Samsung Electronics Co., Ltd. patent applications on May 1st, 2025
Patent Applications by Samsung Electronics Co., Ltd. on May 1st, 2025
Samsung Electronics Co., Ltd.: 222 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (19), H10B12/00 (13), H01L25/065 (13), H01L23/31 (12), H01L29/423 (12) H01L25/0657 (3), H01L23/49838 (3), H01M10/0562 (3), H10B12/30 (3), H10B43/27 (3)
With keywords such as: device, layer, including, based, semiconductor, surface, configured, direction, substrate, and electronic in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Keehwan KA of Suwon-si KR for samsung electronics co., ltd., Mindo ROH of Suwon-si KR for samsung electronics co., ltd., Hyeongi JEON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): A47J36/32, G06V10/764, G06V20/68
CPC Code(s): A47J36/32
Abstract: a cooking apparatus and a method of controlling same. the cooking apparatus includes a thermal imaging camera to measure a temperature of food, a protective window, between the thermal imaging camera and the food, to protect the thermal imaging camera, and a processor to obtain a thermal image through the thermal imaging camera, divide the thermal image into a cooking food area including the food, a first inner wall area covered by the protective window, and a second inner wall area not covered by the protective window other than the cooking food area, obtain a correction parameter to correct influence by the protective window on measurement obtained through the thermal imaging camera based on information of the first inner wall area and the second inner wall area, and correct the temperature of the food measured by the thermal imaging camera through the cooking food area based on the correction parameter.
Inventor(s): Jeonghee CHO of Suwon-si KR for samsung electronics co., ltd., Seehyun KIM of Suwon-si KR for samsung electronics co., ltd., Hyunkoo KANG of Suwon-si KR for samsung electronics co., ltd., Juhyuk KIM of Suwon-si KR for samsung electronics co., ltd., Sanghyuk PARK of Suwon-si KR for samsung electronics co., ltd., Seongu LEE of Suwon-si KR for samsung electronics co., ltd., Yeongju LEE of Suwon-si KR for samsung electronics co., ltd., Sanghwa CHOI of Suwon-si KR for samsung electronics co., ltd., Jiwon CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): A47L9/28, A47L9/04, A47L9/24
CPC Code(s): A47L9/2821
Abstract: a vacuum cleaner including a cleaner body and a brush device connected to the cleaner body. the cleaner body may be configured to perform self-diagnosis on each element of the vacuum cleaner by comparing a flow path pressure value of the vacuum cleaner which is detected by using a pressure sensor mounted to a portion of a suction duct and data related to a load of a brush device with reference values stored in a memory, and to output a result of the self-diagnosis.
Inventor(s): Heeseung CHOI of Suwon-si KR for samsung electronics co., ltd., Jinsoo JEONG of Suwon-si KR for samsung electronics co., ltd., Masato SUZUKI of Tokyo JP for samsung electronics co., ltd., Youngdae KO of Suwon-si KR for samsung electronics co., ltd., Daesoo KIM of Suwon-si KR for samsung electronics co., ltd., Jinho KIM of Suwon-si KR for samsung electronics co., ltd., Hyungmin SON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): A47L11/40
CPC Code(s): A47L11/4091
Abstract: a cleaning system includes a cleaning robot including first and second driving wheels, a first coupling portion, a second coupling portion, a third coupling portion, and a fourth coupling portion, and a first processor configured to control a driving of the first and second driving wheels, and a maintenance station including a housing in which a storage space is provided, a lifting plate including a first fixing projection, a second fixing projection, a third fixing projection, and a fourth fixing projection, a door configured to open or close the storage space of the housing, and a second processor configured to control a driving of the lifting plate. the first fixing projection, the second fixing projection, the third fixing projection, and the fourth fixing projection are coupled to the first coupling portion, the second coupling portion, the third coupling portion, and the fourth coupling portions, respectively.
Inventor(s): Mijeong KIM of Suwon-si KR for samsung electronics co., ltd., Kiwan LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): A61H3/00, B25J9/00, G01S17/08, G01S17/88
CPC Code(s): A61H3/00
Abstract: a wearable device including a distance sensor and a control method of the wearable device are provided. the control method of the wearable device may include measuring a signal related to a first distance from the wearable device to a first ground point using the first distance sensor, measuring a second distance from the wearable device to a second ground point using the second distance sensor, determining a first measurement distance from the wearable device to the first ground point based on a signal measured by the first distance sensor, determining a second measurement distance from the wearable device to the second ground point based on a signal measured by the second distance sensor, estimating a terrain type of a ground on which a user is located, based on the determined first measurement distance and the determined second measurement distance, and controlling at least one driving module based on the estimated terrain type.
Inventor(s): Gunjan GUPTA of Noida IN for samsung electronics co., ltd., Himanshu DIDDEN of Noida IN for samsung electronics co., ltd., Akshay BINDLISH of Noida IN for samsung electronics co., ltd., Anil KUMAR of Noida IN for samsung electronics co., ltd., Anand Kumar ASATI of Noida IN for samsung electronics co., ltd.
IPC Code(s): A63B24/00, A63B23/00, A63B71/06
CPC Code(s): A63B24/0006
Abstract: a method for tracking and measuring body flexibility and balance of a user during physical activity is provided. the method includes capturing sensor data from a plurality of wearable devices for tracking and determining body posture, analyzing the captured sensor data to determine a plurality of parameters including information related to body posture and physical metrics including balance and flexibility, and displaying a balance score, a flexibility score, and transition over time based on the analysis.
20250135387. VENTILATION APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jongwook JOO of Suwon-si KR for samsung electronics co., ltd., Youngchul KO of Suwon-si KR for samsung electronics co., ltd., Kyunghoon KIM of Suwon-si KR for samsung electronics co., ltd., Donghyo KIM of Suwon-si KR for samsung electronics co., ltd., Myungju SHIN of Suwon-si KR for samsung electronics co., ltd., Eomji JANG of Suwon-si KR for samsung electronics co., ltd., Jaehyoung SIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): B01D46/00, A61L2/10, B01D46/42, B01D46/52, F24F8/108, F24F12/00
CPC Code(s): B01D46/0028
Abstract: a ventilation apparatus is provided. the ventilation apparatus includes a housing, an inlet formed on one side of the housing so outside air is introduced into the housing, an outlet formed on another side of the housing so the air introduced into the housing through the inlet is discharged indoors, a total heat exchanger arranged between the inlet and the outlet, and including an intake inlet end into which air introduced through the inlet and flowing toward the outlet is introduced, a filter arranged inside the housing and arranged between the inlet and the total heat exchanger, and a sterilizing lamp configured to sterilize the filter, wherein the filter includes a first side extending in a vertical direction and a second side extending in a direction perpendicular to the first side, and wherein the sterilizing lamp is arranged between one end of the filter and the intake inlet end.
20250135448. CATALYST SCRUBBER APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinyoung Lee of Suwon-si KR for samsung electronics co., ltd., Hyunsik Kim of Suwon-si KR for samsung electronics co., ltd., Jeongmo Yang of Seoul KR for samsung electronics co., ltd., Kyeongtae Lim of Seoul KR for samsung electronics co., ltd., Taewon Seo of Seoul KR for samsung electronics co., ltd., Sunghyup Kim of Suwon-si KR for samsung electronics co., ltd., Sangyoon Soh of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): B01J38/12, B01D53/88
CPC Code(s): B01J38/12
Abstract: a catalyst scrubber apparatus includes a housing having an internal space; a catalyst carrier disposed in the internal space of the housing; and a plurality of nozzles installed in the housing and disposed above the catalyst carrier, wherein at least two of the plurality of nozzles are configured to receive and spray fluid therethrough, the at least two of the plurality of nozzles are shaped and dimensioned to diffuse the fluid sprayed into the internal space of the housing.
Inventor(s): Hyunchul KIM of Suwon-si KR for samsung electronics co., ltd., Ohchel KWON of Suwon-si KR for samsung electronics co., ltd., Daewoong CHOI of Suwon-si KR for samsung electronics co., ltd., Hyunmo KANG of Suwon-si KR for samsung electronics co., ltd., Jinhong PARK of Suwon-si KR for samsung electronics co., ltd., Wooseok CHOE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): B23Q3/08, B23Q3/06
CPC Code(s): B23Q3/084
Abstract: a spin chuck includes an upper plate having an upper surface and a lower surface, the upper plate including a groove and a support pin on the upper surface of the upper plate, wherein the support pin is configured to support a substrate; an anti-slip plate below the upper plate, the anti-slip plate having an upper surface and a lower surface, wherein the anti-slip plate includes a first protrusion protruding in a vertical direction from the upper surface of the anti-slip plate toward the upper plate; and a lower plate below the anti-slip plate, the lower plate including a chucking pin configured to fix the substrate, wherein the lower plate has an upper surface and a lower surface, wherein the first protrusion of the anti-slip plate is coupled to the groove of the upper plate.
Inventor(s): Youngtaek KIM of Suwon-si KR for samsung electronics co., ltd., Domin KIM of Suwon-si KR for samsung electronics co., ltd., Sungyong PARK of Suwon-si KR for samsung electronics co., ltd., Chansoo PARK of Suwon-si KR for samsung electronics co., ltd., Kyoungwhan OH of Suwon-si KR for samsung electronics co., ltd., Jaemin JUNG of Suwon-si KR for samsung electronics co., ltd., Hoseop CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): B24B37/27, B24B37/015
CPC Code(s): B24B37/27
Abstract: a polishing head may include a substrate carrier detachably secured to a driving shaft and to pressurize and rotate a substrate, the substrate carrier includes a flexible membrane, wherein the flexible membrane includes a main thin film having a first surface to be in contact with the substrate and a second surface opposite to the first surface and a plurality of vertical thin films extending from the main thin film in a vertical direction to define a plurality of pressurizing chambers that are divided along a radial direction about a central axis; a plurality of temperature elements disposed under the plurality of pressurizing chambers in the main thin film and configured to apply local heat to the substrate; and a plurality of pressure elements respectively disposed on the plurality of temperature elements in the main thin film and configured to apply local pressure to the main thin film.
20250135601. WAFER GRINDING METHOD_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Heeseok Nho of Suwon-si KR for samsung electronics co., ltd., Yeoiwon Seo of Suwon-si KR for samsung electronics co., ltd., Seonggi Jeon of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): B24B49/02
CPC Code(s): B24B49/02
Abstract: a wafer grinding method includes loading a wafer onto a first chuck, first lowering a spindle having a wheel from a first vertical position to a second vertical position, second lowering the spindle from the second vertical position to a third vertical position, grinding the wafer by the wheel, identifying the third vertical position of the spindle by determining whether amounts of change in an operation current of the spindle exceed a reference amount of change in current, calculating spindle feedback displacement, and applying the spindle feedback displacement to the second vertical position of the first chuck.
Inventor(s): Seong Sil JEONG of Suwon-si KR for samsung electronics co., ltd., Youn Gon Oh of Suwon-si KR for samsung electronics co., ltd., Sang Hyuk Park of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): B65G1/04
CPC Code(s): B65G1/0464
Abstract: a transport vehicle includes: a frame having an internal area; a driver on top of the frame, the driver being configured to travel along a rail; a support structure in the internal area, the support structure being configured to seat, thereon, a drone configured to transport an article; and a controller configured to control an operation of at least one of the driver and the support structure.
Inventor(s): Minhee LEE of Suwon-si KR for samsung electronics co., ltd., Sanghyun KANG of Suwon-si KR for samsung electronics co., ltd., Hyunsuk KWAK of Suwon-si KR for samsung electronics co., ltd., Jaemyung CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): B66F11/04, B66F17/00
CPC Code(s): B66F11/042
Abstract: a scissor lift includes: a fixed plate; a lifting plate above the fixed plate; a pair of scissor arms between the fixed plate and the lifting plate and having an x shape, the pair of scissor arms including a first scissor arm and a second scissor arm, each of the first scissor arm and the second scissor arm including a fixed end fixed to the fixed plate and a moving end configured to move linearly with respect to the fixed plate; a motor configured to move the moving end of the first scissor arm and the moving end of the second scissor arm; a load reduction device configured to reduce a load applied to the motor in a case where the lifting plate descends, wherein the load reduction device includes a plurality of elastic bodies on the moving end of the first scissor arm and connected in series.
20250136427. REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungeun PARK of Suwon-si KR for samsung electronics co., ltd., Junho SHIN of Suwon-si KR for samsung electronics co., ltd., Choongeun LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): B67D1/12, B67D1/00, F25D23/12
CPC Code(s): B67D1/124
Abstract: a refrigerator including a water supply device in the door, and including a control valve to control the supply of water by the water supply device, a water supplier that is movable up and down, and an operation lever extending downward from the water supply device; and a controller configured to, when the water supplier is pressed, control the control valve in a first mode to supply water to the water container, and, in response to the operation lever being manually operated while the water supplier is not pressed, control the control valve in a second mode differently than in the first mode to supply water to the water container.
Inventor(s): Jinhyeong PARK of Suwon-si KR for samsung electronics co., ltd., Eunkyung LEE of Hwaseong-si KR for samsung electronics co., ltd., Hankyum LEE of Suwon-si KR for samsung electronics co., ltd., Doorae KIM of Suwon-si KR for samsung electronics co., ltd., Minhyouk KIM of Suwon-si KR for samsung electronics co., ltd., Youngnam KIM of Suwon-si KR for samsung electronics co., ltd., Youngoh KIM of Suwon-si KR for samsung electronics co., ltd., Jonghwa KIM of Suwon-si KR for samsung electronics co., ltd., Seongho PARK of Hwaseong-si KR for samsung electronics co., ltd., Jeongseok PARK of Suwon-si KR for samsung electronics co., ltd., Yeongjune SONG of Hwaseong-si KR for samsung electronics co., ltd., Sanhui OH of Suwon-si KR for samsung electronics co., ltd., Jaemin OK of Hwaseong-si KR for samsung electronics co., ltd., Houk LEE of Hwaseong-si KR for samsung electronics co., ltd., Byonghee CHO of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): C08K11/00
CPC Code(s): C08K11/005
Abstract: a plastic composite material comprising coffee grounds is provided. the plastic composite material includes coffee grounds, wherein the particle size distribution of the coffee grounds has a particle size distribution of 94% by weight or more for coffee ground particles having a particle size greater than 250 �m and less than or equal to 850 �m, and wherein the plastic composite material has a colorimeter value of 4.4 or less.
Inventor(s): Jungmin PARK of Suwon-si KR for samsung electronics co., ltd., Haeryong KIM of Suwon-si KR for samsung electronics co., ltd., Boeun PARK of Suwon-si KR for samsung electronics co., ltd., Jeongil BANG of Suwon-si KR for samsung electronics co., ltd., Jooho LEE of Suwon-si KR for samsung electronics co., ltd., Hanjin LIM of Suwon-si KR for samsung electronics co., ltd., Hyungsuk JUNG of Suwon-si KR for samsung electronics co., ltd., Sumin HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C23C16/455, C23C16/40, C23C16/44, H01L27/06, H10B12/00
CPC Code(s): C23C16/45531
Abstract: a method of manufacturing a multi-component thin film includes providing a substrate into a process chamber, performing a first cycle, the first cycle including forming a first atomic layer including a first precursor on the substrate by using an atomic layer deposition process, performing a third cycle, the third cycle including injecting an additive onto the first atomic layer, and performing a second cycle, the second cycle including forming a second atomic layer including a second precursor on the first atomic layer and the additive by using an atomic layer deposition process, wherein a thermal decomposition temperature of the additive is lower than each of a thermal decomposition temperature of the first precursor and a thermal decomposition temperature of the second precursor.
Inventor(s): Minju LEE of Suwon-si KR for samsung electronics co., ltd., Daihong KIM of Suwon-si KR for samsung electronics co., ltd., Sangho RHA of Suwon-si KR for samsung electronics co., ltd., Juchan BANG of Suwon-si KR for samsung electronics co., ltd., Seungjae SIM of Suwon-si KR for samsung electronics co., ltd., Mingyu JEON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C23C16/458, C23C16/455, C23C16/56
CPC Code(s): C23C16/458
Abstract: a deposition apparatus includes: a chamber; a support unit within the chamber and including a chuck and a driving member, wherein a substrate is seated on the chuck, wherein the chuck has a first process position and a second process position, wherein the first process position is for processing the substrate in a first process, wherein the second process position is for processing the substrate in a second process, wherein the driving member moves the chuck between the first process position and the second process position; a showerhead supplying process gas toward the substrate, when the chuck is located in the first process position; a power supply unit supplying power to generate plasma between the chuck and the showerhead; and a first ultraviolet lamp disposed in the chamber and emitting ultraviolet rays toward the substrate, when the chuck is located in the second process position.
Inventor(s): Hunyong Park of Suwon-si KR for samsung electronics co., ltd., Yeontae Kim of Suwon-si KR for samsung electronics co., ltd., Janghwi Lee of Suwon-si KR for samsung electronics co., ltd., Sangwoo Bae of Suwon-si KR for samsung electronics co., ltd., Jungchul Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C23C16/48
CPC Code(s): C23C16/482
Abstract: a layer deposition apparatus includes a process chamber configured to provides a space for processing a substrate, the process chamber including an upper chamber and a lower chamber that define an inner space; a substrate support disposed within the process chamber and configured to support the substrate; a lamp heating portion disposed above the upper chamber outside the process chamber and including a plurality of light sources configured to irradiate light onto the substrate through the upper chamber; and an interference thin layer pattern disposed on an upper surface of the upper chamber and configured to reflect at least a portion of light from the plurality of light sources.
Inventor(s): Kanghyun LEE of Suwon-si KR for samsung electronics co., ltd., Dongpil SEO of Suwon-si KR for samsung electronics co., ltd., Youngjin CHO of Suwon-si KR for samsung electronics co., ltd., Sangyoung SO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): D06F33/42, D06F33/34, D06F33/43, D06F33/44, D06F34/30, D06F34/32, D06F37/06, D06F101/20, D06F103/38, D06F105/02, D06F105/08
CPC Code(s): D06F33/42
Abstract: this washing machine comprises: a housing; a tub within the housing; a detergent supplier connected to the tub; and a water supply guide to guide water to the detergent supplier. the detergent supplier comprises: a drawer to accommodate a detergent; a filter detachably installed to the drawer; and a drawer case to accommodate the drawer. the drawer case comprises a washing hole through which a part of water supplied to the drawer case is guided to the filter and which is to supply the water to the outer side of the filter opposite to the inner side of the filter where foreign matter is collected.
Inventor(s): Jaeyoung SHIN of Suwon-si KR for samsung electronics co., ltd., Gyusung NA of Suwon-si KR for samsung electronics co., ltd., Sungjong KIM of Suwon-si KR for samsung electronics co., ltd., Jongha PARK of Suwon-si KR for samsung electronics co., ltd., Haneal LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): D06F34/16, D06F23/02, D06F23/04, D06F33/40, D06F33/48, D06F34/04, D06F34/28, D06F37/22, D06F37/24, D06F103/24, D06F103/26, D06F103/46, D06F105/58, D06F105/62, G01C19/56
CPC Code(s): D06F34/16
Abstract: a washing machine may include a tub; a drum configured to be rotatable inside the tub; a weight balancer coupled to the tub; a vibration sensor provided in the tub; and a controller, wherein the controller is configured to compare an unbalance value of laundry in the drum with a reference value based on a driving current applied to a motor configured to rotate the drum, obtain an angular speed of at least one rotation axis of the tub based on an output value of the vibration sensor in response to the unbalance value of the laundry being less than the reference value, and determine whether the weight balancer is damaged based on the angular speed of the at least one rotation axis of the tub.
Inventor(s): Yoshinari SHIMADA of Yokohama-shi JP for samsung electronics co., ltd., Akihiro HOSOKAWA of Yokohama-shi JP for samsung electronics co., ltd., Yoshiyuki NISHIOKA of Yokohama-shi JP for samsung electronics co., ltd., Hogyo HOSHIYAMA of Yokohama-shi JP for samsung electronics co., ltd., Yuichi SUZUKI of Yokohama-shi JP for samsung electronics co., ltd., Yuki ONO of Yokohama-shi JP for samsung electronics co., ltd., Wonjae HAN of Suwon-si KR for samsung electronics co., ltd., Hyungjin CHOE of Suwon-si KR for samsung electronics co., ltd., Sejun LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): D06F37/24, D06F23/04, D06F37/26
CPC Code(s): D06F37/24
Abstract: a washing machine includes a washing tub, a dewatering tub arranged rotatably in the washing tub, a housing to accommodate the washing tub, a suspension to suspend the washing tub from the housing substantially in a vertical direction, and a damper to connect the washing tub to the housing. the damper includes a translational damper to apply a damping force in a direction of translation, and a first rotational damper and a second rotational damper respectively connected to opposite ends of the translational damper while securing a degree of freedom substantially in the vertical direction of the translational damper, and to respectively apply the damping force in a rotating direction. the first rotational damper is arranged on a lower portion of the housing to be rotatable about a first rotary axis substantially in the vertical direction. the second rotational damper is arranged on a bottom of the washing tub to be rotatable about a second rotary axis substantially in the vertical direction.
20250137189. WASHING MACHINE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hidekazu FUNAKOSHI of Yokohama-shi JP for samsung electronics co., ltd., Hiroshi KATSUMOTO of Yokohama-shi JP for samsung electronics co., ltd., Tetsuya HIKAMI of Yokohama-shi JP for samsung electronics co., ltd., Osamu KAZAMA of Yokohama-shi JP for samsung electronics co., ltd.
