND ADVANCED EPITAXIAL FILM APPLICATIONS simplified abstract (Applied Materials, Inc.)
- 18609067. SUBSTRATE SUPPORT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18609379. RUNOUT AND WOBBLE MEASUREMENT FIXTURES simplified abstract (ASM IP Holding B.V.)
- 18610619. METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18614912. GAS DELIVERY FOR TUNGSTEN-CONTAINING LAYER simplified abstract (Applied Materials, Inc.)
- 18615834. SYSTEMS AND METHODS FOR SUBSTRATE SUPPORT TEMPERATURE CONTROL simplified abstract (Applied Materials, Inc.)
- 18624655. PLASMA GENERATING DEVICE, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kokusai Electric Corporation)
- 18626047. SEMICONDUCTOR PROCESSING CHAMBERS AND METHODS FOR CLEANING THE SAME simplified abstract (Applied Materials, Inc.)
- 18638932. CERAMIC SUSCEPTOR (NGK INSULATORS, LTD.)
- 18667082. BACK SIDE DESIGN FOR FLAT SILICON CARBIDE SUSCEPTOR simplified abstract (Applied Materials, Inc.)
- 18670957. DEPOSITION APPARATUS AND METHOD OF DEPOSITING SUBSTRATE (SAMSUNG ELECTRONICS CO., LTD.)
- 18672023. SUBSTRATE SUPPORTING UNIT, APPARATUS FOR TREATING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (Samsung Electronics Co., Ltd.)
- 18725253. FILM FORMING APPARATUS AND FILM FORMING METHOD (SHIN-ETSU CHEMICAL CO., LTD.)
- 18732080. SYSTEM AND METHOD OF CLEANING PROCESS CHAMBER COMPONENTS simplified abstract (Applied Materials, Inc.)
- 18739563. SUBSTRATE SUPPORTING APPARATUS AND SUBSTRATE PROCESSING APPARATUS (ASM IP Holding B.V.)
- 18762910. SUBSTRATE PROCESSING APPARATUS (Samsung Electronics Co., Ltd.)
- 18789634. Electrostatic Chuck Having Multi Zone Gas Cooling (Applied Materials, Inc.)
- 18800442. SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD THEREOF (SEMES CO., LTD.)
- 18808746. MULTI-STAGE PUMPING LINER (Applied Materials, Inc.)
- 18814907. FORMING MESAS ON AN ELECTROSTATIC CHUCK (Applied Materials, Inc.)
- 18815687. ATOMIC LAYER DEPOSITION PART COATING CHAMBER (Applied Materials, Inc.)
- 18817577. ROTATING SUBSTRATE SUPPORT (ASM IP Holding B.V.)
- 18819298. CONNECTOR FOR SUBSTRATE SUPPORT WITH EMBEDDED TEMPERATURE SENSORS (LAM RESEARCH CORPORATION)
- 18884515. SUBSTRATE PROCESSING APPARATUS WITH FLOW CONTROL RING AND METHOD OF USING SAME (ASM IP Holding B.V.)
- 18891772. SUBSTRATE PROCESSING APPARATUS, PROCESSING VESSEL, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (Kokusai Electric Corporation)
- 18894881. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM (Kokusai Electric Corporation)
- 18896073. DEVICE AND METHOD FOR MANUFACTURING DISPLAY APPARATUS (Samsung Display Co., LTD.)
- 18904967. PROCESSING CHAMBER WITH RF RETURN PATH (Applied Materials, Inc.)
- 18907922. FILM-FORMING METHOD AND FILM-FORMING APPARATUS (Tokyo Electron Limited)
- 18907967. FILM-FORMING METHOD AND FILM-FORMING SYSTEM (Tokyo Electron Limited)
- 18925862. METHOD AND SYSTEM FOR DEPOSITING METAL PHOSPHIDE (ASM IP Holding B.V.)
- 18928314. METHODS AND APPARATUS FOR SUSCEPTOR LEVELING (ASM IP Holding B.V.)
- 18928355. METHODS AND APPARATUS FOR SUSCEPTOR LEVELING (ASM IP Holding B.V.)
- 18940580. SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18962380. SHOWERHEAD FOR PROCESS TOOL (Tokyo Electron Limited)
- 18988000. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING FILM THICKNESS DISTRIBUTION (Kokusai Electric Corporation)
2
- 20240011153. CONTINUOUS LINER FOR USE IN A PROCESSING CHAMBER simplified abstract (Applied Materials, Inc.)
- 20240011156. DEPOSITION APPARATUS simplified abstract (Samsung Display Co., Ltd.)