IPC Code(s): D06F37/30, D06F23/06, D06F105/48, H02P1/16
CPC Code(s): D06F37/304
Abstract: a washing machine including a rotary drum that is rotatable, and into which laundry is loadable; a motor configured to rotate the rotary drum; and a controller configured to perform startup control to initiate rotation of the rotary drum, the startup control including a first process for controlling the motor so that torque for rotating the rotary drum in a first rotation direction is applied to the rotary drum; and a second process for controlling the motor so that, after the first process is initiated, and when a rotational acceleration of the rotary drum is less than or equal to a first predefined threshold before a rotation velocity of the rotary drum reaches a first rotation velocity, torque for rotating the rotary drum in reverse is applied to the rotary drum.
20250137572. DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yoongoo HAN of Suwon-si KR for samsung electronics co., ltd., Kyungmin LEE of Suwon-si KR for samsung electronics co., ltd., Sejun CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F16M11/04, G09F9/30
CPC Code(s): F16M11/041
Abstract: a display apparatus including a rear chassis; and a board that is securable to the rear chassis; wherein the rear chassis includes an insertion rib forming an insertion space into which the board is slidably insertable, and a fixing protrusion, and the board includes an insertion portion on an edge of the board and slidably insertable into the insertion space, and a fixing groove, and the rear chassis and the board are configured so that, when the insertion portion of the board is slidably inserted into the insertion space of the rear chassis, the fixing protrusion is inserted into the fixing groove to secure the board to the rear chassis.
Inventor(s): Jaehyuk Lee of Suwon-si KR for samsung electronics co., ltd., Eunha Choi of Suwon-si KR for samsung electronics co., ltd., Jihye Kwon of Suwon-si KR for samsung electronics co., ltd., Joayoung Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F24C7/08, H05B6/68
CPC Code(s): F24C7/087
Abstract: a cooking appliance providing context of cooking food as an image and a method for controlling the same are provided. the cooking appliance may be configured to determine an internal temperature of a cooking thing based on at least one surface temperature sensed on a surface of the cooking thing by a non-contact temperature sensor, obtain a reference cross-sectional image corresponding to the determined internal temperature among reference cross-sectional images pre-registered for each cooking progress state of the cooking thing, as a virtual cross-sectional image for feeding back the cooking progress state, and output the same.
Inventor(s): Sangho YOO of Suwon-si KR for samsung electronics co., ltd., Kwangsik HAN of Suwon-si KR for samsung electronics co., ltd., Jongwon BAK of Suwon-si KR for samsung electronics co., ltd., Jejin LEE of Suwon-si KR for samsung electronics co., ltd., Byoungguk LIM of Suwon-si KR for samsung electronics co., ltd., Dongil JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F24F11/43, F25B41/31, F25B47/02, F25B49/02
CPC Code(s): F24F11/43
Abstract: an air conditioner is provided. the air conditioner includes an indoor unit including an expansion valve and an indoor heat exchanger, a compressor configured to supply a refrigerant to the indoor unit, a compressor inlet pressure sensor configured to detect a compressor inlet pressure corresponding to a pressure of the refrigerant flowing into the compressor from an accumulator, memory storing one or more computer programs, and one or more processors communicatively coupled to the compressor inlet pressure sensor and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the air conditioner to adjust an opening degree of the expansion valve of the indoor unit based on the compressor inlet pressure during a defrosting operation.
Inventor(s): Dongsu HA of Suwon-si KR for samsung electronics co., ltd., Seungcheon YU of Suwon-si KR for samsung electronics co., ltd., Youngjin KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F24F11/86, F24F11/52, F24F11/84
CPC Code(s): F24F11/86
Abstract: provided are an air conditioner for performing a cooling operation according to a cooling capacity selected by a user, and a method of controlling the air conditioner. the air conditioner includes: a compressor, at least one memory storing one or more instructions, and at least one processor, comprising processing circuitry, individually and/or collectively, configured to execute the one or more instructions stored in the memory and to: receive an input for selecting one of a plurality of cooling capacities of the air conditioner, as a maximum cooling capacity capable of being output by the air conditioner, obtain a frequency corresponding to the maximum cooling capacity, of the compressor, in response to a determination to output the cooling capacity of the air conditioner as the maximum cooling capacity, based on a desired temperature set in the air conditioner and an indoor temperature, and, based on the obtained frequency, control the compressor.
20250137694. REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaehwan LEE of Suwon-si KR for samsung electronics co., ltd., Haejin SONG of Suwon-si KR for samsung electronics co., ltd., Heemoon JEONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F25B21/02, F25D11/02, F25D19/00, F25D23/06
CPC Code(s): F25B21/02
Abstract: a refrigerator may include a body including an insulating wall having a hole, a compartment in the body, and a thermoelectric module in the hole and configured to cool the compartment the thermoelectric module includes a thermoelectric element including: a heat-absorbing surface on a first side facing and configured to absorb heat from the compartment, a heat-generating surface on a second side, opposite the first side, and configured to receive heat from the heat-absorbing surface and discharge the received heat, a cooling sink in contact with the heat-absorbing surface and configured to exchange heat with the heat-absorbing surface, a heat sink in contact with the heat-generating surface and configured to exchange heat with the heat-generating surface, and a coupling member coupling the cooling sink and heat sink so that the cooling sink is pressed against the heat-absorbing surface and the heat sink is pressed against the heat-generating surface.
20250137716. REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sihoon LEE of Suwon-si KR for samsung electronics co., ltd., Jinhong YU of Suwon-si KR for samsung electronics co., ltd., Myoungjin JANG of Suwon-si KR for samsung electronics co., ltd., Jisick HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F25D25/02, A47B88/477
CPC Code(s): F25D25/025
Abstract: a refrigerator including; an inner cabinet forming a storage compartments; a fixed rail on an inner wall of the inner cabinet; a movable rail that is slidable along the fixed rail between a first rail position, at which the movable rail is inserted, and a second rail position, at which the movable rail is withdrawn; and a sliding case that is slidable along the movable rail between a first case position, at which the sliding case is inserted with respect to the movable rail, and a second rail position, at which the sliding case is withdrawn from the first case position with respect to the movable rail. the movable rail is configured to be locked to the fixed rail at the first rail position, and to be released from the fixed rail in response to the movable rail moving from the first rail position to the second rail position.
Inventor(s): Hyeonseong KIM of Suwon-si KR for samsung electronics co., ltd., Minkyung HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G01C21/16, G01J1/42, G06F3/01, G06T7/70
CPC Code(s): G01C21/1652
Abstract: an electronic device is provided. the electronic device includes a plurality of distance sensors, an inertial sensor, a camera, a display, memory storing one or more computer programs, and a processor operatively connected to the plurality of distance sensors, the inertial sensor, the camera module, the display module, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by processor, cause the electronic device to: identify, using the inertial sensor, whether a user wearing the electronic device on their head is walking, detect, in response to the user walking, a head rotation amount of the user using the inertial sensor, obtain a plurality of images through the camera on the basis of satisfying a head rotation condition based on the head rotation amount, measure an angle between a movement direction of the user and a gaze direction of the user on the basis of the plurality of images that are obtained, and activate among the plurality of distance sensors, at least one first distance sensor corresponding to the movement direction, when the measured angle exceeds a threshold.
Inventor(s): Isak CHOI of Suwon-si KR for samsung electronics co., ltd., Dongnam BYUN of Suwon-si KR for samsung electronics co., ltd., Jinyoung HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G01C21/00, G06T7/521, G06T7/73, G06T11/00, G06V20/58, G06V20/70
CPC Code(s): G01C21/3811
Abstract: a method of generating a spatial map includes obtaining a captured image of a target area in a space, obtaining light detection and ranging (lidar) scan data by scanning a depth of the target area with respect to a first height, performing object detection on the captured image, and, according to the performed object detection, generating a spatial map of the target area, based on all of the lidar scan data and the captured image.
Inventor(s): Insang SONG of Suwon-si KR for samsung electronics co., ltd., Kihyun KWON of Suwon-si KR for samsung electronics co., ltd., Gunwoo RYU of Suwon-si KR for samsung electronics co., ltd., Jaehyun BYUN of Suwon-si KR for samsung electronics co., ltd., Kyoungsoo SON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G01R1/04, G01R31/28
CPC Code(s): G01R1/0408
Abstract: provided is a test module for testing the performance of an image sensor, the test module including a test board having an area greater than an area of the image sensor and configured to be coupled to the image sensor, and a connector electrically connected to the image sensor and configured to transmit an electrical signal received from the image sensor to a test socket, wherein the test board includes a dummy region of which an outer perimeter corresponds to a perimeter of the test board and configured to be electrically cut off from the image sensor, and a cut-off region formed corresponding to an inner perimeter of the dummy region, located between the dummy region and the image sensor, and configured to electrically cut off the dummy region from the image sensor.
Inventor(s): Seongkwan Lee of Suwon-si KR for samsung electronics co., ltd., Minho Kang of Suwon-si KR for samsung electronics co., ltd., Jongpill Park of Suwon-si KR for samsung electronics co., ltd., Cheolmin Park of Suwon-si KR for samsung electronics co., ltd., Jaemoo Choi of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G01R31/317, G01R1/073
CPC Code(s): G01R31/31721
Abstract: a probe card includes a plurality of power lines that are electrically connected to the plurality of duts, a plurality of ground lines that are electrically connected to the plurality of duts and to each other, and a plurality of power compensation circuits that are electrically connected to respective ones of the plurality of power lines and respective ones of the plurality of ground lines, where the plurality of power compensation circuits are configured to generate and provide a plurality of compensated power supply voltages to the respective ones of the plurality of power lines, and where the plurality of compensated power supply voltages are configured to inhibit a variation of a ground voltage of the respective ones of the plurality of ground lines.
Inventor(s): Ju Wan LIM of Suwon-si KR for samsung electronics co., ltd., Daeryong JUNG of Seoul KR for samsung electronics co., ltd., Jinho KIM of Yongin-si KR for samsung electronics co., ltd., Young Hun SUNG of Hwaseong-si KR for samsung electronics co., ltd., Duk Jin OH of Seoul KR for samsung electronics co., ltd., Myeongjae LEE of Seoul KR for samsung electronics co., ltd.
IPC Code(s): G01R31/367, G01R31/3828, H02J7/00
CPC Code(s): G01R31/367
Abstract: to generate a charging path for a battery, a method includes generating simulation data for charging currents based on a battery model indicating an internal state of a battery, generating an initial look-up table (lut) for the charging currents and preset battery voltage limits based on the simulation data, the initial lut representing initial charging limit conditions of the battery for stages corresponding to the charging currents, generating a modified lut by adjusting at least one of the initial charging limit conditions of the initial lut, in response to the initial lut failing to satisfy a threshold, determining a final lut based on the modified lut, in response to the modified lut satisfying the threshold, and generating a charging path for the battery based on the final lut.
Inventor(s): CHISUNG BAE of Suwon-si KR for samsung electronics co., ltd., Nahm il KOO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G01R31/66, C12M1/34, H01L27/092
CPC Code(s): G01R31/66
Abstract: a verification device and a method of operating the verification device. the verification device includes: an electrode array including a plurality of electrodes configured to contact a culture medium for culturing a plurality of cells, and a plurality of analog front ends (afes) corresponding to the plurality of electrodes; and a control circuit including a plurality of first connection verifying circuits (cvcs) corresponding to the plurality of electrodes, wherein the control circuit is configured to verify at least one connection from among a plurality of first connections between the plurality of cells and the plurality of electrodes, and a plurality of second connections between the plurality of electrodes based on a result of verifying the plurality of first cvcs.
Inventor(s): Jong Ki LEE of San Jose CA US for samsung electronics co., ltd.
IPC Code(s): G01S19/34, G01S19/40, G01S19/49
CPC Code(s): G01S19/34
Abstract: methods and systems for tracking a geographic position, including: determining a duty cycle associated with a global navigation satellite system (gnss) based on a determined state of an electronic device, wherein the duty cycle comprises one or more first time periods in which a gnss module is active, and one or more second time periods in which the gnss module is inactive; obtaining gnss information indicating a first position of the electronic device during the one or more first time periods; obtaining sensor information indicating a second position of the electronic device during the one or more second time periods, the second position being relative to the first position; and generating estimated missing path information during the one or more second time periods based on the gnss information and the sensor information.
Inventor(s): Se Yoon KIM of Suwon-si KR for samsung electronics co., ltd., Byong Gwon SONG of Suwon-si KR for samsung electronics co., ltd., Du Hyun LEE of Suwon-si KR for samsung electronics co., ltd., Won Taek SEO of Suwon-si KR for samsung electronics co., ltd., Jang Woo YOU of Suwon-si KR for samsung electronics co., ltd., Yong Seop YOON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G02B1/00, H04N23/55
CPC Code(s): G02B1/002
Abstract: a metalens includes a substrate, and a metasurface provided on the substrate and including a plurality of metaatoms, where at least one of the plurality of metaatoms may include a plurality of layers.
Inventor(s): Jongkyun IM of Suwon-si KR for samsung electronics co., ltd., Seunghoon LEE of Suwon-si KR for samsung electronics co., ltd., Soonwoong YANG of Suwon-si KR for samsung electronics co., ltd., Sangchul JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G02B27/01, G06F1/16, G06F1/20, H05K7/20
CPC Code(s): G02B27/0176
Abstract: an electronic device according to an embodiment of the present disclosure may comprise: glass, a rim arranged to surround the circumference of the glass, and a temple hinge-coupled to the rim. the temple may include: a housing including a bendable region; a printed circuit board and a battery disposed in the housing to be spaced apart from the bendable region; a first heat transfer member comprising a thermally conductive material extending in the housing to have a plate shape; and a second heat transfer member comprising a thermally conductive material in contact with the first heat transfer member. the bendable region may include a material that is easy to bend, and the second heat transfer member may include a slit and may be disposed to be folded one or more times.
Inventor(s): JIN-KYUN LEE of Incheon KR for samsung electronics co., ltd., SUNG IL LEE of Suwon-si KR for samsung electronics co., ltd., KANGHO PARK of Suwon-si KR for samsung electronics co., ltd., YEJIN KU of Incheon KR for samsung electronics co., ltd., GAYOUNG KIM of Incheon KR for samsung electronics co., ltd., CHOONGHAN RYU of Suwon-si KR for samsung electronics co., ltd., CHANGYOUNG JEONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/004, G03F7/20, G03F7/32
CPC Code(s): G03F7/0043
Abstract: a resist composition includes an alkylated tin-oxo nanocluster and a compound having lewis basicity. the alkylated tin-oxo nanocluster includes a core structure including tin oxide, and an alkyl group of 1 to 20 carbon atoms, combined with the tin element of the core structure. the compound includes a polymer or an organic single molecule, having a functional group that functions as a lewis base, and the functional group is a functional group containing lone pair electrons.
Inventor(s): Dmitry ANDROSOV of Suwon-si KR for samsung electronics co., ltd., Cheol KANG of Suwon-si KR for samsung electronics co., ltd., Hana KIM of Suwon-si KR for samsung electronics co., ltd., Sungan DO of Hwaseong-si KR for samsung electronics co., ltd., Yonghoon MOON of Hwaseong-si KR for samsung electronics co., ltd., Hoyoon PARK of Suwon-si KR for samsung electronics co., ltd., Jaejun LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/039
CPC Code(s): G03F7/039
Abstract: provided are a photoreactive polymer compound including a first repeating unit represented by formula 1, a photoresist composition including the same, and a method of forming a pattern by using the photoresist composition:
Inventor(s): Dmitry ANDROSOV of Suwon-si KR for samsung electronics co., ltd., Cheol KANG of Suwon-si KR for samsung electronics co., ltd., Hana KIM of Suwon-si KR for samsung electronics co., ltd., Sungan DO of Hwaseong-si KR for samsung electronics co., ltd., Yonghoon MOON of Hwaseong-si KR for samsung electronics co., ltd., Hoyoon PARK of Suwon-si KR for samsung electronics co., ltd., Jaejun LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/039
CPC Code(s): G03F7/039
Abstract:
Inventor(s): Sungmin Nam of Suwon-si KR for samsung electronics co., ltd., Seongjeon Choi of Suwon-si KR for samsung electronics co., ltd., Seunghune Yang of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/00
CPC Code(s): G03F7/70125
Abstract: a method of configuring an extreme ultraviolet (euv) light source includes obtaining first information about a mask pattern, generating a top-hat illumination system for the mask pattern based on a fourier approximation, storing second information about aerial images of euv point light sources that correspond to pupil mirrors, selecting a combination of the euv point light sources according to established rules, and performing a simulation on an entire euv illumination system, based on the selected combination of the euv point light sources.
Inventor(s): Yeongchan CHO of Suwon-si KR for samsung electronics co., ltd., Minjae KIM of Suwon-si KR for samsung electronics co., ltd., Sungmin NAM of Suwon-si KR for samsung electronics co., ltd., Seunghune YANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/00
CPC Code(s): G03F7/70516
Abstract: provided are a method of configuring an optimized extreme ultraviolet (euv) illumination system, and an euv exposure method using the euv illumination system. the method of configuring the euv illumination system includes calculating an aerial image by performing an optical simulation with respect to each of euv point sources, summing up the aerial images based on euv mapping, searching for a combination of the euv point sources by using a fitness value with respect to the summed aerial image, and configuring the euv illumination system as a combination of the euv point sources, which has a maximum fitness value.
Inventor(s): YOONKI HWANG of Suwon-si KR for samsung electronics co., ltd., JAE-SEOK KANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/00, G03F1/48, G03F1/54, G03F1/74
CPC Code(s): G03F7/70741
Abstract: a method of manufacturing may include preparing a reticle, forming an exhaust hole in the reticle, exhausting a contamination material from the reticle through the exhaust hole, and forming a protection layer in the exhaust hole to fill the exhaust hole, after the exhausting of the contamination material. the reticle may include a main pattern region, a dummy pattern region outside the main pattern region, and a gray region between the main pattern region and the dummy pattern region. the forming the exhaust hole in the reticle may include forming the exhaust hole in the gray region. the repaired reticle may be used in a lithographic exposure process to pattern a layer of a semiconductor device.
Inventor(s): YOUNG HO HWANG of Suwon-si KR for samsung electronics co., ltd., JAE HONG LIM of Suwon-si KR for samsung electronics co., ltd., CHUL MIN CHO of Suwon-si KR for samsung electronics co., ltd., SANG HYUN LIM of Suwon-si KR for samsung electronics co., ltd., YOUNG KYUN IM of Suwon-si KR for samsung electronics co., ltd., SEOK HEO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/00, G03F7/20
CPC Code(s): G03F7/70875
Abstract: a substrate processing apparatus includes a process chamber having a space in which a substrate is disposed and processed in the process chamber, a supporter disposed in the process chamber and configured to support and rotate the substrate, a heater disposed in the process chamber and configured to heat a first surface of the substrate, where the heater includes one or more irradiation modules for generating light pulses and directing the light pulses to the first surface of the substrate, a controller configured to control an intensity of the light pulse generated by each of the one or more irradiation modules of the heater, and a fluid supplier configured to supply fluid to the first surface of the substrate.
Inventor(s): Kihun EOM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G09G3/00
CPC Code(s): G06F1/1618
Abstract: provided are a flexible electronic device and an operation method thereof. the electronic device may include a housing, a flexible display including a first portion and a second portion, a first sensor and a second sensor, a third sensor, at least one processor, and a memory. the processor may monitor whether or not the flexible display switches from a folded state to an unfolded state using the third sensor. the processor may at least partially activate the first sensor and the second sensor, based on the case where the flexible display switches from the folded state to the unfolded state. the processor may measure relative position and/or angle of the first portion and the second portion in the flexible display using the first sensor and the second sensor. in addition, various other embodiments may be provided.
Inventor(s): Yeonghun GU of Suwon-si KR for samsung electronics co., ltd., Keunpyo PARK of Suwon-si KR for samsung electronics co., ltd., Youngho PARK of Suwon-si KR for samsung electronics co., ltd., Jiwoo LEE of Suwon-si KR for samsung electronics co., ltd., Kio JUNG of Suwon-si KR for samsung electronics co., ltd., Ko CHOI of Suwon-si KR for samsung electronics co., ltd., Woojin CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F1/16, H05K7/14
CPC Code(s): G06F1/1641
Abstract: an example electronic device may include a first housing on which a first printed circuit board including a processor is disposed, a second housing on which a second printed circuit board including a display driver for a display is disposed, a hinge structure configured to physically connect the first housing and the second housing such that the first housing and the second housing are foldable/unfoldable, and a cable structure configured to electrically connect the first printed circuit board and the second printed circuit board via the hinge structure. the cable structure may include a first cable configured to transfer display signals and a second cable branched off from the first cable to be grounded to the hinge structure.
Inventor(s): Seunghyun HWANG of Suwon-si KR for samsung electronics co., ltd., Donghyun BYUN of Suwon-si KR for samsung electronics co., ltd., Sukjin YUN of Suwon-si KR for samsung electronics co., ltd., Uyhyeon JEONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F1/16, E05D3/12, E05D11/10, F16C11/04
CPC Code(s): G06F1/1681
Abstract: an arm structure of an electronic device is provided. the arm structure includes an arm body, a first cam disposed on one side of the arm body and including a first hole into which at least a portion of a rotating shaft providing a folding operation of the electronic device is inserted, a peak and a valley being formed around the first hole, a second cam arranged side-by-side on a same axis as the one side of the arm body, spaced apart from the first cam, and including a second hole into which at least a portion of the rotating shaft is inserted, a peak and a valley being formed around the second hole, and a connecting part disposed on another side of the arm body and fastened with a rotating part providing rotation of the electronic device.
Inventor(s): Kijoong KIM of Suwon-si KR for samsung electronics co., ltd., Yunseo KANG of Suwon-si KR for samsung electronics co., ltd., Hojin CHUN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F1/30, G06F1/26
CPC Code(s): G06F1/30
Abstract: an operating method of a storage device, may include: adjusting a value of preset electrical energy to be stored in the auxiliary power supply, based on information about first required energy according to process variability of a main system; adjusting a value of electrical energy to be stored in the auxiliary power supply or a value of second required energy, based on information about the second required energy for a temperature of the main system and a required performance of the main system, to obtain an adjusted value of the electrical energy or an adjusted value of the second required energy; and based on the adjusted value of the electrical energy or the adjusted value of the second required energy being greater than a value of available energy of the auxiliary power supply, outputting a signal indicating that the auxiliary power supply operates in a fail mode.
Inventor(s): Kichang KANG of Suwon-si KR for samsung electronics co., ltd., Pilgyu SANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/043, G06F3/041
CPC Code(s): G06F3/0436
Abstract: an electronic device is provided. the electronic device includes a housing including a wall configured to define an outer surface of the electronic device, a sensor component including a first sensor and a second sensor, memory storing one or more computer programs, and one or more processors communicatively coupled to the sensor component, and the memory, wherein the first sensor and the second sensor are disposed to be in contact with an inner surface of the wall, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to: transmit, via the first sensor, a first wave so that the first wave propagates toward the second sensor through the wall, transmit, via the second sensor, a second wave so that the second wave propagates toward the first sensor through the wall, receive, via the first sensor, the second wave transmitted from the second sensor and a first reflected wave corresponding to the first wave generated by a touch applied to an outer surface of the wall, receive, via the second sensor, the first wave transmitted from the first sensor and a second reflected wave corresponding to the second wave generated by a touch applied to the outer surface of the wall, and identify a touch position on the basis of the first reflected wave and the second reflected wave based on the touch applied to the outer surface of the wall.
Inventor(s): Jaesung PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/04842, G06F1/16, G06F21/30
CPC Code(s): G06F3/04842
Abstract: an electronic device and a control method thereof are disclosed. the method includes based on identifying that a wearable device has a control ui function, controlling at least one of the display or the speaker to provide a request for identifying whether the wearable device has control authority associated with at least one function of the electronic device; based on identifying that the wearable device has the control authority, identifying a first control ui of the wearable device corresponding to the at least one function of the electronic device; displaying a gui for the at least one function of the electronic device and a gui for the first control ui, and in response to receiving user interaction information input from the wearable device and associated with the first control ui, controlling the electronic device based on the user interaction information and the at least one function of the electronic device.
Inventor(s): Hongjae KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/04883, G06F3/041
CPC Code(s): G06F3/04883
Abstract: a display device includes a display including a touchscreen, and at least one processor configured to: identify letter areas corresponding to letters provided on the touchscreen; based on receiving a stroke input on the letter areas through the touchscreen, set the letter areas where the stroke input is received as areas of interest; identify a start area corresponding to a start point of the stroke input; identify a last area corresponding to an end point of the stroke input; generate a line input continuing from the start area to the second area; and control the display to display the generated line input on the touchscreen.
Inventor(s): Hyunsub SONG of Suwon-si KR for samsung electronics co., ltd., Hyeonho SONG of Suwon-si KR for samsung electronics co., ltd., Donghun LEE of Suwon-si KR for samsung electronics co., ltd., Wonseb JEONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/061
Abstract: disclosed is an operation method of a storage device which is connected to a compute express link (cxl) switch. the method includes receiving a first access request from a first host through the cxl switch, performing an operation corresponding to the first access request, detecting a change in first metadata managed by the first host, based on the first access request, and transmitting first update information corresponding to the change in the first metadata to a second host sharing the storage device through the cxl switch.
Inventor(s): Sang Hun JUN of Suwon-si KR for samsung electronics co., ltd., Sung Chul Hur of Suwon-si KR for samsung electronics co., ltd., Bumjun Kim of Suwon-si KR for samsung electronics co., ltd., Jungmoo Son of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0619
Abstract: a storage adapter includes a carrier and a storage device. the storage device stores data and includes a buffer memory including a volatile memory, a nonvolatile memory, a memory controller that controls the buffer memory and the nonvolatile memory, and a mode signal generating circuit that generates a mode signal, based on a connection state of the storage device and the carrier. the carrier removably receives the storage device, and based on a level of the mode signal, the memory controller selectively performs a data dump operation such that the data stored in the buffer memory are stored in the nonvolatile memory.
Inventor(s): Oscar P. PINTO of San Jose CA US for samsung electronics co., ltd., Ramdas P. KACHARE of Pleasanton CA US for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F9/54
CPC Code(s): G06F3/0644
Abstract: provided are systems, methods, and apparatuses for managing memory. the method can include: establishing a connection via an interface, between a host device and a storage device; and transferring data, via the interface, between first memory associated with the host device and second memory associated with the storage device by performing a data operation on the second memory by an application executed by the host, where the storage device includes a processing element that accelerates the data operation by performing at least one offload function on the data operation.
Inventor(s): Jesuk YEON of Suwon-si KR for samsung electronics co., ltd., In Hwan DOH of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0655
Abstract: an operating method of a storage device which includes a nonvolatile memory device and a controller controlling the nonvolatile memory device includes receiving, by the controller from a host device, a first logical address of a source range entry, a second logical address of a destination range entry, and a first copy command including a first flag that indicates a background copy is set, mapping, at the controller, a first physical address on the second logical address, mapping, at the controller, a second physical address on the second logical address and/or the first physical address, transmitting, by the controller to the host device, a first notification of a completion of the first copy command, and after the controller transmits the first notification, reading, at the nonvolatile memory device, first data stored at the first physical address and writing the first data at the second physical address.
Inventor(s): Dongil SEO of Suwon-si KR for samsung electronics co., ltd., Hokeun KWAK of Suwon-si KR for samsung electronics co., ltd., Yongkwan KIM of Suwon-si KR for samsung electronics co., ltd., Jaeheung PARK of Suwon-si KR for samsung electronics co., ltd., Dongok CHOI of Suwon-si KR for samsung electronics co., ltd., Sunhyoung PYO of Suwon-si KR for samsung electronics co., ltd., Min HEU of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G02B27/09
CPC Code(s): G06F3/14
Abstract: a display device includes a display configured to output a screen image along a first direction, and a lens assembly including at least three lenses arranged sequentially along an optical axis and configured to focus or guide the screen output from the display in a predetermined direction/predetermined position. the lens assembly may be configured to reflect the screen output from the display at least twice between a first lens disposed farthest from the display and an nlens disposed closest to the display. the display may be disposed to be movable in a direction crossing the first direction or the optical axis. the display device satisfies [conditional expression 1: 0.02<=md/dsp<=0.2] regarding the diagonal length dsp of the display and the distance md from the optical axis to the center of the display which is measured along a direction perpendicular to the optical axis.
Inventor(s): Kwanhee JEONG of Suwon-si KR for samsung electronics co., ltd., Sergei LONCHAKOV of Moscow RU for samsung electronics co., ltd., Ivan TITARENKO of Moscow RU for samsung electronics co., ltd., Hyoungjong KIM of Suwon-si KR for samsung electronics co., ltd., Chanbin LIM of Suwon-si KR for samsung electronics co., ltd., Ivan MAIDANSKII of Moscow RU for samsung electronics co., ltd., Stanislav MOLOGIN of Moscow RU for samsung electronics co., ltd., Andrei VISOCHAN of Moscow RU for samsung electronics co., ltd.
IPC Code(s): G06F8/41
CPC Code(s): G06F8/41
Abstract: a processor of an electronic device, according to an embodiment, may be configured to store, in a volatile memory of the electronic device, instructions received through a communication circuit of the electronic device and included in a package file stored in a non-volatile memory of the electronic device. the processor may be configured to execute, on the basis of the instructions stored in the volatile memory, a process in a second state different from a first state for displaying of a screen within a display. the processor may be configured to, in response to an input indicating execution of one process corresponding to the package file, change a state of the process in the second state to the first state and display, within the display, a screen corresponding to an application corresponding to the input.
Inventor(s): Somnath ROY of San Ramon CA US for samsung electronics co., ltd., Mayank SAXENA of Livermore CA US for samsung electronics co., ltd., Ronald LEE of Pleasanton CA US for samsung electronics co., ltd.
IPC Code(s): G06F9/4401
CPC Code(s): G06F9/4411
Abstract: a system and a method for managing services for devices are disclosed. an upstream interface set is configured to communicate with an application that requests a device service using a device. a downstream interface set is configured to include a device service functionality that provides the device service customized to the device. the device is integrated with the application. a processing element is configured to process communication requests between the upstream interface set and the downstream interface set.
Inventor(s): Bittu Kumar SINGH of Noida IN for samsung electronics co., ltd.
IPC Code(s): G06F9/50, G06F11/34
CPC Code(s): G06F9/5022
Abstract: a method and a system for reclaiming system resources in an electronic device are provided. the method includes identifying an initialization of an activity corresponding to a first application associated with the electronic device, determining whether a combination of the activity and the first application is defined in a resource pool database, upon determining that the combination of the activity and the first application is not defined in the resource pool database: monitoring resource consumption by the activity, and storing the combination of the activity and the first application with the monitored resource consumption in the resource pool database, and upon determining that the combination of the activity and the first application is defined in the resource pool database, reclaiming the system resources corresponding the combination of the activity and the first application.
Inventor(s): Haewook LEE of Suwon-si KR for samsung electronics co., ltd., Kwanhee JEONG of Suwon-si KR for samsung electronics co., ltd., Sekyeong HEO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F9/54, G06F3/04842
CPC Code(s): G06F9/546
Abstract: an electronic device according to an embodiment may comprise a display, a memory for storing instructions, and a processor. the electronic device may, on the basis of execution of a binder driver, store one or more messenger data sets for executing a function of a target process by using a source process, in a buffer area of the memory assigned to the target process. the electronic device may temporarily refrain from starting execution of the function of the target process by using the binder driver, in a first state in which a threshold quantity or more of the one or more messenger data sets are stored in the buffer area. the electronic device may control the display to display a visual object indicating information about the source process.
20250138940. NONVOLATILE MEMORY_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hwasuk Cho of Suwon-si KR for samsung electronics co., ltd., Seungwoo Yu of Suwon-si KR for samsung electronics co., ltd., Byungkwan Chun of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F11/10
CPC Code(s): G06F11/1016
Abstract: a nonvolatile memory device includes a plurality of latch groups, an address controller, an encoder, and a buffer. the address controller controls an input address and an output address to indicate one of the plurality of latch groups. the encoder receives sector data from a latch group corresponding to the output address among the plurality of latch groups and also compresses the received sector data. the buffer stores the compressed sector data. among the plurality of latch groups, the compressed sector data stored in the buffer is overwritten in a latch group corresponding to the input address.
Inventor(s): Hanju LEE of Suwon-si KR for samsung electronics co., ltd., Kyungryun KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F11/10, G06F21/79
CPC Code(s): G06F11/1016
Abstract: provided is a storage device including a plurality of non-volatile memory devices, a host interface device configured to communicate with an external host device through an interface channel, and at least one media interface device connected between the host interface device and the plurality of non-volatile memory devices, the at least one media interface being configured to control the plurality of non-volatile memory devices, wherein the at least one media interface device is further configured to perform an operation offloaded from the host interface device and perform serial communication with the host interface device.
Inventor(s): Kyungkeun Lee of Suwon-si KR for samsung electronics co., ltd., Bumjun Kim of Suwon-si KR for samsung electronics co., ltd., Seunghan Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F11/30, G06F21/60
CPC Code(s): G06F11/3034
Abstract: disclosed is a method of operating an electronic device which includes a host device and a storage device. the host device includes a processor and a baseboard management controller (bmc), the storage device includes a storage controller and a micro controller unit (mcu), and the bmc and the mcu support out-of-band communication. the method of operating the electronic device includes providing, by the bmc, a first request including information about environment data to the mcu through the out-of-band communication, and providing, by the mcu, a first response corresponding to the first request to the bmc through the out-of-band communication.
Inventor(s): Jungjeong Jo of Suwon-si KR for samsung electronics co., ltd., Geontaek Lee of Suwon-si KR for samsung electronics co., ltd., In-Su Kim of Suwon-si KR for samsung electronics co., ltd., Beomkyu Shin of Suwon-si KR for samsung electronics co., ltd., Jaeyong Jeong of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F12/02, G06F13/16
CPC Code(s): G06F12/0246
Abstract: a storage device configured to perform address mapping in a multi-domain manner includes a non-volatile memory device including a plurality of dies associated with a first domain or a second domain, and a storage controller configured to map a logical address of a write request to a first physical address mapped to the first domain. responsive to detecting concentration of a workload or resource corresponding to the write request in the first domain at a reference rate or more, the storage controller is configured to redirect the first physical address mapped to the first domain to a second physical address assigned to the second domain.
Inventor(s): Taegwang JO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/0246
Abstract: provided are a memory controller controlling power consumption, a memory system including the memory controller, and a method of operating the memory controller. the memory controller includes a write amplification factor (waf) calculator configured to calculate a waf value relating to a ratio of an amount of data written to the memory device to an amount of write data provided from the host, a performance controller configured to adjust performance of the write operation such that the performance of the write operation decreases, compared to a certain reference performance value, as the calculated waf value increases, the performance controller configured to thereby control the memory device to consume power within a power range, and a command processor configured to control execution of write commands for performing the write operation, based on control by the performance controller.
Inventor(s): Hyunju Yi of Suwon-si KR for samsung electronics co., ltd., Byungchul Ko of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F12/02, G06F12/1045, G06F13/16
CPC Code(s): G06F12/0292
Abstract: provided is an operating method of a storage controller that includes a buffer memory, an address manager, and a direct memory access (dma) engine and controls a non-volatile memory device. the operating method includes receiving, from an external host device, a read request including a host address, storing, by an address manager in response to the read request, mapping information about the host address and a command identifier corresponding to the read request in a translation table, setting, by the dma engine, a destination address of read data corresponding to the read request to a virtual address corresponding to the command identifier, and transmitting the read data to the virtual address, and translating, by the address manager based on the translation table, the destination address of the read data from the virtual address to the host address.
Inventor(s): Aditya Madhusudan DESHPANDE of Sunnyvale CA US for samsung electronics co., ltd., Douglas JOSEPH of Leander TX US for samsung electronics co., ltd., Arun RODRIGUES of Albuquerque NM US for samsung electronics co., ltd., Manisha GAJBE of Folsom CA US for samsung electronics co., ltd.
IPC Code(s): G06F12/0806
CPC Code(s): G06F12/0806
Abstract: in some aspects, the techniques described herein relate to a device including a storage media and a processor including a cache hierarchy including a first cache, a second cache, and a third cache, wherein the first cache and the third cache are organized in an inclusive cache hierarchy, and wherein the second cache is an exclusive cache to the inclusive cache hierarchy; and a cache directory, wherein the cache directory corresponds to the first cache, second cache, and third cache. in some aspects, the processor performs operations including searching the first cache for data, searching the second cache for the data, and searching the cache directory for the data. in some aspects, searching the cache directory includes determining that the data is located in the cache directory and determining a location of the data in the cache hierarchy based on an entry in the cache directory.
Inventor(s): Alan GARA of Palo Alto CA US for samsung electronics co., ltd., Douglas JOSEPH of Austin TX US for samsung electronics co., ltd., Arun RODRIGUES of Albuquerque NM US for samsung electronics co., ltd., Samantika SURY of Westford MA US for samsung electronics co., ltd., Rolf RIESEN of Forest Grove OR US for samsung electronics co., ltd., Robert WISNIEWSKI of Ossining NY US for samsung electronics co., ltd.
IPC Code(s): G06F12/0808, G06F11/07, G06F12/0864, G06F13/16
CPC Code(s): G06F12/0808
Abstract: systems and methods for computing with multiple nodes. in some embodiments, a method includes writing, during each of a sequence of time steps, by each node of a plurality of nodes, to a shared memory, the shared memory being shared by the nodes, wherein: each of the nodes includes a hardware-maintained coherence domain and is connected to the other nodes, and each of the nodes includes a respective portion of the shared memory.
Inventor(s): Alan GARA of Palo Alto CA US for samsung electronics co., ltd., Douglas JOSEPH of Austin TX US for samsung electronics co., ltd., Arun RODRIGUES of Albuquerque NM US for samsung electronics co., ltd., Samantika SURY of Westford MA US for samsung electronics co., ltd., Rolf RIESEN of Forest Grove OR US for samsung electronics co., ltd., Robert WISNIEWSKI of Ossining NY US for samsung electronics co., ltd.
IPC Code(s): G06F12/084, G06F12/0891
CPC Code(s): G06F12/084
Abstract: systems and methods for computing with multiple nodes. in some embodiments, a method includes: executing, by a first node of a plurality of nodes, a global load from a first address of a shared memory, the shared memory being shared by the nodes, the first address being an address within a shared memory section of a second node, the first address being cached in a first cache of the first node, the executing including: fetching a value stored in the shared memory, at the first address.
Inventor(s): Alan GARA of Palo Alto CA US for samsung electronics co., ltd., Douglas JOSEPH of Austin TX US for samsung electronics co., ltd., Arun RODRIGUES of Albuquerque NM US for samsung electronics co., ltd., Samantika SURY of Westford MA US for samsung electronics co., ltd., Rolf RIESEN of Forest Grove OR US for samsung electronics co., ltd., Robert WISNIEWSKI of Ossining NY US for samsung electronics co., ltd.
IPC Code(s): G06F12/0891, G06F12/084, G06F13/16
CPC Code(s): G06F12/0891
Abstract: systems and methods for computing with multiple nodes. in some embodiments, a method includes: executing, by a first node of a plurality of nodes, a global clean, the executing including: determining that a first cached value in a cache of the first node is a modified cached copy of data in a shared memory, the shared memory being shared by the nodes; and in response to determining that the first cached value is a modified cached copy of data in the shared memory, writing back the first cached value to the shared memory.
Inventor(s): Rajashekhar Hanumantappa PAYAGOND of San Diego CA US for samsung electronics co., ltd., Sambhab MOHAPATRA of San Jose CA US for samsung electronics co., ltd., Sukesh NAGARAJA of San Jose CA US for samsung electronics co., ltd., Pramod PEETHAMBARAN of San Jose CA US for samsung electronics co., ltd., Somnath ROY of San Ramon CA US for samsung electronics co., ltd., Mayank SAXENA of San Jose CA US for samsung electronics co., ltd.
IPC Code(s): G06F16/25
CPC Code(s): G06F16/254
Abstract: provided are systems, methods, and apparatuses for data analytics based on zero extract transform load (etl). in one or more examples, the systems, devices, and methods include generating a data request for at least a subset of data stored in a database; converting the data request to an object storage request; determining, based on parsing the object storage request, that the object storage request includes an extract transform load (etl) request; creating an etl command based on the object storage request; routing the etl command to a storage device based on the storage device comprising at least one etl function requested in the data request; and determining information from result data that is received from the storage device in response to routing the etl command to the storage device.
Inventor(s): Younho JEON of Suwon-si KR for samsung electronics co., ltd., Jae Hun JANG of Suwon-si KR for samsung electronics co., ltd., Suchang KIM of Suwon-si KR for samsung electronics co., ltd., Yeo-Reum PARK of Suwon-si KR for samsung electronics co., ltd., Hong Rak SON of Suwon-si KR for samsung electronics co., ltd., Jihoon LIM of Suwon-si KR for samsung electronics co., ltd., Se Jung KWON of Seongnam-si KR for samsung electronics co., ltd., Byeoung Wook KIM of Seongnam-si KR for samsung electronics co., ltd., Baeseong PARK of Seongnam-si KR for samsung electronics co., ltd., Dongsoo LEE of Seongnam-si KR for samsung electronics co., ltd.
IPC Code(s): G06F17/16
CPC Code(s): G06F17/16
Abstract: a matrix multiplier includes an input vector scaler generating a first quantization scaled input vector based on a first input vector, a plurality of common scale coefficients, and first-to-rth multiplication scale coefficients, a first data type converter generating a first fixed point quantization scaled input vector based on the first quantization scaled input vector, an element array comprising a first processing element generating a first fixed point output element based on the first fixed point quantization scaled input vector and first plurality of quantization sign bits, and a second processing element generating a second fixed point output element based on the first fixed point quantization scaled input vector and second plurality of quantization sign bits, and a second data type converter generating and outputting first and second output elements by converting data types of the first and second fixed point output elements.
Inventor(s): Younho JEON of Suwon-si KR for samsung electronics co., ltd., Hong Rak SON of Suwon-si KR for samsung electronics co., ltd., Wonsuk SONG of Suwon-si KR for samsung electronics co., ltd., Younggeon YOO of Suwon-si KR for samsung electronics co., ltd., JongYoon YOON of Suwon-si KR for samsung electronics co., ltd., Jihoon LIM of Suwon-si KR for samsung electronics co., ltd., Jae Hun JANG of Suwon-si KR for samsung electronics co., ltd., Sejung KWON of Seongnam-si KR for samsung electronics co., ltd., Byeoungwook KIM of Seongnam-si KR for samsung electronics co., ltd., Baeseong PARK of Seongnam-si KR for samsung electronics co., ltd., Dongsoo LEE of Seongnam-si KR for samsung electronics co., ltd.
IPC Code(s): G06F17/16, G06F5/01, H03M7/24
CPC Code(s): G06F17/16
Abstract: a matrix multiplier includes an input vector scaler configured to generate a first scaled input vector based on a first input vector and a plurality of quantization scale coefficients, a first data type converter configured to generate a first fixed-point scaled input vector based on the first scaled input vector, a processing element array including a first processing element configured to generate a first fixed-point output element based on the first fixed-point scaled input vector and first plurality of quantization sign values and a second processing element configured to generate a second fixed-point output element based on the first fixed-point scaled input vector and second plurality of quantization sign values, and a second data type converter configured to generate first and second output elements by converting data type of the first and second fixed-point output elements, and to output a first output vector including the first and second output elements.