- 20240011159. PE-CVD APPARATUS AND METHOD simplified abstract (SPTS Technologies Limited)
- 20240018648. Purge Ring for Reduced Substrate Backside Deposition simplified abstract (APPLIED MATERIALS, INC.)
- 20240055289. VACUUM SEAL FOR ELECTROSTATIC CHUCK simplified abstract (Applied Materials, Inc.)
A
- Applied materials, inc. (20240247371). SEMICONDUCTOR PROCESSING CHAMBERS AND METHODS FOR CLEANING THE SAME simplified abstract
- Applied materials, inc. (20240247373). ADJUSTABLE CROSS-FLOW PROCESS CHAMBER LID simplified abstract
- Applied materials, inc. (20240249924). BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS simplified abstract
- Applied materials, inc. (20240254624). PLATE ASSEMBLIES, PROCESS KITS, AND PROCESSING CHAMBERS FOR SEMICONDUCTOR MANUFACTURING simplified abstract
- Applied materials, inc. (20240254627). INJECTORS, LINERS, PROCESS KITS, PROCESSING CHAMBERS, AND RELATED METHODS FOR GAS FLOW IN BATCH PROCESSING OF SEMICONDUCTOR MANUFACTURING simplified abstract
- Applied materials, inc. (20240258075). SUBSTRATE SUPPORT WITH REAL TIME FORCE AND FILM STRESS CONTROL simplified abstract
- Applied materials, inc. (20240258153). APPARATUS AND METHODS FOR SEMICONDUCTOR PROCESSING simplified abstract
- Applied materials, inc. (20240304423). SEMICONDUCTOR CHAMBER COMPONENTS WITH ADVANCED COATING TECHNIQUES simplified abstract
- Applied materials, inc. (20240304492). BACK SIDE DESIGN FOR FLAT SILICON CARBIDE SUSCEPTOR simplified abstract
- Applied materials, inc. (20240337537). SYSTEMS, APPARATUS, AND METHODS FOR MONITORING PLATE TEMPERATURE FOR SEMICONDUCTOR MANUFACTURING simplified abstract
- Applied materials, inc. (20240410078). IN-SITU FILM GROWTH RATE MONITORING APPARATUS, SYSTEMS, AND METHODS FOR SUBSTRATE PROCESSING
- Applied materials, inc. (20240420926). ATOMIC LAYER DEPOSITION PART COATING CHAMBER
- Applied materials, inc. (20240420986). FORMING MESAS ON AN ELECTROSTATIC CHUCK
- Applied materials, inc. (20250003076). MODULAR HEATING JACKET WITH REMOLDABLE INSULATOR
- Applied materials, inc. (20250006487). DYNAMIC MULTI ZONE FLOW CONTROL FOR A PROCESSING SYSTEM
- Applied materials, inc. (20250087471). MULTI-STAGE PUMPING LINER
- Applied materials, inc. (20250096703). Electrostatic Chuck Having Multi Zone Gas Cooling
- Applied materials, inc. (20250115999). COMPACT DYNAMIC LEVELING LIFT MECHANISM
- Applied materials, inc. (20250116001). ARC REDUCTION AND RF CONTROL FOR ELECTROSTATIC CHUCKS IN SEMICONDUCTOR PROCESSING
- Applied materials, inc. (20250118593). PROCESSING CHAMBER WITH RF RETURN PATH
- Applied materials, inc. (20250122624). GAS FLOW IMPROVEMENT FOR PROCESS CHAMBER
- Applied materials, inc. (20250132189). LIFT PINS INCLUDING OPENING, AND RELATED COMPONENTS AND CHAMBER KITS, FOR PROCESSING CHAMBERS
- Applied Materials, Inc. patent applications on April 10th, 2025
- Applied Materials, Inc. patent applications on April 17th, 2025
- Applied Materials, Inc. patent applications on April 24th, 2025
- Applied Materials, Inc. patent applications on August 1st, 2024
- Applied Materials, Inc. patent applications on December 12th, 2024
- Applied Materials, Inc. patent applications on December 19th, 2024
- Applied Materials, Inc. patent applications on February 13th, 2025
- Applied Materials, Inc. patent applications on February 6th, 2025
- Applied Materials, Inc. patent applications on January 2nd, 2025
- Applied Materials, Inc. patent applications on January 30th, 2025
- Applied Materials, Inc. patent applications on July 25th, 2024
- Applied Materials, Inc. patent applications on March 13th, 2025
- Applied Materials, Inc. patent applications on March 20th, 2025
- Applied Materials, Inc. patent applications on March 6th, 2025
- Applied Materials, Inc. patent applications on October 10th, 2024
- Applied Materials, Inc. patent applications on September 12th, 2024
B
- Betone Technology Shanghai, Inc. (20240327986). CHEMICAL VAPOR DEPOSITION DEVICE CAPABLE OF RECIPROCATING ROTATION AND LIFTING simplified abstract
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 15th, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 28th, 2024
K
S
- Samsung display co., ltd. (20240093369). DEPOSITION APPARATUS simplified abstract
- Samsung display co., ltd. (20240240320). PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract
- Samsung display co., ltd. (20250011921). DEVICE AND METHOD FOR MANUFACTURING DISPLAY APPARATUS
- SAMSUNG DISPLAY CO., LTD. patent applications on February 8th, 2024
- Samsung Display Co., LTD. patent applications on January 9th, 2025
- Samsung Display Co., LTD. patent applications on July 18th, 2024
- Samsung Display Co., Ltd. patent applications on March 21st, 2024
- Samsung electronics co., ltd. (20240093368). EDGE RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240218511). SUBSTRATE DEGASSING METHOD AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240282573). METHOD AND SYSTEM FOR PROCESSING SUBSTRATES simplified abstract
- Samsung electronics co., ltd. (20240318314). SUBSTRATE SUPPORT DEVICE simplified abstract
- Samsung electronics co., ltd. (20240355583). PLASMA PROCESSING APPARATUS simplified abstract
- Samsung electronics co., ltd. (20250075323). SUBSTRATE SUPPORT, THIN FILM PROCESSING DEVICE, AND THIN FILM DEPOSITION CONTROL METHOD USING THE SAME
- Samsung electronics co., ltd. (20250137131). DEPOSITION APPARATUS AND METHOD OF DEPOSITING SUBSTRATE
- Samsung electronics co., ltd. (20250146133). SUBSTRATE SUPPORTING UNIT, APPARATUS FOR TREATING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Samsung electronics co., ltd. (20250149311). SUBSTRATE PROCESSING APPARATUS
- Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on May 1st, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on May 1st, 2025
- Samsung Electronics Co., Ltd. patent applications on May 8th, 2025
- Samsung Electronics Co., Ltd. patent applications on October 24th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- Seiko epson corporation (20250003063). Particle Coating Apparatus And Method Of Coating Particle
- Seiko epson corporation (20250003064). Particle Coating Apparatus And Method Of Coating Particle
- SEIKO EPSON CORPORATION patent applications on January 2nd, 2025
T
- Taiwan semiconductor manufacturing co., ltd. (20240222097). METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240203770). ROUNDED VERTICAL WAFER VESSEL RODS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258123). GAS FLOW ACCELERATOR TO PREVENT BUILDUP OF PROCESSING BYPRODUCT IN A MAIN PUMPING LINE OF A SEMICONDUCTOR PROCESSING TOOL
- Taiwan semiconductor manufacturing company, ltd. (20240258123). GAS FLOW ACCELERATOR TO PREVENT BUILDUP OF PROCESSING BYPRODUCT IN A MAIN PUMPING LINE OF A SEMICONDUCTOR PROCESSING TOOL simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240376600). METHODS OF SUBSTRATE PROCESSING AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240376605). SYSTEM AND METHOD FOR DYNAMICALLY ADJUSTING THIN-FILM DEPOSITION PARAMETERS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379400). WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPERATURE UNIFORMITY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250069944). SCREWLESS SEMICONDUCTOR PROCESSING CHAMBERS
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 27th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 20th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Tokyo electron limited (20240295027). SUBSTRATE PROCESSING APPARATUS simplified abstract
- Tokyo electron limited (20250129472). FILM-FORMING METHOD AND FILM-FORMING APPARATUS
- Tokyo electron limited (20250129475). MULTIPLE INPUT POST MIX SHOWERHEAD
- Tokyo electron limited (20250129479). FILM-FORMING METHOD AND FILM-FORMING SYSTEM
- Tokyo Electron Limited patent applications on April 24th, 2025
- Tokyo Electron Limited patent applications on February 6th, 2025
- Tokyo Electron Limited patent applications on March 6th, 2025
- Tokyo Electron Limited patent applications on September 5th, 2024
U
- US Patent Application 17871455. PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY simplified abstract
- US Patent Application 17871505. PROCESS KITS AND RELATED METHODS FOR PROCESSING CHAMBERS TO FACILITATE DEPOSITION PROCESS ADJUSTABILITY simplified abstract
- US Patent Application 18188929. PRE-TREATMENT APPARATUS simplified abstract
- US Patent Application 18324192. MANUFACTURING METHOD OF DISPLAY DEVICE AND CVD DEVICE simplified abstract
- US Patent Application 18324469. SUBSTRATE PROCESSING APPARATUS simplified abstract