Inventor(s): Hyungmin LEE of Suwon-si KR for samsung electronics co., ltd., Jihye PARK of Suwon-si KR for samsung electronics co., ltd., Soohyun SEO of Suwon-si KR for samsung electronics co., ltd., Joohoon EOM of Suwon-si KR for samsung electronics co., ltd., Heetak LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F21/32, G06F1/16, G06F21/44, G06V40/12, G06V40/13
CPC Code(s): G06F21/32
Abstract: an electronic device is provided. the electronic device includes a first housing, a second housing configured to slidably move relative to the first housing, a display, wherein a display area of the display, which is exposed to an outside of the electronic device, can be extended or reduced based on a sliding movement of the second housing, a fingerprint sensor configured to be moved by the sliding movement of the second housing, at least one processor including processing circuitry, and memory storing instructions. the instructions, when executed by the at least one processor individually or collectively, cause the electronic device to, based on a touch area touched by the user on the display corresponding to a first area corresponding to the fingerprint sensor in the display, perform an authentication using the fingerprint sensor, based on the touch area not corresponding to the first area, control the sliding movement of the second housing so that the first area is located at a position where the authentication can be performed, and perform the authentication, based on the sliding movement of the second housing.
Inventor(s): Hee-jun SONG of Seoul KR for samsung electronics co., ltd., Jung-wook KIM of Seoul KR for samsung electronics co., ltd.
IPC Code(s): G06F40/274, G06F40/163, G06F40/268, G06F40/279
CPC Code(s): G06F40/274
Abstract: a device and method for providing recommended words for at least one input character are provided. the method includes: receiving an input for inputting at least character and recommending one or more extended words including the at least one character by applying the input at least one character to an artificial intelligence (ai) model. an input that selects one of the recommended word is received, and whether a space is located next to the selected extended word is predicted. the selected extended word and the space on a character input window is displayed based on the predicting that the space is located next to the selected extended word, and at least one word to be located next to the space is recommended.
Inventor(s): Shanshan LV of Xi’an CN for samsung electronics co., ltd., Jonghoon YOON of Suwon-si KR for samsung electronics co., ltd., Byung In YOO of Suwon-si KR for samsung electronics co., ltd., Changyong SON of Suwon-si KR for samsung electronics co., ltd., Sung-Jae CHO of Suwon-si KR for samsung electronics co., ltd., Yunhao ZHANG of Xi’an CN for samsung electronics co., ltd., Zhenxin YANG of Xi’an CN for samsung electronics co., ltd., Miao ZHANG of Xi’an CN for samsung electronics co., ltd.
IPC Code(s): G06N3/0495
CPC Code(s): G06N3/0495
Abstract: a method performed by one or more processors includes: iteratively training layer-specific quantization levels and layer-specific quantization intervals of respective layers of a neural network of original weights by, for each training iteration, adjusting the quantization levels and quantization intervals to reduce a loss that is determined based on the original weights and is determined based on the original weights as quantized according to the quantization levels and quantization intervals at a current iteration of the training.
Inventor(s): Minsoo RHU of Daejeon KR for samsung electronics co., ltd., Youngeun KWON of Daejeon KR for samsung electronics co., ltd.
IPC Code(s): G06N3/08, G06F13/28, G06F15/173, G06N3/10
CPC Code(s): G06N3/08
Abstract: a computing system includes a host processor, a plurality of accelerators that communicate with the host processor based on a communication interface, and a plurality of memory nodes that are connected with the plurality of accelerators through an interconnection network. a first data link is established between a first accelerator of the plurality of accelerators and a first memory node of the plurality of memory nodes, and a second data link is established between the first accelerator and a second memory node of the plurality of memory nodes.
Inventor(s): Insoo KIM of Suwon-si KR for samsung electronics co., ltd., Geonseok SEO of Suwon-si KR for samsung electronics co., ltd., Jae Seok CHOI of Suwon-si KR for samsung electronics co., ltd., Hyong Euk LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T5/60, G06T5/20, G06T5/70, G06T7/215, G06T7/246, G06V10/762, G06V10/764, G06V10/77, G06V10/82, G06V20/70
CPC Code(s): G06T5/60
Abstract: a method and device for image enhancement based on blur segmentation are provided. the method of image enhancement includes: generating a blur segmentation map including indications of blur characteristics of respective pixels of a blur image, wherein the blur characteristics are in predetermined blur characteristic categories, and wherein the generating is performed by classifying the blur characteristic of each pixel of the blur image into one of the predetermined blur characteristic categories; converting the blur segmentation map into an image residual error corresponding to a blur component of the blur image; and generating the deblurred image based on the blur image and the image residual error.
Inventor(s): Younghoon JEONG of Suwon-si KR for samsung electronics co., ltd., Hyunseung LEE of Suwon-si KR for samsung electronics co., ltd., Donghyun KIM of Suwon-si KR for samsung electronics co., ltd., Kyuha CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06V10/764
CPC Code(s): G06T7/0002
Abstract: an image processing device is configured to store a cumulative quality of content comprising a plurality of input images based on a viewing frequency of the content, determine a model storing condition based on the viewing frequency and the cumulative quality, obtain a reference model corresponding to the model storing condition, store the reference model in a memory, and generate a target model corresponding to a first image by training the reference model stored in the memory by using training data corresponding to a quality of the first image.
Inventor(s): Minwoo Jeon of Suwon-si KR for samsung electronics co., ltd., Seunghwan Kim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G01N21/95
CPC Code(s): G06T7/0004
Abstract: a method of inspecting a semiconductor package includes acquiring an image of a surface of a semiconductor package, classifying a characteristic of a mold bleed present on the surface of the semiconductor package and captured in the image, identifying that the mold bleed is abnormal, and generating an alarm upon identifying that the mold bleed is abnormal.
Inventor(s): Hyunchul KIM of Suwon-si KR for samsung electronics co., ltd., Daewoong Choi of Suwon-si KR for samsung electronics co., ltd., Ohchel Kwon of Suwon-si KR for samsung electronics co., ltd., Hyunmo Kang of Suwon-si KR for samsung electronics co., ltd., Taecheon Kim of Suwon-si KR for samsung electronics co., ltd., Jinhong Park of Suwon-si KR for samsung electronics co., ltd., Wooseok Choe of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T7/00, H01L21/66
CPC Code(s): G06T7/001
Abstract: a wafer inspection method includes: obtaining an inspection image by capturing an image of a wafer and an identification tag; obtaining an inspection profile by quantifying the identification tag in the inspection image; and performing a surface inspection of the wafer based on the obtained inspection profile.
Inventor(s): Kyuhyun SHIM of Suwon-si KR for samsung electronics co., ltd., Seongeun KIM of Suwon-si KR for samsung electronics co., ltd., Seohyung LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06V10/774, G06T5/50, G06T5/77, G06V10/26, G06V10/764, G06V10/82
CPC Code(s): G06V10/774
Abstract: a method and apparatus with data augmentation are disclosed. the a method includes: based on information about objects included in target data, extracting a region for object synthesis from a point cloud of the target data; determining a target object based on location information about the extracted region; based on a point cloud of the target object and the point cloud of the target data, synthesizing the point cloud of the target object with the extracted region to generate a synthetic point cloud; and generating a synthetic image by synthesizing an image of the target object with an image of the target data based on the location information about the extracted region and the point cloud of the target object, wherein the synthetic point cloud and the synthetic image form an augmented training item.
Inventor(s): Kihun LEE of Suwon-si KR for samsung electronics co., ltd., Hongchul CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06V20/10, A61H1/02, A61H3/00, G01B7/30, G01C21/16, G01D5/14, G06T7/50, G06V10/25, G06V10/74, G06V40/10
CPC Code(s): G06V20/10
Abstract: a method of determining a state of a walking terrain is provided for a wearable walking assist and/or exercise device. the method may include generating a first image by capturing a scene using a distance sensor, identifying at least one of a left leg or a right leg of a user in the first image based on depth information of the first image, setting a first region of interest (roi) in the first image based on at least one of the left leg or the right leg, generating a first depth value pattern for the first roi based on depth information of the first roi, and determining a first state of a walking terrain corresponding to the first roi based on the first depth value pattern.
Inventor(s): Saket Gurukar of Mountain View CA US for samsung electronics co., ltd., Du Tran of Palo Alto CA US for samsung electronics co., ltd.
IPC Code(s): G06V20/40
CPC Code(s): G06V20/49
Abstract: a method includes obtaining a video and a relational space-time query and identifying at least one type of the relational space-time query. the at least one identified type of the relational space-time query represents at least one of: an activity type, an object type, or a time type. the method also includes learning correlations among activities, objects, and time in the video using, one or more cross-attention models. the method further includes obtaining one or more predictions generated using one or more outputs of the one or more cross-attention models based on the at least one identified type of the relational space-time query. in addition, the method includes generating a response to the relational space-time query based on the one or more predictions.
Inventor(s): Jungbae KIM of Suwon-si KR for samsung electronics co., ltd., Euntaik Lee of Suwon-si KR for samsung electronics co., ltd., Hyeonsu Lee of Suwon-si KR for samsung electronics co., ltd., Seungjin Kim of Suwon-si KR for samsung electronics co., ltd., Jinwoong Seok of Suwon-si KR for samsung electronics co., ltd., Mooyoung Kim of Suwon-si KR for samsung electronics co., ltd., Boyeon Na of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G09G3/00, G06T11/00
CPC Code(s): G09G3/035
Abstract: an electronic device for reducing a screen providing time and a control method thereof are provided. the electronic device includes a processor, a memory configured to store instructions, a display module configured to be driven in at least one state of a first state or a second state, wherein the second state is different from the first state, and a sensor module configured to detect the state of the display module, wherein, the instructions, when executed by the processor, cause the electronic device to determine whether the display module changes from the first state to the second state, in response to the state of the display module changing to the second state, generate image information obtained by converting an image displayed on the display module in the first state, store the generated image information in the at least one memory, and in response to the display module changing from the second state to the first state, output an image displayed on the display module based on the stored image information. the image information obtained by converting the image displayed on the display module may include information on an image converted from an image desired by a user.
Inventor(s): Sanghoon OH of Suwon-si KR for samsung electronics co., ltd., Youngkook KIM of Suwon-si KR for samsung electronics co., ltd., Jung HUR of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G09G3/32, G06F3/01
CPC Code(s): G09G3/32
Abstract: provided is a display device including a sensor, a display, and at least one processor configured to display a high dynamic range (hdr) image having a first brightness range on the display, and display an hdr image having a second brightness range on the display based on a user being identified by the sensor as being within a predetermined distance from the display while the hdr image having the first brightness range is displayed, wherein a maximum value of the second brightness range is less than a maximum value of the first brightness range.
20250140309. MEMORY DEVICE AND MEMORY SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeongjin Yoo of SUWON-SI KR for samsung electronics co., ltd., Wangsoo KIM of SUWON-SI KR for samsung electronics co., ltd., Junsub Yoon of SUWON-SI KR for samsung electronics co., ltd.
IPC Code(s): G11C11/4099, G11C5/10, G11C11/4093
CPC Code(s): G11C11/4099
Abstract: a memory device includes a reference voltage generator configured to generate a reference voltage, and a data input/output (i/o) buffer configured to receive a data signal having a first phase, generate a phase control signal having a second phase opposite to the first phase, and generate an output signal based on the data signal, the phase control signal, and the reference voltage.
Inventor(s): Kwangsoo Kim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G11C16/04, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/41, H10B43/10, H10B43/27, H10B43/35, H10B43/40, H10B80/00
CPC Code(s): G11C16/0483
Abstract: a semiconductor device includes a peripheral circuit structure and a cell structure stacked on the peripheral circuit structure, the cell structure including gate electrodes spaced apart from each other in a vertical direction, a channel structure arranged within a channel hole extending in the vertical direction by passing through the gate electrodes, including a channel layer and a back gate electrode spaced apart from the channel layer, and including a first end portion arranged adjacent to the peripheral circuit structure and a second end portion opposite to the first end portion, a common source layer connected to the channel layer at the second end portion of the channel structure, an upper insulating layer on the common source layer, and a back gate contact arranged within a first backside contact hole passing through the upper insulating layer and the common source layer and connected to the back gate electrode.
Inventor(s): Changyoung Lee of Suwon-si KR for samsung electronics co., ltd., Sanghoon Jung of Suwon-si KR for samsung electronics co., ltd., Changsik Yoo of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G11C29/12, H01L21/66, H01L23/00, H01L25/065, H01L25/18, H10B80/00
CPC Code(s): G11C29/1201
Abstract: an example memory device includes a first semiconductor layer and a second semiconductor layer. the first semiconductor layer includes a memory cell array, a first bonding pad, and a first test pad. the second semiconductor layer is disposed with respect to the first semiconductor layer in a vertical direction, and includes a peripheral circuit, a second bonding pad connected to the first bonding pad, a second test pad connected to the first test pad, and a test circuit. the test circuit checks a connection state of the first and second bonding pads. the test circuit receives a first test signal through the first and second test pads, generates a first test result signal representing a first misalignment between the first and second bonding pads based on the first test signal, and compensates an operation of the peripheral circuit based on the first test result signal.
Inventor(s): Jaewoong CHUNG of Suwon-si KR for samsung electronics co., ltd., Junghun LEE of Suwon-si KR for samsung electronics co., ltd., Seonkeun PARK of Suwon-si KR for samsung electronics co., ltd., Sunghoon LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01H36/00, H04M1/02
CPC Code(s): H01H36/004
Abstract: an electronic device according to an embodiment may comprise: a first housing, a second housing, a display, and/or a button structure including a button. the second housing may be configured to be movable in relation to the first housing. the display may include a rollable display configured to unroll or roll based on a movement of the second housing. the button structure may comprise a sensor module including at least one sensor, a first coil, a second coil, and/or a third coil. the first coil may be spaced apart from the sensor module within a first sidewall, and may be electrically connected to the sensor module. the second coil and the third coil may be disposed within a second sidewall of the second housing facing the first sidewall. in the second coil and the third coil, the second coil may be spaced apart from the third coil in a direction of the movement of the second housing.
20250140509. ION NEUTRALIZATION MODULE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongwan KIM of Suwon-si KR for samsung electronics co., ltd., Minsung KIM of Suwon-si KR for samsung electronics co., ltd., Youngseok SONG of Suwon-si KR for samsung electronics co., ltd., Jisoo IM of Suwon-si KR for samsung electronics co., ltd., Kanghee KIM of Suwon-si KR for samsung electronics co., ltd., Younseon WANG of Suwon-si KR for samsung electronics co., ltd., Junho IM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01J37/02, H01J37/305
CPC Code(s): H01J37/026
Abstract: an ion neutralization module comprising a reflector configured to neutralize an ion, a frame configured to support the reflector, and a conductive adhesive between the reflector and the frame to attach the reflector to the frame.
Inventor(s): Changheon LEE of Hwaseong-si KR for samsung electronics co., ltd., Sangki NAM of Seongnam-si KR for samsung electronics co., ltd., Taesun SHIN of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/3065, H01L21/67
CPC Code(s): H01J37/32834
Abstract: a substrate processing method includes inserting a substrate from an outside into a processing space, supplying a process gas from a gas supply unit to the processing space, producing plasma based on the process gas, performing an etching process for the substrate using ions included in the plasma, and discharging a processed gas produced in the etching process through a discharge part. the discharge part includes a first slit extending through a flange part, and a second slit connected to the first slit while extending through a side wall part connected to the flange part. a vertical length of the first slit is equal to a vertical length of the second slit. a horizontal length of the first slit is about 5 times to about 7 times the vertical length of the first slit.
Inventor(s): Yeongsup SOHN of Suwon-si KR for samsung electronics co., ltd., Seongbo SHIM of Suwon-si KR for samsung electronics co., ltd., Moosong LEE of Suwon-si KR for samsung electronics co., ltd., Jiyeon YI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/033, G03F7/00, G03F7/004, G03F7/16, H01L21/308, H01L21/311, H01L21/3213
CPC Code(s): H01L21/0337
Abstract: a method of forming patterns includes forming an etch target film on a substrate having a first region and a second region, forming a hardmask structure on the etch target film in the first region and the second region, the hardmask structure including a plurality of hardmask layers, forming a first photoresist film on the hardmask structure in at least one of the first region and the second region, forming a first photoresist pattern in the second region by exposing and developing the first photoresist film, and forming a pattern from the etch target film by etching the hardmask structure and the etch target film by using the first photoresist pattern, wherein a top surface of the hardmask structure in the first region is exposed to the outside after the first photoresist film is developed.
Inventor(s): Nikhil SIVADAS of Boston MA US for samsung electronics co., ltd., Yongwoo SHIN of Concord MA US for samsung electronics co., ltd.
IPC Code(s): H01L21/22, H01L21/225
CPC Code(s): H01L21/2225
Abstract: a structure includes a dopant layer at or close to a channel to n-dope tmds, wherein the dopant layer includes at least one of: at least one of halides (mx; m=(ti, zr, or hf), x=at least one of {cl, br, or i}); at least one of hydroxides (m(oh); m=(ru, os, or ni)); caas; or znhnte. a method for fabricating a channel includes depositing a delta-doped layer having a low dielectric constant and a band gap>0.1 ev onto a high-k layer, and n-doping a tmd layer, wherein an absolute value of ionization energy of the delta-doped layer is less than an absolute value of the electron affinity of the tmd layer, the delta-doped layer includes one of a halide, hydroxide, chalcogenide, oxide, arsenide, or multi-anion compound, and a fractional ratio of the delta-doped layer to the high-k layer is 0 to 0.3.
Inventor(s): SangHyuk YOO of Suwon-si KR for samsung electronics co., ltd., Songyun KANG of Suwon-si KR for samsung electronics co., ltd., Jiwon SON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/3115, H01L21/02, H01L21/311
CPC Code(s): H01L21/31155
Abstract: the present disclosure relates to methods of manufacturing semiconductor devices, and a method for manufacturing a semiconductor device according to an embodiment comprises: forming an insulating layer including a silicon compound on a substrate; forming a trench by recessing a portion of the insulating layer toward the substrate, wherein the trench is adjacent a first portion of the insulating layer and a second portion of the insulating layer; implanting a first impurity with a first concentration in the first portion of the insulating layer; implanting a second impurity with a second concentration in the second portion of the insulating layer, wherein the implanting the first impurity and the implanting the second impurity are performed simultaneously; and etching the first portion of the insulating layer after the implanting the first impurity, wherein the first impurity and the second impurity each include at least one of boron and arsenic.
Inventor(s): Sunghwan Kim of Suwon-si KR for samsung electronics co., ltd., Kyungwon Kang of Suwon-si KR for samsung electronics co., ltd., Dongwook Kim of Suwon-si KR for samsung electronics co., ltd., Seok Heo of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H01L21/683
CPC Code(s): H01L21/67051
Abstract: provided are a wafer cleaning device and a method of optimizing the same. the wafer cleaning device includes an upper nozzle configured to spray a cleaning solution onto a front surface of a wafer, a spin chuck provided below the wafer to rotate the wafer and configured to heat a central region of the wafer, and a plurality of lower nozzles provided below the wafer to spray a temperature control liquid having a higher temperature than the cleaning solution onto a rear surface of the wafer, the plurality of lower nozzles configured to heat an outer region of the wafer that surrounds the central region of the wafer. a temperature gradient formed by the spin chuck and the plurality of lower nozzles causes a cleaning solution to flow in a cleaning solution layer on the front surface of the wafer.
Inventor(s): Ilyoung HAN of Suwon-si KR for samsung electronics co., ltd., Sumin KIM of Suwon-si KR for samsung electronics co., ltd., Minwoo RHEE of Suwon-si KR for samsung electronics co., ltd., Hyunjin LEE of Suwon-si KR for samsung electronics co., ltd., Kyeongbin LIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/677, H01L21/67, H01L21/68
CPC Code(s): H01L21/67709
Abstract: a wafer on which a hydrophilic pattern is applied is provided to a die seat on which a first magnetic pattern is formed and a hydrophobic pattern is applied around the hydrophilic pattern. liquid is dispensed to the die seat. a first die on which a second magnetic pattern is formed is seated on the wafer and the first die is first-aligned using capillary force of the liquid. liquid is dispensed onto an upper surface of the first die. a second die is seated on the upper surface of the first die and the second die is first-aligned with capillary force of the liquid on the upper surface of the first die. a magnetic field is generated in the first magnetic pattern and the second magnetic pattern and the first magnetic pattern and the second magnetic pattern are secondly-aligned using magnetic force.
20250140595. APPARATUS FOR PROCESSING SUBSTRATE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yeontae Kim of Suwon-si KR for samsung electronics co., ltd., Yihwan Kim of Suwon-si KR for samsung electronics co., ltd., Woohyung Kim of Suwon-si KR for samsung electronics co., ltd., Sunwoo Bang of Suwon-si KR for samsung electronics co., ltd., Kwanghyun Yang of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/687, H01J37/32, H01L21/67
CPC Code(s): H01L21/68742
Abstract: an apparatus for processing a substrate is provided and includes: a chamber including an internal space; a shower head in the internal space of the chamber; a heater below the shower head; lift pins configured to lift the substrate, relative to the heater, while the substrate is on the heater; a rotation shaft connected to the heater; a rotation driving actuator connected to the rotation shaft and configured to rotate the heater by rotating the rotation shaft; a first lifting driving actuator configured to lift the heater; a lifting member configured to lift the lift pins; and a second lifting driving actuator connected to the lifting member and configured to lift the lift pins, relative to the heater, by lifting the lifting member.
Inventor(s): Bongsoo KIM of Suwon-si KR for samsung electronics co., ltd., Chobi KIM of Suwon-si KR for samsung electronics co., ltd., Pyunghwa HAN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/14, H01L23/00, H01L23/31, H01L23/498
CPC Code(s): H01L23/145
Abstract: a semiconductor package includes: a first interconnection structure; an expanded layer arranged on the first interconnection structure, the expanded layer comprising a plurality of expanded base layers; a semiconductor chip arranged in a mounting space and electrically connected to the first interconnection structure; a filling insulating layer configured to fill the mounting space; and a second interconnection structure arranged on the expanded layer and the filling insulating layer, the second interconnection structure electrically connected to the first interconnection structure through a plurality of via structures, in which a surface of a lowermost expanded base layer among the plurality of expanded base layers is positioned at a higher vertical level than a surface of the filling insulating layer, and a sink space is confined by the expanded layer and the filling insulating layer under a surface of the lowermost expanded base layer among the plurality of expanded base layers.
20250140668. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunwoong HAN of Suwon-si KR for samsung electronics co., ltd., Junhyeong PARK of Suwon-si KR for samsung electronics co., ltd., Young Kwan SEO of Suwon-si KR for samsung electronics co., ltd., Kyungtae KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/065
CPC Code(s): H01L23/49822
Abstract: a semiconductor package includes a first redistribution substrate comprising first redistribution patterns and first redistribution insulating layers covering the first redistribution patterns, a conductive post on the first redistribution substrate, extending in a direction perpendicular to a top surface of the first redistribution substrate and electrically connected to a corresponding one of the first redistribution patterns, a first semiconductor chip on the first redistribution substrate and laterally spaced apart from the conductive post, and a second redistribution substrate on the conductive post and the first semiconductor chip and comprising second redistribution patterns. the conductive post is electrically connected to a corresponding one of the second redistribution patterns. a top surface of the conductive post faces the second redistribution substrate. the conductive post includes contact holes extending from the top surface of the conductive post into the conductive post. the corresponding second redistribution pattern fills the contact holes.
Inventor(s): Jeongrim SEO of Suwon-si KR for samsung electronics co., ltd., Pyunghwa HAN of Suwon-si KR for samsung electronics co., ltd., JoongSun KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48, H01L21/56, H01L23/00, H01L23/31
CPC Code(s): H01L23/49838
Abstract: a wiring structure may include a first wiring layer including a first via pad, a first insulating layer covering the first wiring layer, a second wiring layer on the first insulating layer and including a second via pad defining a hole, a second insulating layer on the first insulating layer and covering the second wiring layer, a third wiring layer on the second insulating layer and including a third via pad, and a via integrally penetrating the first insulating layer and the second insulating layer, filling the hole of the second via pad, and connecting the first via pad, the second via pad, and the third via pad to each other, wherein the first insulating layer covers upper and side surfaces of the first via pad, and a diameter of the first via pad is smaller than diameters of the second via pad and the third via pad.
20250140677. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Min Jeong SHIN of Suwon-si KR for samsung electronics co., ltd., Duck Gyu KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/10
CPC Code(s): H01L23/49838
Abstract: a semiconductor package includes a redistribution substrate including a first surface and a second surface, which are opposite to each other in a first direction, a semiconductor chip mounted on the first surface of the redistribution substrate, a redistribution pattern in the redistribution substrate and electrically connected to the semiconductor chip, a metal pattern electrically connected to the redistribution pattern, including a third surface and a fourth surface, which are opposite to each other in the first direction, and a connection terminal on the second surface of the redistribution substrate and being in contact with the fourth surface of the metal pattern, wherein at least a portion of the redistribution pattern is in contact with sidewalls of the metal pattern, wherein the third surface faces the semiconductor chip and is not in contact with the redistribution pattern, and wherein the fourth surface does not overlap the second surface in the first direction.
Inventor(s): Jihyun LEE of Suwon-si KR for samsung electronics co., ltd., Insik HAN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48, H01L23/00, H01L23/31
CPC Code(s): H01L23/49838
Abstract: a substrate includes a base substrate comprising a center region and a corner region in a plan view. the base substrate comprises wiring patterns and an insulating layer. first conductive pads are on an upper surface of the center region of the base substrate. second conductive pads are on an upper surface of the corner region of the base substrate. each of the first conductive pads has a circular or oval shape in the plan view. each of the second conductive pads has a polygonal shape in the plan view.
Inventor(s): Jiyong KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/522, H01L23/13, H01L23/367, H01L25/11, H01L25/16
CPC Code(s): H01L23/5223
Abstract: a storage device may include a substrate; a semiconductor chip on the substrate; a case including a plurality of heat dissipation fins, a cavity, and a capacitor module configured to be electrically connected to the substrate, the heat dissipation fins being arranged in a first direction and spaced apart from each other in a second direction that is perpendicular to the first direction, and an upper cover on the case. the capacitor module may include a capacitor in the cavity and the capacitor may be configured to supply power to the substrate.
20250140694. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ki-Il Kim of Suwon-si KR for samsung electronics co., ltd., Sug Hyun Sung of Suwon-si KR for samsung electronics co., ltd., Myung Yoon Um of Suwon-si KR for samsung electronics co., ltd., Jung Gun You of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/768, H01L21/8234, H01L23/522, H01L27/088, H01L29/06, H01L29/08
CPC Code(s): H01L23/5286
Abstract: a semiconductor device includes a back interlayer insulating film, a back wiring line disposed within the back interlayer insulating film, a fin-type pattern disposed on a first surface of the back wiring line, a source/drain pattern disposed on the fin-type pattern, and a back wiring contact connecting the back wiring line and source/drain pattern. a bottom surface of the source/drain pattern is connected to the fin-type pattern and faces the back wiring line. the back wiring contact includes a back contact barrier film, a back contact plug film, and a back ferroelectric material film. the back wiring contact includes a third surface facing the back wiring line. a vertical length from a second surface of the back wiring line to the third surface of the back wiring contact is less than a vertical length from the second surface to the bottom surface of the source/drain pattern.
Inventor(s): Sunggu KANG of Suwon-si KR for samsung electronics co., ltd., Jaechoon KIM of Suwon-si KR for samsung electronics co., ltd., Sungho MUN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/00, H01L23/31, H01L23/367, H01L23/48, H01L23/498, H01L25/065, H10B80/00
CPC Code(s): H01L23/5286
Abstract: a semiconductor package includes a first redistribution layer substrate having a lower conductive structure; a first semiconductor chip and a second semiconductor chip electrically connected to the first redistribution layer substrate and arranged side-by-side on the first redistribution layer substrate; and an interposer disposed over a portion of the first semiconductor chip and a portion of the second semiconductor chip to electrically connect the first semiconductor chip to the second semiconductor chip, wherein the first semiconductor chip comprises a rear power distribution network structure in a lower portion of the first semiconductor chip, and the second semiconductor chip comprises a rear power distribution network structure in a lower portion of the second semiconductor chip.
20250140705. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyuhyeon Choi of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L21/56, H01L23/00, H01L23/31, H01L23/498, H01L25/18, H10B80/00
CPC Code(s): H01L23/5386
Abstract: a semiconductor package includes a package substrate, a first semiconductor chip on the package substrate and including a plurality of first through vias, a second semiconductor chip spaced apart from the first semiconductor chip in a lateral direction parallel to an upper surface of the package substrate and including a plurality of second through vias, a third semiconductor chip on the first semiconductor chip, an interposer between the third semiconductor chip and the first semiconductor chip and electrically connecting the first semiconductor chip to the third semiconductor chip, a molding layer between the package substrate and the interposer and on the first semiconductor chip and the second semiconductor chip, a first solder ball between the first semiconductor chip and the interposer, and a second solder ball between the second semiconductor chip and the interposer.
Inventor(s): Junghoon KANG of Anyang-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L21/48, H01L23/00, H01L23/31
CPC Code(s): H01L23/5389
Abstract: a method includes attaching a first anisotropic conductive film including first conductive particles to a front surface of a substrate structure; compressing a first redistribution structure on the front surface of the substrate structure such that a first redistribution conductor of the first redistribution structure that is exposed is electrically connected by the first conductive particles to a connection terminal or a vertical connection conductor that is exposed from the substrate structure, attaching a second anisotropic conductive film including second conductive particles to a rear surface of the substrate structure; and compressing a second redistribution structure on the rear surface of the substrate structure such that a second redistribution conductor of the second redistribution structure that is exposed is electrically connected by the second conductive particles to the vertical connection conductor.
Inventor(s): TAE SUN KIM of Ballston Spa NY US for samsung electronics co., ltd., Yeojin LEE of Cohoes NY US for samsung electronics co., ltd., KANG-ILL SEO of Springfield VA US for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L21/56, H01L21/68, H01L21/768
CPC Code(s): H01L23/544
Abstract: wafer-bonding methods are provided. a wafer-bonding method includes overlaying a first wafer and a second wafer with each other. the first wafer includes a transparent or translucent material having first alignment marks thereon. the second wafer has second alignment marks. the method includes providing light through the first wafer to check alignment of the first alignment marks with the second alignment marks. the method includes bonding the first wafer to the second wafer. moreover, the method includes removing the transparent or translucent material while the first alignment marks remain bonded to the second wafer.
20250140711. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Byounghoon KIM of Suwon-si KR for samsung electronics co., ltd., Jihwan SEO of Suwon-si KR for samsung electronics co., ltd., Sangsu JEONG of Suwon-si KR for samsung electronics co., ltd., Sungsik PARK of Suwon-si KR for samsung electronics co., ltd., Giseok SONG of Suwon-si KR for samsung electronics co., ltd., Hyunju SONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L23/528, H01L29/06, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L23/544
Abstract: a semiconductor device may include a substrate including a logic cell region and a key region, an active pattern in the logic cell region, a channel pattern on the active pattern, a plurality of gate electrodes extending on the channel pattern in a first direction and spaced apart from each other in a second direction perpendicular to the first direction, a device separation layer on the key region, and a first key pattern corresponding to the plurality of gate electrodes on the device separation layer.
20250140720. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): DAWOON JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/48, H01L25/065
CPC Code(s): H01L24/05
Abstract: a semiconductor package includes a first semiconductor chip, a chip structure on the first semiconductor chip, and a bonding structure between the first semiconductor chip and the chip structure, where the bonding structure includes a first conductive pad on an upper surface of the first semiconductor chip, a second conductive pad on a lower surface of the chip structure, a protective metal layer between the first conductive pad and the second conductive pad, and an intermetallic compound in the protective metal layer, where the protective metal layer covers a surface of the first conductive pad and a surface of the second conductive pad, where the semiconductor package further includes a first interface between the first semiconductor chip and the chip structure and a second interface between the protective metal layer and the second conductive pad.
Inventor(s): Jihoon KIM of Suwon-si KR for samsung electronics co., ltd., Jinkyeong SEOL of Suwon-si KR for samsung electronics co., ltd., Raeyoung KANG of Suwon-si KR for samsung electronics co., ltd., Minki KIM of Suwon-si KR for samsung electronics co., ltd., Hyeonkyu HA of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/48, H01L25/065, H10B80/00
CPC Code(s): H01L24/06
Abstract: a semiconductor package includes a plurality of semiconductor chips bonded to each other through direct bonding, the plurality of semiconductor chips including a first semiconductor chip and a second semiconductor chip. the first semiconductor chip including: a front insulating layer bonded to a back insulating layer of the second semiconductor chip; a front pad surrounded by the front insulating layer; a device layer on a back surface of the front insulating layer and including an interconnection structure electrically connected to the front pad; a conductive pattern between the interconnection structure and the front pad; and a support insulating layer between the device layer and the front insulating layer and surrounding the conductive pattern, wherein a gap is between a first side surface of the support insulating layer and a second side surface of the conductive pattern that faces the first side surface.
20250140726. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyunglyul LEE of Suwon-si KR for samsung electronics co., ltd., Jooyoung OH of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00
CPC Code(s): H01L24/14
Abstract: a semiconductor package includes: a package substrate having a first region and a second region; first connection pads disposed on the first region of the package substrate, and having a first height; second connection pads disposed on the second region of the package substrate, and having a second height that is lower than the first height; a semiconductor chip including first chip pads, second chip pads, and a protective insulating layer, wherein the first chip pads are disposed in the first region, wherein the second chip pads are disposed in the second region, and wherein the protective insulating layer is disposed on the second chip pads; first bump structures disposed on the first chip pads, and respectively connected to the first connection pads; and second bump structures disposed on the protective insulating layer, wherein the second bump structures are respectively connected to the second connection pads.
Inventor(s): Wonbin Shin of Suwon-si KR for samsung electronics co., ltd., Jihye Shim of Suwon-si KR for samsung electronics co., ltd., Seokkyu Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/49
CPC Code(s): H01L24/20
Abstract: provided is a wiring structure including a wiring insulating layer including a first insulating layer and a second insulating layer on the first insulating layer, and a wiring pattern that penetrates the second insulating layer and extends into the first insulating layer, wherein a portion of a side surface of the wiring pattern in contact with the first insulating layer is a curved surface with a first surface roughness, and a portion of the side surface of the wiring pattern in contact with the second insulating layer is a flat surface with a second surface roughness that is less than the first surface roughness.
Inventor(s): Taehoon Lee of Suwon-si KR for samsung electronics co., ltd., Dahee Kim of Suwon-si KR for samsung electronics co., ltd., Gyujin Choi of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/498
CPC Code(s): H01L24/20
Abstract: an example semiconductor package includes a redistribution structure, including a first surface and a second surface, and a semiconductor chip on the first surface of the redistribution structure. the redistribution structure includes a plurality of first conductive lines, including a first signal line, and a plurality of second conductive lines at a vertical level different from the plurality of first conductive lines. the plurality of second conductive lines include a ground line electrically insulated from the first signal line. the ground line includes an opening extending through the ground line at a position vertically overlapping the first signal line and a venting hole communicating with a first end portion of the opening. the first end portion of the opening has a first width in a first horizontal direction. the venting hole has a second width smaller than the first width in the first horizontal direction.
Inventor(s): Hoseok LEE of Suwon-si KR for samsung electronics co., ltd., Kyu-Chang KANG of Suwon-si KR for samsung electronics co., ltd., Kangsub JEONG of Suwon-si KR for samsung electronics co., ltd., Dayoung KIM of Suwon-si KR for samsung electronics co., ltd., Young Seok PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/065, G11C11/4091, H01L23/00, H10B12/00, H10B80/00
CPC Code(s): H01L25/0657
Abstract: a semiconductor memory device may include a first chip include a first array matrix and a second array matrix adjacent to each other and including memory cells, and a second chip below the first chip, and including sense amplifiers configured to drive the memory cells, where first cell bit lines are in the first array matrix, and second cell bit lines are in the second array matrix, where first bit lines and first complementary bit lines are below the first array matrix, and second bit lines and second complementary bit lines are below the second array matrix, and where the first bit lines and the second bit lines are connected to the first cell bit lines and the second cell bit lines, respectively, the first complementary bit lines and the second complementary bit lines are connected to the second cell bit lines and first cell bit lines, respectively.
20250140752. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): YOUNGBAE KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498, H01L23/522, H01L25/10, H10B12/00, H10B80/00
CPC Code(s): H01L25/0657
Abstract: a semiconductor package is provided that includes a buffer chip, a plurality of semiconductor chips on the buffer chip, and a molding layer on the buffer chip and the plurality of semiconductor chips. the buffer chip includes a device layer and a capacitor layer on the device layer. the device layer includes a plurality of transistors that constitute logic circuits. the capacitor layer includes at least one capacitor. the plurality of semiconductor chips vertically overlap the capacitor.
Inventor(s): Jungsoo BYUN of Suwon-si KR for samsung electronics co., ltd., Taesung Jeong of Suwon-si KR for samsung electronics co., ltd., Younggwan Ko of Suwon-si KR for samsung electronics co., ltd., Jaeean Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes an interposer, first and second semiconductor chips, and electrical connection structures. the interposer includes a first connection structure having a first redistribution conductor, second connection structures each having a second redistribution conductor, third connection structures each having a third redistribution conductor, and a passivation layer filling spaces between the first to third connection structures. the first semiconductor chip is disposed on the interposer to overlap the first connection structure and some third connection structures. the second semiconductor chip is disposed on the interposer to overlap some second connection structures and third connection structures. the electrical connection structures are electrically connected to the first and second chips. the first redistribution conductor electrically connects the first chip to some electrical connection structures, the second redistribution conductor electrically connects the second chip some electrical connection structures, and the third redistribution conductor electrically connects the first and second chips.
Inventor(s): Dahee Kim of Suwon-si KR for samsung electronics co., ltd., Taehoon Lee of Suwon-si KR for samsung electronics co., ltd., Gyujin Choi of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L21/48, H01L23/00, H01L23/31, H01L23/367, H01L23/498
CPC Code(s): H01L25/18
Abstract: a semiconductor package using a core layer to reduce the total thickness of the semiconductor package and to maximize heat dissipation characteristics is provided. the semiconductor package includes a first redistribution layer, a first semiconductor device disposed on the first redistribution layer, a second semiconductor device disposed on the first redistribution layer and adjacent to the first semiconductor device, a support member disposed at side surfaces of the first semiconductor device and the second semiconductor device, a third semiconductor device disposed above the second semiconductor device, and a heat dissipation structure disposed above the first semiconductor device and adjacent to the third semiconductor device.
Inventor(s): Mahdi Amachraa of Cambridge MA US for samsung electronics co., ltd., Yan Wang of Brookline MA US for samsung electronics co., ltd., Heung Chan Lee of Suwon-si KR for samsung electronics co., ltd., Giyun Kwon of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01M10/0562, H01M10/0525
CPC Code(s): H01M10/0562
Abstract: a compound has the formula libmocl, wherein li, o, and cl vacancies are allowed and m is either a one-way, two-way or three-way combination of the following species: al, fe, b, la, y, mo, be, si, cr, as, mn, v, co, ge, fe, mo, mo, as, ti, p, as, and wherein 0≤x<2, 0<y<6, 0≤z<1, and 0<w<2 either satisfy a charge balance mechanism with their respective defect site b, li, o, or cl, or satisfy any combination that maintains charge neutrality of the compound, and wherein when m comprises al, m is a two-way or three-way combination. a glass ceramic composition includes the compound. a lithium ion battery includes a solid state ionic conductor, wherein the solid state ionic conductor includes the compound.
Inventor(s): Valentina LACIVITA of Cambridge MA US for samsung electronics co., ltd., Yan Wang of Brookline MA US for samsung electronics co., ltd., Yongwoo Shin of Concord MA US for samsung electronics co., ltd., Samuel Cross of Cambridge MA US for samsung electronics co., ltd.
IPC Code(s): H01M10/0562, H01M50/431
CPC Code(s): H01M10/0562
Abstract: a deformable halide-based ionic conductor has one of the following formulas: nalii, nalibr, nalicl, klif, lihff, liagi, lisib(clf), liagbr, liznfhaving a trigonal crystal structure with space group r-3, liagcl, or liagcl. a catholyte includes a deformable halide-based ionic conductor having one of the following formulas: cslicl, wherein the csliclhas an orthorhombic crystal structure, klif, lihff, lisib(clf), liagbr, liznf, liagcl, or liagcl. a solid electrolyte separator includes a deformable halide-based ionic conductor having one of the following formulas: cslicl, wherein the csliclhas an orthorhombic crystal structure, nalii, nalibr, nalicl, klif, lihff, liagi, lisib(clf), liagbr, liznf, liagcl, or liagcl. a solid state battery includes an anode, a cathode, and a solid electrolyte separator including a deformable halide-based ionic conductor having one of the following formulas: cslicl, wherein the csliclhas an orthorhombic crystal structure, nalii, nalibr, nalicl, klif, lihff, liagi, lisib(clf), liagbr, liznf, liagcl, or liagcl.
Inventor(s): Valentina LACIVITA of Cambridge MA US for samsung electronics co., ltd., Yan WANG of Brookline MA US for samsung electronics co., ltd., Yongwoo SHIN of Concord MA US for samsung electronics co., ltd., Samuel Robert CROSS of Cambridge MA US for samsung electronics co., ltd.
IPC Code(s): H01M10/0562, C01D15/00, C01D17/00
CPC Code(s): H01M10/0562
Abstract: an anolyte includes a deformable halide-based ionic conductor having one of the following formulas: cslicl, wherein the csliclhas an orthorhombic crystal structure, nalii, nalibr, nalicl, and klif. a solid state battery includes an anode, a cathode, and a solid electrolyte, wherein the solid state battery comprises the aforementioned anolyte.
Inventor(s): Bumjin PARK of Suwon-si KR for samsung electronics co., ltd., Jedok KIM of Suwon-si KR for samsung electronics co., ltd., Seho PARK of Suwon-si KR for samsung electronics co., ltd., Sungku YEO of Suwon-si KR for samsung electronics co., ltd., Hana CHOE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H02J50/10, H02J7/00
CPC Code(s): H02J50/10
Abstract: an electronic device (e.g., a power supply device or a power receiving device) includes a housing including a first side of the electronic device and a second side opposite to the first side, a wireless charging coil disposed in the housing, and a magnet structure disposed in the housing to surround the coil and including a plurality of magnet pieces including a first magnet piece and a second magnet piece. the first magnet piece includes a first outer magnetized area having an n pole facing the first side, a first inner magnetized area disposed closer to the coil than the first outer magnetized area and having an s pole facing the first side, and a first non-magnetized area disposed between the first outer magnetized area and the first inner magnetized area. the second magnet piece includes a second outer magnetized area having an n pole facing the first side, a second inner magnetized area disposed closer to the coil than the second outer magnetized area and having an s pole facing the first side, and a second non-magnetized area disposed between the second outer magnetized area and the second inner magnetized area. the first magnet piece has a first magnetic force and the second magnet piece has a second magnetic force different from the first magnetic force.
Inventor(s): Hangseok CHOI of Suwon-si KR for samsung electronics co., ltd., Sangwoo KANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H02J50/12, H02J7/00, H02J50/80
CPC Code(s): H02J50/12
Abstract: according to embodiments, an electronic device may comprise a wireless power transmission/reception circuit, a wired power transmission/reception port, a load switch electrically connected to the wired power transmission/reception port, a switching charger electrically connected to the load switch and the wireless power transmission/reception circuit, a battery electrically connected to the switching charger, and a processor. the processor may be configured to, based on a first current input to an input end of the load switch, a first voltage at an output end of the load switch, a second voltage of the battery, a second current between the switching charger and the battery, and efficiency by the switching charger, predict a third current at an output end of the wireless power transmission/reception circuit.
20250141445. ASYMMETRIC OUTPUT DRIVER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Mohamed Badr Mahmoud Mohamed Badr YOUNIS of Champaign IL US for samsung electronics co., ltd.
IPC Code(s): H03K17/687
CPC Code(s): H03K17/6872
Abstract: a system and method for operating an output driver are disclosed, the method comprising connecting a first p-channel field-effect transistor (pfet) between a supply voltage and an output node; connecting a second pfet in parallel with the first pfet between the supply voltage and the output node; connecting a first n-channel field-effect transistor (nfet) between the supply voltage and a gate of the second pfet; and adjusting a voltage at a gate of the first nfet based on a voltage at the output node to modulate a voltage of a gate of the second pfet to maintain a pull-up resistance within a predefined range.
Inventor(s): Sungjae OH of Gyeonggi-do KR for samsung electronics co., ltd., Hyunuk KANG of Gyeonggi-do KR for samsung electronics co., ltd., Daeyoung LEE of Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H04B1/04, H04B1/00
CPC Code(s): H04B1/0458
Abstract: the disclosure relates to a fifth generation (g) communication system or a sixth generation (g) communication system. an electronic device in a wireless communication system can reduce or minimize the size of a power amplifier module (pam) and can secure a relatively wide operating frequency band of the pam.
Inventor(s): Mouna Hajir of San Diego CA US for samsung electronics co., ltd., Mojtaba Rahmati of San Diego CA US for samsung electronics co., ltd., Hyuk Joon Kwon of San Diego CA US for samsung electronics co., ltd.
IPC Code(s): H04B1/525, H04B1/12
CPC Code(s): H04B1/525
Abstract: a system includes: a first transmitter to transmit a first signal; a second transmitter to transmit a second signal; a receiver to receive a downlink signal, the downlink signal including a desired signal and an interference signal corresponding to the first and second signals; a processor; and memory including instructions that, when executed by the processor, cause the processor to: select an interference function based on center frequencies of the first and second transmitters and the receiver; calculate correlation values based on a first delay between the receiver and a reference transmitter, and a second delay between the first and second transmitters; select one or more filter taps based on the calculated correlation values; estimate the interference signal based on the selected one or more filter taps and the interference function; determine the desired signal from the downlink signal according to the estimated interference signal; and transmit the desired signal.
Inventor(s): Youngrok JANG of Gyeonggi-do KR for samsung electronics co., ltd., Hyoungju JI of Gyeonggi-do KR for samsung electronics co., ltd., Namjeong LEE of Gyeonggi-do KR for samsung electronics co., ltd., Younsun KIM of Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04L5/00, H04W24/10
CPC Code(s): H04B7/0626
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a terminal in a wireless communication system includes receiving, from a base station, first configuration information on a sounding reference signal (srs) resource, receiving, from the base station, second configuration information for a channel state information (csi) report, transmitting, to the base station, an srs for a first channel between a first transmission and reception point (trp) and the terminal based on the first configuration information, and transmitting, to the base station, the csi report including a measurement result of a second channel between a second trp and the terminal based on the second configuration information.
Inventor(s): Yibing Michelle WANG of Temple City CA US for samsung electronics co., ltd., Radwanul Hasan SIDDIQUE of Monrovia CA US for samsung electronics co., ltd.
IPC Code(s): H04J14/02, H04J14/06
CPC Code(s): H04J14/0307
Abstract: a device includes an electronic integrated circuit, the electronic integrated circuit including an optical demultiplexer and at least one photodetector optically coupled to the optical demultiplexer. the optical demultiplexer may have at least one nanostructured layer able to receive an incoming optical signal and separate the incoming optical signal into a first separated optical signal and a second separated optical signal. the device may have a first photodetector and a second photodetector, where the first photodetector may receive the first separated optical signal and the second photodetector may receive the second separated optical signal.
Inventor(s): Sa ZHANG of Beijing CN for samsung electronics co., ltd., Feifei SUN of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04L1/1812, H04W72/232, H04W72/30
CPC Code(s): H04L1/1812
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method and an apparatus for performing a hybrid automatic repeat request (harq) operation are provided. the method includes receiving downlink signals, wherein the downlink signals include a physical downlink control channel (pdcch) that does not schedule a physical downlink shared channel (pdsch) reception, and/or one or more multicast pdschs, and generating a harq-ack codebook for the downlink signals. the invention can improve communication efficiency.
Inventor(s): Pengru LI of Beijing CN for samsung electronics co., ltd., Qi XIONG of Beijing CN for samsung electronics co., ltd., Feifei SUN of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04L5/00
CPC Code(s): H04L5/0051
Abstract: the present disclosure provides a user equipment and a method executed by the user equipment. a method executed by a user equipment ue, includes: determining whether a reference signal for positioning collides with other downlink signals and/or channels, and/or other uplink signals and/or channels; and determining a behaviour of the ue according to a result of the determination.
Inventor(s): Kyungjun CHOI of Suwon-si KR for samsung electronics co., ltd., Younsun KIM of Suwon-si KR for samsung electronics co., ltd., Jaeyeon SHIM of Suwon-si KR for samsung electronics co., ltd., Hyoungju JI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/0446, H04W72/23
CPC Code(s): H04L5/0055
Abstract: the disclosure provides a method for establishing and receiving a downlink control channel in a wireless communication system. a method performed by a terminal comprises, receiving, from a base station, information with at least one cell associated with a hybrid automatic repeat request acknowledgement (harq-ack) codebook transmission of the ue; receiving, from the base station, information triggering the harq-ack codebook transmission; and transmitting, to the base station, a harq-ack codebook including harq-ack information associated with the at least one cell, respectively, wherein, in case that the at least one cell includes at least one of a deactivated secondary cell (scell) or an activated scell including an activated dormant bandwidth part (bwp), harq-ack information associated with the deactivated scell and harq-ack information associated with the activated scell including the activated dormant bwp is generated based on a parameter associated with a harq-ack information generation, which is configured for reference bwp.
Inventor(s): Minsu LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L12/28
CPC Code(s): H04L12/2816
Abstract: an electronic device is provided. the electronic device includes a communication interface connected to a first electronic device and a second electronic device, in each of which a hub is built-in, through an access point, memory storing one or more computer programs, and one or more processors communicatively coupled to the communication interface and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to, based on receiving a user input for controlling an external device connected to the first electronic device, transmit a first control command to the first electronic device through the communication interface, the first control command including an instruction for controlling the external device, identify that a communication error occurred between the first electronic device and the external device, and transmit a second control command through the communication interface, the second control command including an instruction to control that the first control command and identification information of the external device are transmitted to the second device, and the second electronic device communicates with the external device to control the external device, wherein the identification information of the external device is obtained by the first electronic device through near field communication.
Inventor(s): Soosin HWANG of Suwon-si KR for samsung electronics co., ltd., Ilyong PARK of Suwon-si KR for samsung electronics co., ltd., Jeongsoo LEE of Suwon-si KR for samsung electronics co., ltd., Jaehwan SIM of Suwon-si KR for samsung electronics co., ltd., Jongjik LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L41/08
CPC Code(s): H04L41/08
Abstract: an electronic apparatus including a communication interface, a memory configured to store at least one instruction, and a processor connected to the memory to control the electronic apparatus, and the processor is configured to, based on a resource state of a first hub device, among a plurality of hub devices, having a resource condition unsatisfied to support control of an external device connected to the first hub device, transmit a signal to disconnect the external device from the first hub device through the communication interface, and transmit a signal c to connect the external device to a second hub device, among the plurality of hub devices, having a resource state that satisfies the resource condition to support the control of the external device through the communication interface.
Inventor(s): David GUTIERREZ ESTEVEZ of Chertsey GB for samsung electronics co., ltd.
IPC Code(s): H04L41/50, H04W24/10
CPC Code(s): H04L41/5032
Abstract: a method of providing service experience analytics in a network is described. the method comprises: requesting or subscribing, by a service consumer from or to a network data analytics function (nwdaf) of the network, service experience analytics for one or more application(s) and/or service experience analytics for one or more network slice(s), via a request or a subscription; determining, by the nwdaf, whether to provide the service experience analytics for one or more application(s) and/or the service experience analytics for one or more network slice(s), based on the request or the subscription; providing, by the nwdaf to the service consumer, the service experience analytics for one or more application(s) and/or the service experience analytics for one or more network slice(s), according to a result of the determining. a network is also described.
Inventor(s): Kyujin HAN of Suwon-si KR for samsung electronics co., ltd., Juho Kim of Suwon-si KR for samsung electronics co., ltd., Minsun Kim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L51/56, H04L51/216, H04L51/58, H04W4/14
CPC Code(s): H04L51/56
Abstract: a server may include a communication interface, a memory, and a processor operatively connected to the communication interface and the memory. the processor may receive data related to a group sms of a group comprising a first electronic device; receive a plurality of messages transmitted by the first electronic device from a sms message center (smsc); perform forking on the plurality of messages sequentially; generate an object corresponding to the group sms based on address information of forked messages that match the data related to the group sms received from the first electronic device; and transmit the object corresponding to the group sms to a second electronic device.
Inventor(s): Dongyeon KIM of Suwon-si KR for samsung electronics co., ltd., Jaehyeon BAE of Suwon-si KR for samsung electronics co., ltd., Hyunkoo YANG of Suwon-si KR for samsung electronics co., ltd., Sungryeul RHYU of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L65/1089, H04L65/1016, H04L65/1104
CPC Code(s): H04L65/1089
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method and one or more non-transitory computer-readable storage media for processing a control signal in a wireless communication system are provided. the method includes receiving a first control signal transmitted from a network entity, processing the received first control signal, and transmitting, to a network entity, a second control signal generated based on the processing.
Inventor(s): Sooyeon JUNG of Suwon-si KR for samsung electronics co., ltd., Sungdong KIM of Suwon-si KR for samsung electronics co., ltd., Hyunseob OH of Suwon-si KR for samsung electronics co., ltd., Jihye LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L67/51, H04B5/00, H04L12/28
CPC Code(s): H04L67/51
Abstract: the present disclosure provides a method by which an electronic device uses an auxiliary device so as to connect an iot device to an iot service. the method of the present disclosure may comprise the steps of: receiving, from an iot device, basic information about the iot device through an auxiliary device; discovering, on the basis of the basic information, the iot device by using one from among one or more discovery methods; and registering the discovered iot device with the iot service.
Inventor(s): Nina LEE of Suwon-si KR for samsung electronics co., ltd., Eunsun KIM of Suwon-si KR for samsung electronics co., ltd., Pilwon KIM of Suwon-si KR for samsung electronics co., ltd., Hoyoung SEO of Suwon-si KR for samsung electronics co., ltd., Joonho OK of Suwon-si KR for samsung electronics co., ltd., Jinyung JUNG of Suwon-si KR for samsung electronics co., ltd., Younghak OH of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04M1/72415, H04M1/72469
CPC Code(s): H04M1/72415
Abstract: an electronic device according to an embodiment of the present disclosure comprises: a communication unit comprising communication circuitry, a sensor unit comprising a sensor, a camera unit including a front camera and a rear camera, a processor, comprising processing circuitry, and a memory operatively connected to the processor. the memory can store instructions, wherein at least one processor, individually and/or collectively, is configured to execute the instructions and to cause the electronic device to: connect the electronic device to an external electronic device; while operating a first application including a photo and video capture function related to the camera unit, detect movement of the electronic device using the sensor unit; in response to the electronic device not moving for more than a specified period of time, obtain a direction of the external electronic device using the communication unit; determine setting information of a second application based on the direction of the external electronic device; and transmit the determined setting information of the second application to the external electronic device.
Inventor(s): Yeeun CHOI of Suwon-si KR for samsung electronics co., ltd., Songil LEE of Suwon-si KR for samsung electronics co., ltd., Donghee KANG of Suwon-si KR for samsung electronics co., ltd., Juyeon LEE of Suwon-si KR for samsung electronics co., ltd., Jiwoong HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N9/31
CPC Code(s): H04N9/3182
Abstract: an electronic apparatus is provided. the electronic apparatus includes memory, a projection part, a sensor part, an optical shutter part, and at least one processor, and the at least one processor is configured to output, through the projection part, a first projection image at a projection surface, obtain, through the sensor part, first sensing data associated with the projection surface, obtain a second projection image by performing a correction function on the first projection image based on the first sensing data, identify a position of a background area from the first projection image, identify a position of a blocking area corresponding to the position of the background area, control the optical shutter part to perform a filtering function based on the position of the blocking area, and output, through the projection part, the second projection image.
Inventor(s): Donguk KIM of Suwon-si KR for samsung electronics co., ltd., Sehyun KIM of Suwon-si KR for samsung electronics co., ltd., Yeonwoo KIM of Suwon-si KR for samsung electronics co., ltd., Jongin LEE of Suwon-si KR for samsung electronics co., ltd., Donghwa JEONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N9/31, G06F3/14
CPC Code(s): H04N9/3185
Abstract: an electronic device including an image display portion through which to display content; and at least one processor configured to set a calibration threshold value based on a usage environment of the electronic device, calculate an amount of an external impact applied to the electronic device, compare the calculated amount of the external impact and a magnitude of the set calibration threshold value, and perform a calibration of the image display portion based on the calculated amount of the external impact being greater than the set calibration threshold value.
Inventor(s): Giuk KANG of Suwon-si KR for samsung electronics co., ltd., Byunghwa LEE of Suwon-si KR for samsung electronics co., ltd., Jeewoo NOH of Suwon-si KR for samsung electronics co., ltd., Sojeong SHIM of Suwon-si KR for samsung electronics co., ltd., Yeeun CHOI of Suwon-si KR for samsung electronics co., ltd., Inyoung CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N9/31
CPC Code(s): H04N9/3188
Abstract: an electronic apparatus is provided. the electronic apparatus includes a projector, a driver, memory storing one or more computer programs, and one or more processors communicatively coupled to the projector, the driver and the memory, and one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic apparatus control the projector to project first content onto a projection surface, based on the electronic apparatus moving from a first position to a second position, identify a projection angle for the projection surface based on the second position, obtain second content by changing a screen form of the first content based on the second position and the projection angle, and based on the electronic apparatus moving from the first position to the second position by controlling the driver, control the projector to project the second content onto the projection surface.
Inventor(s): Jaesung PARK of Suwon-si KR for samsung electronics co., ltd., Jiman KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N9/31
CPC Code(s): H04N9/3194
Abstract: an electronic device including a projection part; a user interface; an illumination sensor; and at least one processor configured to identify whether an external light exists around the electronic device based on an illumination value sensed by the illumination sensor, control the projection part to project an image including a plurality of color patches on a projection surface, perform color calibration of an output image based on whether an external light exists around the electronic device and a color of a color patch among the plurality of color patches selected through the user interface, and control the projection part to project the output image for which the color calibration has been performed.
20250142047. CAMERA TEST DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sara Lee of Suwon-si KR for samsung electronics co., ltd., Seungwan Jeon of Suwon-si KR for samsung electronics co., ltd., Junho Han of Suwon-si KR for samsung electronics co., ltd., Byoungho Kong of Suwon-si KR for samsung electronics co., ltd., Sungsu Kim of Suwon-si KR for samsung electronics co., ltd., Kichrl Park of Suwon-si KR for samsung electronics co., ltd., Yugyung Lee of Suwon-si KR for samsung electronics co., ltd., Subin Han of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N17/00
CPC Code(s): H04N17/002
Abstract: an operating method of a camera test device using a test chart includes an operation of receiving, from a camera module, image data generated by imaging the test chart and an operation of measuring a resolution by depth of the camera module from the image data, wherein the test chart is a three-dimensional (3d) chart including a first test pattern radiating from a vertex of the test chart, and the first test pattern is a pattern of an outer surface of the test chart in which white and black surfaces are arranged alternately.
Inventor(s): Seung-soo JEONG of Seoul KR for samsung electronics co., ltd., Minwoo Park of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N19/159, H04N19/105, H04N19/176, H04N19/184, H04N19/513
CPC Code(s): H04N19/159
Abstract: a video decoding method includes determining whether an ultimate motion vector expression (umve) mode is allowed for an upper data unit including a current block, when the umve mode is allowed for the upper data unit, determining whether the umve mode is applied to the current block, when the umve mode is applied to the current block, determining a base motion vector of the current block, determining a correction distance and a correction direction for correction of the base motion vector, determining a motion vector of the current block by correcting the base motion vector according to the correction distance and the correction direction, and reconstructing the current block based on the motion vector of the current block.
Inventor(s): Minsoo PARK of Suwon-si KR for samsung electronics co., ltd., Minwoo Park of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N19/46, G06Q10/0631, G06Q10/0637, G06Q10/0639, H04N19/117, H04N19/159, H04N19/176, H04N19/18, H04N19/186, H04N19/61, H04N19/82
CPC Code(s): H04N19/46
Abstract: an image decoding method may include obtaining a first coded block flag, when the first coded block flag of the current coding unit indicates that the current coding unit comprises the one or more non-zero significant transform coefficients, identifying whether at least one of a height and a width of the current coding unit is greater than a predetermined size, based on whether the at least one of the height and the width of the current coding unit is greater than the predetermined size, obtaining at least one transform unit, when the at least one of the height and the width of the current coding unit is greater than the predetermined size, obtaining a second coded block flag, obtaining a residual signal of the block of the luma component based on the second coded block flag, and reconstructing the current coding unit based on the residual signal.
Inventor(s): Chanwon SEO of Suwon-si KR for samsung electronics co., ltd., Yehoon Kim of Suwon-si KR for samsung electronics co., ltd., Sojung Yun of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N21/4402, G06N3/08, G06V20/40, H04N21/44, H04N21/466
CPC Code(s): H04N21/440272
Abstract: provided are an artificial intelligence (ai) system that mimics cognitive functions, such as cognition and judgment, of the human brain using a machine learning algorithm such as deep learning and applications thereof. more particularly, provided is a device including a memory storing least one program and a first video, a display, and at least one processor configured to display the first video on at least one portion of the display by executing the at least one program, wherein the at least one program includes instructions for: comparing an aspect ratio of the first video with an aspect ratio of an area in which the first video is to be displayed, generating a second video corresponding to the aspect ratio of the area by using the first video when the aspect ratio of the first video is different from the aspect ratio of the area, and displaying the second video in the area, wherein the generating of the second video is performed by inputting at least one frame of the first video to an ai neural network.
Inventor(s): Niladri MUKHERJEE of Suwon-si KR for samsung electronics co., ltd., Junghyun PARK of Suwon-si KR for samsung electronics co., ltd., Jeehye KIM of Suwon-si KR for samsung electronics co., ltd., Seungchul JEON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N23/61, H04N23/63, H04N23/69, H04N23/71, H04N23/73
CPC Code(s): H04N23/61
Abstract: an electronic device is provided. the electronic device includes at least one camera, memory storing one or more computer programs, and at least one processor communicatively coupled to the at least one camera, and the memory. the one or more computer programs include computer-executable instructions that, when executed by the at least one processor individually or collectively, cause the electronic device to identify an object area in a preview image, identify, based on identifying that the object region corresponds to a predefined subject, brightness of a background region from which the object region is excluded within the preview image, obtain, in a case that the brightness of the background region is greater than or equal to a reference value, one or more first frames through a first exposure value, based on receiving input of a user, obtain, after obtaining the one or more first frames, one or more second frames through a second exposure value greater than the first exposure value, generate an output image based on the one or more first frames and the one or more second frames, obtain, in a case that the brightness of the background region is less than the reference value, one or more frames through the first exposure value, based on receiving input of the user, and generate an output image based on the one or more frames.
Inventor(s): Changhwa Kim of Suwon-si KR for samsung electronics co., ltd., Gwideok Ryan Lee of Suwon-si KR for samsung electronics co., ltd., Doowon Kwon of Suwon-si KR for samsung electronics co., ltd., Daehoon Kim of Suwon-si KR for samsung electronics co., ltd., Changyong Um of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N25/79, H01L27/146
CPC Code(s): H04N25/79
Abstract: a stacked image sensor includes a first semiconductor chip, wherein the first semiconductor chip includes a first contact electrically connected to the first transfer transistor and disposed to extend in a z-axis direction, a second contact electrically connected to the second transfer transistor and disposed to extend in the z-axis direction, a plurality of third contacts electrically connected with each of the first floating diffusion region and the second floating diffusion region and disposed to extend in the z-axis direction, and a first metal region configured to electrically connect the plurality of third contacts to one another and disposed to extend in the z-axis direction, and the first contact, the second contact, and the first metal region contact a first surface of a first interlayer insulation layer where the first contact, the second contact, and the first metal region are formed.
Inventor(s): Changi PARK of Suwon-si KR for samsung electronics co., ltd., Jeho CHUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04R1/02, H04R9/02
CPC Code(s): H04R1/02
Abstract: an electronic device is provided. the electronic device includes a housing, a first printed circuit board, a speaker unit including a speaker housing and a diaphragm, and a support member including a first portion surrounding a portion of the speaker unit and spaced apart from a surface of the speaker unit by a predetermined gap and a second portion extending from the first portion to cover a surface of a portion of the first printed circuit board. a first space located on one side of the diaphragm is formed in the speaker housing, and a second space in fluid communication with the first space is formed between the first portion and the surface of the speaker unit. the second portion and the first printed circuit board form at least a portion of a substantially sealed third space in fluid communication with the second space.
Inventor(s): Youngkyo BAEK of Suwon-si KR for samsung electronics co., ltd., Sangsoo JEONG of Suwon-si KR for samsung electronics co., ltd., Jungje SON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W4/06, H04W28/02, H04W76/12, H04W76/40
CPC Code(s): H04W4/06
Abstract: according to an embodiment of the disclosure, a base station (bs) is configured to: transmit traffic to at least one user equipment (ue) connected to the bs via a unicast scheme; based on information about a number of ues connected to the bs to use a particular application, a particular service, or a particular session, or information of traffic to be used by the ue, determine whether to switch a transmission scheme of the traffic from the unicast scheme to a broadcast/multicast scheme; and as the broadcast/multicast scheme is determined as the transmission scheme of the traffic, transmit a message informing that the transmission scheme of the traffic is to be switched.
Inventor(s): Vijay SANGAMESHWARA of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): H04W4/50
CPC Code(s): H04W4/50
Abstract: embodiments of the disclosure describe a method for managing a pull notification message trigger procedure to enable a service enabler architecture layer (seal) notification management client (snm-c) to share a pull notification message trigger indication to a seal notification management server (snm-s) . the updates to the existing create notification channel procedures to manage a pull notification message triggers (pnmt) in seal notification management services are performed. further, a new pull notification message trigger information field represents the snm-c indication to support such application triggers to initiate the pull notification message procedure. the method for the snm-c to encode the pull notification message trigger information field as part of the create notification channel request information element sent in a http request body to the snm-s
Inventor(s): Mahmoud WATFA of Middlesex GB for samsung electronics co., ltd., Lalith Kumar of Bengaluru IN for samsung electronics co., ltd.
IPC Code(s): H04W4/90, H04W4/12, H04W60/04, H04W84/04
CPC Code(s): H04W4/90
Abstract: a method and an apparatus are provided for controlling access to a network supporting disaster roaming. the network receives a non-access stratum (nas) message from a user equipment (ue). the network verifies at least one condition in response to the nas message. based on the at least one condition, the network accepts the nas message and indicates that the ue is registered for emergency services.
Inventor(s): Matthew Tonnemacher of Allen TX US for samsung electronics co., ltd., Bilal Sadiq of Plano TX US for samsung electronics co., ltd.
IPC Code(s): H04W8/00, H04L67/51, H04W84/12
CPC Code(s): H04W8/005
Abstract: an embodiment includes a station (sta) in a wireless network, the sta comprising a memory and a processor coupled to the memory, the processor configured to receive, from an origin sta, a first discovery frame that includes one or more services intended for proxy transmission and one or more service identifiers each associated with a respective one of the one or more services, identify the one or more services based on the one or more service identifiers, generate a second discovery frame based on the first discovery frame, wherein the second discovery frame includes the one or more services intended for proxy transmission included in the first discovery frame; and transmit, to one or more other stas on behalf of the origin sta, the second discovery frame.
Inventor(s): Sapan Pramodkumar SHAH of Bangalore IN for samsung electronics co., ltd., Basavaraj Jayawant PATTAN of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): H04W8/22, H04L47/36, H04W60/04
CPC Code(s): H04W8/22
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to an embodiment, a method performed by a first user equipment (ue) which is a constrained ue in a wireless communication system is provided. the method comprises transmitting, to a plurality of ues, a first message for requesting a relay configuration for the first ue, receiving, from at least one ue with a relay capability among the plurality of ues, a second message as a response to the first message, the second message comprising information on the relay configuration, and identifying a second ue for a relay service among the at least one ue with the relay capability based on the information on a maximum allowed packet size of the second ue.
Inventor(s): Naman GUPTA of Suwon-si KR for samsung electronics co., ltd., Jicheol LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W12/06
CPC Code(s): H04W12/06
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to an embodiment of the disclosure, a method performed by a user equipment (ue) comprises transmitting, to a udm (unified data management), a first message for credentials for the ue, the credentials for the ue including at least one of name information, a mobile phone number, and a date of birth. the method comprises receiving, from the udm, a second message indicating authentication success, wherein the second message includes a user id corresponding to the credentials for the ue. the method comprises receiving, from an amf (access and mobility management function), a third message to trigger local authentication of the ue. the method comprises performing the local authentication for the ue based on the second message and the third message.
Inventor(s): Donggun KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W24/04, H04W28/086
CPC Code(s): H04W24/04
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transfer rate. the present disclosure relates to a method performed by a terminal in a wireless communication system. provided according to various embodiments of the present disclosure are a method and a device which can quickly activate cells in a next-generation mobile communication system.
Inventor(s): Rubayet Shafin of Allen TX US for samsung electronics co., ltd., Yue Qi of Plano TX US for samsung electronics co., ltd., Boon Loong Ng of Plano TX US for samsung electronics co., ltd., Peshal Nayak of Plano TX US for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX US for samsung electronics co., ltd., Elliot Jen of Taipei City TW for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W72/0446
CPC Code(s): H04W28/0278
Abstract: a station (sta) in a wireless network transmits, to an access point (ap), a buffer status report indicating pending peer-to-peer (p2p) traffic. the sta receives, from the ap, a first trigger frame allocating a first time within a transmission opportunity (txop) obtained by the ap to the sta in response to the buffer status report. the sta transmits, to a peer sta, one or more frames via a p2p link established between the sta and the peer sta within the first time.
Inventor(s): Milos TESANOVIC of Staines GB for samsung electronics co., ltd., Jaehyuk JANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W28/02
CPC Code(s): H04W28/0278
Abstract: a method for providing a buffer status report (bsr) in a network is provided. the method comprises selecting a format of the bsr from among at least two bsr formats. the format of the bsr is selected based on one or more predetermined criteria. the predetermined criteria may comprise one or more of: a number of configured lcgs; a number of lcgs of a certain minimum priority; and/or a required level of bsr granularity.
Inventor(s): Miao ZHOU of Beijing CN for samsung electronics co., ltd., Feifei SUN of Beijing CN for samsung electronics co., ltd., Min WU of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04W36/06, H04W72/25
CPC Code(s): H04W36/06
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method and an apparatus in a wireless communication system include determining first resources for a sidelink (sl) transmission, the first resources including multiple consecutive time units, determining whether the first resources include second resources unavailable for the sl transmission, and performing reselection of at least one of the second resources and at least one of third resources in a case that the first resources include the second resources, wherein the third resources include resources other than the second resources among the first resources.
Inventor(s): Aby Kanneath ABRAHAM of Bangalore IN for samsung electronics co., ltd., Chadi KHIRALLAH of Middlesex GB for samsung electronics co., ltd., Hyunjeong KANG of Gyeonggi-do KR for samsung electronics co., ltd., Sangyeob JUNG of Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H04W36/24, H04W36/00
CPC Code(s): H04W36/24
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein disclose methods for handling a slice based cell reselection in a wireless network () by a ue (). the method includes evaluating a cell reselection criteria based on a relative reselection priority between frequencies derived using a slice priority of at least one slice group supported on a frequency. the at least one slice group comprises a highest priority slice group supported by the frequency as an input. further, the method includes determining a change in the relative reselection priority upon detecting that a best cell or a highest ranked cell in the frequency does not support the at least one slice group associated with a highest priority. further, the method includes re-evaluating the cell reselection criteria based on the determined changed in the relative reselection priority.
Inventor(s): Anil AGIWAL of Suwon-si KR for samsung electronics co., ltd., Seungri JIN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W48/04, H04L1/1822, H04W24/08, H04W36/00, H04W72/20, H04W72/23
CPC Code(s): H04W48/04
Abstract: a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving a physical downlink control channel (pdcch) associated with a sidelink configured grant type 2, identifying whether a number of consecutive out-of-sync indications are received from lower layer, and starting a timer in case that the number of consecutive out-of-sync indications are received, wherein the ue does not use resources of the sidelink configured grant type 2 while the timer is running.
Inventor(s): Matthew Tonnemacher of Allen TX US for samsung electronics co., ltd., Bilal Sadiq of Plano TX US for samsung electronics co., ltd.
IPC Code(s): H04W48/08, H04W48/16, H04W84/12
CPC Code(s): H04W48/08
Abstract: an embodiment includes a station (sta) in a wireless network, the sta comprising a memory and a processor coupled to the memory, the processor configured to receive, from an origin sta, a first discovery frame that includes one or more attributes intended for proxied transmission, generate a second discovery frame that includes the one or more attributes intended for proxied transmission based on the first discovery frame and appends additional information, wherein the additional information includes an indication that the one or more attributes are associated with the origin sta and that the one or more attributes are being transmitted by proxy transmission, and wherein the additional information includes address information for the origin sta, and transmit, to one or more other stas, the second discovery frame.
Inventor(s): Hyeonu CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W48/20, H04W24/08, H04W84/12
CPC Code(s): H04W48/20
Abstract: in an electronic device and a method according to the present disclosure the device may include a communication circuit; a processor; and a memory, wherein the memory may be configured to store instructions that, when executed by the processor, cause the electronic device to receive, from each of at least one access point (ap) that has received a probe request frame transmitted by an external electronic device, information related to the probe request frame, the information including a quality of a signal including the probe request frame, to select a ap among the at least one ap to transmit a probe response frame to the external electronic device based on the signal quality and a data size temporarily stored in a buffer of the at least one ap, and to instruct the selected ap to transmit the probe response frame to the external electronic device.
Inventor(s): Seunghoon CHOI of Gyeonggi-do KR for samsung electronics co., ltd., Hyewon YANG of Gyeonggi-do KR for samsung electronics co., ltd., Jaewon LEE of Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H04W52/02, H04W8/22, H04W48/20
CPC Code(s): H04W52/0229
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system includes transmitting, to a base station, wake-up signal reception-related ue capability information, receiving, from the base station, wake-up signal reception-related information, and performing measurement on at least one neighbor cell by one of a wake-up receiver of the ue and a main radio of the ue based on the wake-up signal reception-related information.
Inventor(s): Liang HU of San Diego CA US for samsung electronics co., ltd., Philippe Jean Marc Michel SARTORI of Naperville IL US for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04L5/00, H04W52/02, H04W68/02
CPC Code(s): H04W56/0015
Abstract: a system and a method are disclosed for reducing power consumption in cell selection/reselection. the method includes transmitting, to a network node by the ue, a wake-up signal (wus) in response to a trigger condition, receiving, from the network node by the ue, a confirmation message of a receipt of the wus, and receiving an on-demand message via a synchronization signal block (ssb) or a system information block type 1 (sib1) within a time window.
Inventor(s): Ashok Kumar NAYAK of Bangalore IN for samsung electronics co., ltd., Varini GUPTA of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): H04W60/04, H04W4/02, H04W48/16
CPC Code(s): H04W60/04
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. specifically, the disclosure related to method performed by a user equipment (ue) in a wireless communication system. the method comprising includes receiving, from a base station of a hosting network, localized service support information. the method further includes performing, a manual selection of the hosting network based on the localized service support information. the method further includes transmitting, to the base station of the hosting network, a registration request message for a localized service from the hosting network. the method further includes receiving, from the base station of the hosting network, a registration accept message in response to the registration request message.
Inventor(s): Pengru LI of Beijing CN for samsung electronics co., ltd., Qi XIONG of Beijing CN for samsung electronics co., ltd., Feifei SUN of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04W64/00, G01S5/00, G01S5/02, G01S5/10
CPC Code(s): H04W64/00
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. specifically, the disclosure related to method and apparatus for measuring positioning reference signal in a wireless communication system. the method and apparatus for performing a receiver and a method and apparatus for performing a transmitter in a wireless communication system, as well as a transmitter device and a receiver device are provided herein. wherein, a method performed by a receiver in a communication system, comprises: acquiring configuration information of a reference signal for positioning: performing a carrier phase-based positioning measurement based on the configuration information: and reporting and/or transmitting a result of the carrier phase-based positioning measurement.
Inventor(s): Sangyeob JUNG of Suwon-si KR for samsung electronics co., ltd., Weiping SUN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W64/00
CPC Code(s): H04W64/006
Abstract: the disclosure relates to a 5g or a 6g communication system for supporting a higher data transmission rate. the disclosure proposes a method and an apparatus for transmitting a measurement report message to a bs when a ue satisfies a predetermined condition in a mobile communication system.
Inventor(s): Anil AGIWAL of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W68/02
CPC Code(s): H04W68/02
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method may include: receiving, from a base station, system information associated with a paging subgroup; identifying a value associated with a number of paging subgroups for a core network (cn) assigned subgrouping, based on the system information; and determining a paging subgroup identification (id) associated with a ue id based subgrouping, based on the identified value.
Inventor(s): Hyeonu CHOI of Suwon-si KR for samsung electronics co., ltd., Hyunkee MIN of Suwon-si KR for samsung electronics co., ltd., Wonbin PARK of Suwon-si KR for samsung electronics co., ltd., Junsu CHOI of Suwon-si KR for samsung electronics co., ltd., Jeongyong MYOUNG of Suwon-si KR for samsung electronics co., ltd., Sungbin MIN of Suwon-si KR for samsung electronics co., ltd., Mincheol JEONG of Suwon-si KR for samsung electronics co., ltd., Sunggi CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W72/0453, H04W28/02, H04W84/12
CPC Code(s): H04W72/0453
Abstract: an electronic device may include: a communication circuit connected to a first external electronic device; a processor; and a memory, wherein the memory is configured to store instructions that cause the electronic device to identify a bandwidth of a first link between the electronic device and the first external electronic device and a bandwidth of a second link established between the electronic device and a second external electronic device, when a size of the bandwidth of the second link is larger than a size of the bandwidth of the first link, identify traffic of data transmitted and/or received by the second external electronic device, control the communication circuit to transmit information indicating a size of a reduced bandwidth of the second link to the second external electronic device, and when the second external electronic device has reduced the bandwidth of the second link, reduce the bandwidth of the second link.
Inventor(s): Hongbo Si of Allen TX US for samsung electronics co., ltd.
IPC Code(s): H04W72/1263, H04L27/26, H04W56/00, H04W92/18
CPC Code(s): H04W72/1263
Abstract: methods and apparatuses for a sidelink synchronization signals and physical sidelink broadcast channel block (s-ss/psbch) block structure for unlicensed operation. a method of a user equipment (ue) in a wireless communication system includes determining a subcarrier spacing (scs) of a sidelink synchronization signals and physical sidelink broadcast channel (s-ss/psbch) block; determining a set of interlaced resource blocks (rbs). the set of interlaced rbs includes rbs with a uniform interval k. the method further includes mapping the s-ss/psbch block to the set of interlaced rbs and transmitting, to another ue, the s-ss/psbch block over a sidelink channel.
Inventor(s): Ebrahim MolavianJazi of San Jose CA US for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX US for samsung electronics co., ltd.
IPC Code(s): H04W72/1273, H04L1/00, H04L27/26, H04W24/08, H04W72/044, H04W72/20
CPC Code(s): H04W72/1273
Abstract: apparatuses and methods for scheduling enhancements for wireless communication systems. a method for receiving physical downlink control channels (pdcchs) includes receiving first information for first search space sets for scheduling on a first cell from the first cell and second information for second search space sets for scheduling on the first cell from a second cell. the method includes determining a first number of pdcch receptions over a first number of non-overlapping control channel elements (cces) on the first cell in a first slot based on the first search space sets and identifying that at least one of the first number of pdcch receptions exceeds a predetermined number of pdcch receptions and the first number of non-overlapping cces exceeds a predetermined number of non-overlapping cces. the method further includes canceling pdcch receptions corresponding only to third search space sets from the first search space sets.
Inventor(s): Jaeyeon SHIM of Suwon-si KR for samsung electronics co., ltd., Kyungjun CHOI of Suwon-si KR for samsung electronics co., ltd., Hyoungju JI of Suwon-si KR for samsung electronics co., ltd., Hyemin CHOE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W72/21, H04L1/1812, H04L1/1829, H04L5/00
CPC Code(s): H04W72/21
Abstract: a method performed by a user equipment (ue) in a wireless communication system. the method includes receiving, from a base station (bs), information associated with a downlink (dl) resource on a dl subband and information associated with an uplink (ul) resource on a ul subband, wherein the dl resource and the ul resource are on a same time resource; receiving, from the bs, time resource information for multiplexing uplink control information (uci) on the ul resource; performing multiplexing of the uci on the ul resource based on the time resource information; and transmitting, to the bs, an ul signal based on the ul resource multiplexed with the uci.
Inventor(s): Hyunjeong KANG of Suwon-si KR for samsung electronics co., ltd., Sangyeob JUNG of Suwon-si KR for samsung electronics co., ltd., Daegyun KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W72/25, H04W4/44
CPC Code(s): H04W72/25
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method for processing a control signal in a wireless communication system according to the disclosure includes: receiving a first control signal transmitted from a base station; processing the received first control signal; and transmitting a second control signal generated based on the processing to the base station.
Inventor(s): Donghoon KANG of Suwon-si KR for samsung electronics co., ltd., Yeonwoo KIM of Suwon-si KR for samsung electronics co., ltd., Jino SON of Suwon-si KR for samsung electronics co., ltd., Jeongsoo SHIN of Suwon-si KR for samsung electronics co., ltd., Kyuyun LEE of Suwon-si KR for samsung electronics co., ltd., Sohee CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W72/30, H04L5/00, H04W8/18
CPC Code(s): H04W72/30
Abstract: an electronic apparatus included in an internet of things (iot) network includes a communication interface, and at least one processor. the at least one processor is configured to, based on occurrence of an event in which control information allowing control over a target apparatus be provided, identify a target apparatus among at least one external apparatus connected with the electronic apparatus, broadcast a packet in association with providing the control information through the communication interface, receive identification information from an apparatus that responds to the packet through the communication interface, and based on the received identification information from the apparatus being included in a pre-stored contact list, provide the control information allowing control over the target apparatus to the apparatus.
Inventor(s): Junhwan AN of Suwon-si KR for samsung electronics co., ltd., Yunsik BAE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W76/14, H04W4/80, H04W8/00, H04W12/0433
CPC Code(s): H04W76/14
Abstract: an electronic device including a communication circuitry, memory storing one or more computer programs, and one or more processors communicatively coupled to the communication circuitry and the memory is provided. the one or more computer programs include computer-executable instructions that, when individually or collectively executed by the one or more processors, cause the electronic device to receive a second advertising signal related to a second service, identify that a first bluetooth connection for a first service has been established with an external electronic device based on a first advertising signal and the second advertising signal is broadcast from the external electronic device, perform a service search procedure for the second service through the first bluetooth connection, and at least one of transmit or receive data packets for the second service at least one of to or from the external electronic device through the first bluetooth connection.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore IN for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W76/28, H04W76/38
CPC Code(s): H04W76/28
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein disclose a method and a system for availing discontinuous reception (drx) command for a plurality of user equipments (ues) receiving new radio multicast broadcast service (nr mbs). the method includes receiving medium access control (mac) control element (ce) () from a base station. the mac ce () comprises at least one of a channel identifier (id), a drx index, and a radio network temporary identifier (rnti). the method includes determining that the received mac ce () comprises a drx command for at least one mbs service based on the at least one of the channel id, the drx index and the rnti. the drx command is for stopping at least one timer of drx configuration of the at least one mbs service. the method includes stopping the at least one timer of drx configuration of the at least one mbs service based on the determination.
Inventor(s): Jihoon KIM of Suwon-si KR for samsung electronics co., ltd., Taedong GOH of Suwon-si KR for samsung electronics co., ltd., Minsik CHO of Suwon-si KR for samsung electronics co., ltd., Bohwan CHOI of Suwon-si KR for samsung electronics co., ltd., Jinsoo CHOI of Suwon-si KR for samsung electronics co., ltd., Youngho RYU of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05B6/54, H05B6/62
CPC Code(s): H05B6/54
Abstract: provided is an electronic device configured to accommodate at least one container, the electronic device including a conductive plate configured to form an electric field based on a container being accommodated at a designated position of the electronic device, and a conductive member connected to the conductive plate and having an adjustable length, the conductive member being configured to adjust a position of the conductive plate based on the adjustable length, wherein the conductive plate includes a plurality of conductive plates that are spaced apart from each other by a gap formed along a direction parallel to a longitudinal cross-section of the container, and wherein, based on the container being accommodated at the designated position, the plurality of conductive plates are configured to form an electric field in a transverse cross-section direction of the container.
Inventor(s): Mindo ROH of Suwon-si KR for samsung electronics co., ltd., Keehwan KA of Suwon-si KR for samsung electronics co., ltd., Seongjoo HAN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05B6/64, H05B6/66
CPC Code(s): H05B6/6455
Abstract: an electronic apparatus includes a microwave generating device, a thermal imaging camera, one or more processors, and memory storing instructions that, when executed by the one or more processors, cause the electronic apparatus to: control the microwave generating device to output microwaves into a cavity; obtain a first temperature pattern, based on first thermal images obtained through the thermal imaging camera, based on the microwaves not being output; obtain a second temperature pattern, based on second thermal images obtained through the thermal imaging camera, based on the microwaves not being output; obtain temperature pattern information including information about whether the microwaves are output, the first temperature pattern, and the second temperature pattern; identify a type of a container by inputting the temperature pattern information to a first neural network model; and output a notification based on the type of the container.
Inventor(s): Seongho SON of Suwon-si KR for samsung electronics co., ltd., Yongyoun KIM of Suwon-si KR for samsung electronics co., ltd., Wanchul SEUNG of Suwon-si KR for samsung electronics co., ltd., Jongsung LEE of Suwon-si KR for samsung electronics co., ltd., Sanguk PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05K5/00, G06F1/16, H01Q1/22, H05K5/02, H05K5/03, H05K9/00
CPC Code(s): H05K5/0017
Abstract: an electronic device is provided. the electronic device includes a first housing, a second housing foldably connected to the first housing through a hinge device, a flexible display disposed to be supported by the second housing through the hinge device from the first housing, and a protective frame disposed on the second housing with edges of the flexible display interposed, wherein a conductive member is disposed based on at least one pattern between the protective frame and the edges of the flexible display.
Inventor(s): Bowon JUNG of Suwon-si KR for samsung electronics co., ltd., Soonik PARK of Suwon-si KR for samsung electronics co., ltd., Chungki YOON of Suwon-si KR for samsung electronics co., ltd., Jungchul AN of Suwon-si KR for samsung electronics co., ltd., Kwangtai KIM of Suwon-si KR for samsung electronics co., ltd., Donghyun YEOM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05K5/02, H05K5/00
CPC Code(s): H05K5/0217
Abstract: according to various embodiments, an electronic device may comprise: a first housing; a second housing coupled to the first housing and configured to be foldable with respect to a folding axis via a hinge device including a hinge; and a flexible display disposed to be supported by the first housing and the second housing and including a folding area, wherein the flexible display includes a window layer, a display panel disposed under the window layer, a support plate disposed under the display panel and including a pattern formed at a position at least corresponding to the folding area, and at least one functional layer disposed under the support plate; and includes a first adhesive member comprising an adhesive disposed between the first housing and at least one functional layer and having a length in the direction parallel to the folding axis in a position adjacent at least to one side of the folding area and a second adhesive member comprising an adhesive disposed between the second housing and at least one functional layer and having a length in the direction parallel to the folding axis in a position adjacent at least to the other side of the folding area.
Inventor(s): Junwon LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05K5/02, F16C11/04
CPC Code(s): H05K5/0226
Abstract: an electronic device according to an embodiment of the disclosure may include: a first housing, a second housing disposed on one side of the first housing and rotatably connected to the first housing, a third housing disposed on one side of the second housing and rotatably connected to the second housing, a first hinge provided between the first housing and the second housing and having a first width, and a second hinge provided between the second housing and the third housing and having a second width greater than the first width. the second hinge may include a fastener receiving portion configured to receive a fastener of an accessory configured to be fastened thereto.
Inventor(s): Hwanmyung NOH of Suwon-si KR for samsung electronics co., ltd., Seungwoon LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05K5/02
CPC Code(s): H05K5/0226
Abstract: an electronic device is provided. the electronic device includes a first housing, a second housing, a hinge module disposed between the first housing and the second housing and rotatably connecting the second housing to the first housing, a flexible display disposed across one surface of the first housing, the hinge module, and one surface of the second housing, a foot structure disposed adjacent to an outer surface of the first housing and including a first member on which a guide slot is formed, and a link structure comprising a first link member connected to the hinge module, and a second link member connecting the first link member to the guide slot, wherein the second link member is configured to move along the guide slot in conjunction with rotation of at least one of the first housing or the second housing by the hinge module, and wherein the foot structure is configured to move in a first direction toward an exterior of the first housing or a second direction opposite to the first direction in conjunction with movement of the second link member.
Inventor(s): Youngmin MOON of Suwon-si KR for samsung electronics co., ltd., Jaehyun BAE of Suwon-si KR for samsung electronics co., ltd., Chulsoo SHIN of Suwon-si KR for samsung electronics co., ltd., Bobum SEO of Suwon-si KR for samsung electronics co., ltd., Changsu LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05K5/03, H05K5/02
CPC Code(s): H05K5/03
Abstract: an electronic device includes: a first housing and a second housing; a hinge structure connecting the first housing and the second housing; a flexible display; and a cover window to cover an outer surface of the flexible display. the cover window includes: a first glass corresponding to the first housing; a second glass corresponding to the second housing; a protective layer outside the first glass and the second glass; and a transparent resin layer between the protective layer and the flexible display. the transparent resin layer includes a plurality of first transparent areas spaced apart in a direction from the first glass toward the second glass, and a plurality of second transparent areas disposed between the plurality of first transparent areas. a hardness of the plurality of first transparent areas is greater than a hardness of the plurality of second transparent areas.
Inventor(s): Iljae SHIN of Suwon-si KR for samsung electronics co., ltd., Kiseok LEE of Suwon-si KR for samsung electronics co., ltd., Seokhan PARK of Suwon-si KR for samsung electronics co., ltd., Sungmin PARK of Suwon-si KR for samsung electronics co., ltd., Dongjun LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/30
Abstract: a semiconductor device includes gate electrodes extending in a first horizontal direction on a memory cell region and stacked and spaced apart from each other in a vertical direction, back-gate electrodes extending between the gate electrodes in the first horizontal direction and stacked and spaced apart from each other in the vertical direction, vertical conductive patterns extending in the vertical direction and spaced apart from each other in the first horizontal direction on the memory cell region, active layers between the gate electrodes and the back-gate electrodes, extending in a second horizontal direction intersecting with the first horizontal direction, and electrically connected to the vertical conductive patterns on the memory cell region, and a through-plug extending in the vertical direction and in contact with side surfaces of the back-gate electrodes.
20250142805. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jung Kun LIM of Suwon-si KR for samsung electronics co., ltd., Young Chul LIM of Suwon-si KR for samsung electronics co., ltd., Gi Duck KWEON of Suwon-si KR for samsung electronics co., ltd., Hyo Joong KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/30
Abstract: a semiconductor memory device includes a semiconductor pattern on the substrate, and extending in a first horizontal direction, a bit-line and a first electrode of an information storage element electrically connected to two opposite ends of the semiconductor pattern, respectively, and a gate electrode on the semiconductor pattern, wherein the first electrode includes a first area and a second area spaced apart from each other in a vertical direction, and a connection area connecting the first area with the second area, wherein each of the first area and the second area includes first and second extensions spaced apart from each other in the vertical direction, and a connection portion connecting the first extension and the second extension and separated from the connection area, and wherein the connection area connects the second extension of the first area and the first extension of the second area adjacent to each other.
20250142806. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyunghwan LEE of Seoul KR for samsung electronics co., ltd., Yongseok KIM of Suwon-si KR for samsung electronics co., ltd., Ilgweon KIM of Hwaseong-si KR for samsung electronics co., ltd., Hyeoungwon SEO of Yongin-si KR for samsung electronics co., ltd., Sungwon YOO of Hwaseong-si KR for samsung electronics co., ltd., Jaeho HONG of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/30
Abstract: a semiconductor memory device includes a word line extending in a vertical direction, a semiconductor pattern having a ring-shaped horizontal cross-section that extends around the word line, a bit line at a first end of the semiconductor pattern, and a capacitor structure at second end of the semiconductor pattern. the capacitor structure includes a lower electrode layer electrically connected to the second end of the semiconductor pattern, having a ring-shaped horizontal cross-section, and including a connector extending in the vertical direction. a first segment extends in a horizontal direction from an upper end of the connector, and a second segment extends in the horizontal direction from a lower end of the connector. an upper electrode layer surrounded by the lower electrode layer, extends in the vertical direction, and a capacitor dielectric layer is between the lower electrode layer and the upper electrode layer.
20250142809. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kangin Kim of Suwon-si KR for samsung electronics co., ltd., Kyounghwan Kim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/34
Abstract: a semiconductor device includes a gate trench extending in a first direction on a substrate, first active fins protruding from a bottom of the gate trench, an upper surface of each of the first active fins having a first vertical level, a second active fin in the gate trench, an upper surface of the second active fin having a second vertical level higher than the first vertical level, and a gate structure on an isolation pattern filling the gate trench. a first portion of the gate structure overlapping with upper portions of the first active fins includes a first electrode. a second portion of the gate structure overlapping an upper portion of the second active fin includes a second electrode. a vertical height of the second electrode is greater than a vertical height of the first electrode.
20250142810. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): TAEJIN KIM of Suwon-si KR for samsung electronics co., ltd., HYUNGEUN CHOI of Suwon-si KR for samsung electronics co., ltd., TAEJIN PARK of Suwon-si KR for samsung electronics co., ltd., EUIJOONG SHIN of Suwon-si KR for samsung electronics co., ltd., SANGHO LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L23/522, H01L23/528
CPC Code(s): H10B12/482
Abstract: a semiconductor memory device includes a bit line extending above a substrate in a second horizontal direction, first and second active patterns beneath the bit line, each of the first and second active patterns having a first surface in contact with the bit line without a dopant source layer therebetween and a second surface opposite to the first surface in a vertical direction, a back-gate electrode between the first and second active patterns and extending above the substrate in a first horizontal direction by crossing the bit line, a first word line extending in the first horizontal direction at one side of the first active pattern, a second word line extending in the first horizontal direction at an opposite side of the second active pattern, and contact patterns in contact with the second surfaces of the first and second active patterns.
Inventor(s): Hyojin PARK of Suwon-si KR for samsung electronics co., ltd., Jinbum KIM of Suwon-si KR for samsung electronics co., ltd., Sung-Hwan JANG of Suwon-si KR for samsung electronics co., ltd., Dae-Jin NAM of Suwon-si KR for samsung electronics co., ltd., Sunguk JANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor memory device may include bit lines spaced apart from each other in a first direction on a substrate and extending in a second direction, a first active pattern and a second active pattern on the bit lines and are spaced apart from each other in the second direction, and first and second word lines between the first active and second active patterns. the first and second word lines respectively may be adjacent to the first and second active patterns. the first active pattern and/or the second active pattern may include a body portion extending in a third direction and a protruding portion protruding from an upper end of the body portion in the third direction. the protruding portion may have a width in the second direction that is greater than that of the body portion. the third direction may differ from the first and second directions.
Inventor(s): Suyoun Song of Suwon-si KR for samsung electronics co., ltd., Jamin Koo of Suwon-si KR for samsung electronics co., ltd., Beomseo Kim of Suwon-si KR for samsung electronics co., ltd., Jonghyeok Kim of Suwon-si KR for samsung electronics co., ltd., Daeyoung Moon of Suwon-si KR for samsung electronics co., ltd., Changwoo Seo of Suwon-si KR for samsung electronics co., ltd., Wonseok Yoo of Suwon-si KR for samsung electronics co., ltd., Chunhyung Chung of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/423
CPC Code(s): H10B12/485
Abstract: a semiconductor device includes a substrate including a first active region, a bit line on the substrate to cross the first active region, a bit line contact between the bit line and the first active region and in a bit line contact hole extending into the substrate, a bit line contact spacer on a sidewall of the bit line contact within the bit line contact hole, a bit line spacer on a sidewall of the bit line, an anti-oxidation layer between the sidewall of the bit line and the bit line spacer and between the sidewall of the bit line contact and the bit line spacer, and a buried contact in a buried contact hole, passing through the bit line contact spacer, and contacting the first active region, in which the anti-oxidation layer includes a silicon-containing material including sio, where 0<x≤2.
20250142813. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Soo Ho SHIN of Suwon-si KR for samsung electronics co., ltd., Ji Hoon CHANG of Suwon-si KR for samsung electronics co., ltd., Ga Eun LEE of Suwon-si KR for samsung electronics co., ltd., Hyeon-Woo JANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L23/528, H01L29/51
CPC Code(s): H10B12/50
Abstract: a semiconductor memory device includes a substrate including a cell area and a peripheral area defined around the cell area, a peripheral gate on the peripheral area and including a peripheral gate conductive film, peripheral wiring lines on the peripheral gate, peripheral wiring capping films respectively in contact with the peripheral wiring lines, wherein each peripheral wiring capping film includes upper and lower surfaces, and a peripheral wiring isolation pattern isolating adjacent peripheral wiring lines, and contacting a sidewall of the peripheral wiring lines, wherein the lower surface of each peripheral wiring capping film faces the substrate and contacts an upper surface of the peripheral wiring extension line, wherein a height from an upper surface of the substrate to the upper surface of each peripheral wiring extension line is smaller than a height from the upper surface of the substrate to an upper surface of the peripheral wiring isolation pattern.
20250142814. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yonghyeok Son of Suwon-si KR for samsung electronics co., ltd., Jeongil Seo of Suwon-si KR for samsung electronics co., ltd., Donghun Lee of Suwon-si KR for samsung electronics co., ltd., Seungmo Kang of Suwon-si KR for samsung electronics co., ltd., Seung Joo Lee of Suwon-si KR for samsung electronics co., ltd., Yujin Cho of Suwon-si KR for samsung electronics co., ltd., Seongjun Choi of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: a semiconductor device includes an interconnection line, an insulating layer on the interconnection line and having an opening exposing a top surface of the interconnection line, and a redistribution pattern extending into the opening and electrically connected to the interconnection line at a bottom surface of the opening. the interconnection line is configured to provide a current path in a first direction in a region adjacent to the redistribution pattern. the opening comprises a first side surface facing the first direction. a corner region of the opening protrudes away from or is recessed towards the opening at an end portion of the first side surface of the opening when viewed in plan view.
Inventor(s): Daehwan CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L25/065, H10B43/35, H10B43/40, H10B80/00
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes: a substrate including a cell array region and a contact region; a gate stacking structure including a plurality of interlayer insulation layers and a plurality of gate electrodes alternately stacked on the substrate; a channel structure penetrating the gate stacking structure in the cell array region; an upper insulation layer covering the gate stacking structure and the channel structure; and a plurality of gate contact parts penetrating the upper insulation layer and connected to the plurality of gate electrodes in the contact region, wherein at least a part of some of the plurality of gate contact parts penetrates at least one passing gate electrode among the plurality of gate electrodes and integrates with a connection gate electrode of the plurality of gate electrodes, and at least a part of an upper surface of the upper insulation layer has a concave shape protruding toward the substrate.
Inventor(s): Geunwon Lim of Suwon-si KR for samsung electronics co., ltd., Youngho Kwon of Suwon-si KR for samsung electronics co., ltd., Chungjin Kim of Suwon-si KR for samsung electronics co., ltd., Jungho Lee of Suwon-si KR for samsung electronics co., ltd., Yunkyu Jung of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B41/27, H10B41/41, H10B43/40
CPC Code(s): H10B43/27
Abstract: a semiconductor device may include a plate layer, gate electrodes spaced apart from each other in a first direction perpendicular to an upper surface of the plate layer on the plate layer, extending to different lengths in a second direction perpendicular to the first direction and forming step regions, channel structures penetrating through the gate electrodes, extending in the first direction, and each including a channel layer, isolation regions penetrating through the gate electrodes and extending in the first direction and the second direction, sacrificial insulating layers on the same levels as levels of the gate electrodes, respectively, a through-via penetrating through the sacrificial insulating layers and extending in the first direction, a dam structure surrounding the through-via, and a guard structure spaced apart from the dam structure horizontally and having a closed loop shape surrounding the dam structure on a plan view.
20250142824. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yuyeon Kim of Suwon-si KR for samsung electronics co., ltd., Siyeong Yang of Suwon-si KR for samsung electronics co., ltd., Chaeho Kim of Suwon-si KR for samsung electronics co., ltd., Jaeho Jung of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/27
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes gate electrodes on a substrate, the gate electrodes being spaced apart from each other in a vertical direction substantially perpendicular to an upper surface of the substrate; and a memory channel structure extending through the gate electrodes in the vertical direction on the substrate. the memory channel structure may include a filling pattern extending in the vertical direction; a channel structure on a sidewall of the filling pattern and an edge portion of an upper surface of the filling pattern; a capping pattern on a central portion of the upper surface of the filling pattern and an upper surface of the channel structure; and a charge storage structure on an outer sidewall of the channel structure and a sidewall of the capping pattern.
20250142829. THREE-DIMENSIONAL MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SEUNGYEON KIM of Suwon-si KR for samsung electronics co., ltd., IN HO KANG of Suwon-si KR for samsung electronics co., ltd., SUKKANG SUNG of Suwon-si KR for samsung electronics co., ltd., BEAKHYUNG CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/40, G11C5/06, G11C16/04, G11C16/10, G11C16/26, H01L25/065, H10B41/27, H10B41/41, H10B43/27, H10B80/00
CPC Code(s): H10B43/40
Abstract: a memory device is provided. the memory device includes: a memory cell array implemented in a first chip; and a peripheral circuit implemented in a second chip and a third chip which overlaps the first chip along a vertical direction. the peripheral circuit includes: a first peripheral circuit implemented in the second chip and the third chip; a second peripheral circuit implemented in the second chip and including at least one high-voltage transistor; and a third peripheral circuit implemented in the third chip and including at least one low-voltage transistor. the first peripheral circuit includes: a first sub-peripheral circuit implemented in the second chip and including at least one high-voltage transistor; and a second sub-peripheral circuit implemented in the third chip and including at least one low-voltage transistor.
Inventor(s): Suseong Noh of Suwon-si KR for samsung electronics co., ltd., Ilho Myeong of Suwon-si KR for samsung electronics co., ltd., KWANG-SOO KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B51/30, H10B51/20
CPC Code(s): H10B51/30
Abstract: a semiconductor device includes: a substrate; a gate stacking structure that includes interlayer insulating layers and gate electrodes that are alternately stacked on the substrate; a channel structure that penetrates the gate stacking structure and extends in a first direction, and includes a channel layer connected to the substrate and a ferroelectric layer that surrounds the channel layer; a charge inflow pattern disposed on a lateral side of the ferroelectric layer and spaced apart in the first direction; and an insulation pattern disposed between the charge inflow pattern and the gate electrodes and that surrounds an exterior side, a lower side, and an upper side of the charge inflow pattern.
Inventor(s): Yunseong LEE of Suwon-si KR for samsung electronics co., ltd., Sijung YOO of Suwon-si KR for samsung electronics co., ltd., Seunggeol NAM of Suwon-si KR for samsung electronics co., ltd., Kihong KIM of Suwon-si KR for samsung electronics co., ltd., Yoonsang PARK of Suwon-si KR for samsung electronics co., ltd., Sanghyun JO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B51/30, H10B51/20
CPC Code(s): H10B51/30
Abstract: a semiconductor device, a memory device, and a method of manufacturing the semiconductor device are disclosed. the semiconductor device includes a semiconductor substrate, a ferroelectric layer provided on the semiconductor substrate, an aluminum oxide layer provided on the ferroelectric layer, and a gate electrode provided on the aluminum oxide layer, wherein the aluminum oxide layer includes aluminum, oxygen, and hydrogen, and wherein a content of oxygen in the aluminum oxide layer is more than about 1.5 times and about 2 times or less a content of aluminum in the aluminum oxide layer.
20250142850. INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seyoung Kim of Suwon-si KR for samsung electronics co., ltd., Dahee Kim of Suwon-si KR for samsung electronics co., ltd., Hongseon Song of Suwon-si KR for samsung electronics co., ltd., Wanggon Lee of Suwon-si KR for samsung electronics co., ltd., Sukjin Chung of Suwon-si KR for samsung electronics co., ltd., Beomjong Kim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10D1/716
Abstract: provided is an integrated circuit device including a lower electrode, a dielectric layer on the lower electrode, an upper electrode facing the lower electrode with the dielectric layer therebetween, and an interfacial structure between the dielectric layer and the upper electrode, wherein the interfacial structure includes a first interfacial layer and a second interfacial layer, and a high band gap interfacial layer between the first interfacial layer and the second interfacial layer, wherein a third band gap of the high band gap interfacial layer is greater than a first band gap of the first interfacial layer and is greater than a second band gap of the second interfacial layer.
Inventor(s): Jaehong LEE of Latham NY US for samsung electronics co., ltd., Jintae KIM of Clifton Park NY US for samsung electronics co., ltd., Myung YANG of Niskayuna NY US for samsung electronics co., ltd., Kang-ill SEO of Springfield VA US for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L27/088, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H10D30/6219
Abstract: provided is a semiconductor device which includes a 1source/drain region; and a 1contact structure on a 1portion of the 1source/drain region; and a 2contact structure on a 2portion of the 1source/drain region, wherein at least one of the 1contact structure and the 2contact structure is configured to connect the 1source/drain region to a voltage source or another circuit element for signal routing.
Inventor(s): Changhyun KIM of Suwon-si KR for samsung electronics co., ltd., Kyung-Eun BYUN of Suwon-si KR for samsung electronics co., ltd., Minsu SEOL of Suwon-si KR for samsung electronics co., ltd., Junyoung KWON of Suwon-si KR for samsung electronics co., ltd., Huije RYU of Suwon-si KR for samsung electronics co., ltd., Eunkyu LEE of Suwon-si KR for samsung electronics co., ltd., Yeonchoo CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L27/092, H01L29/10, H01L29/66
CPC Code(s): H10D30/63
Abstract: provided is a semiconductor device including a substrate, a first vertical channel, a spacer, and a second vertical channel. the first vertical channel may have a sheet shape extending in a direction perpendicular to a surface of the substrate. the spacer may be provided at an end of the first vertical channel in an extension direction. the second vertical channel may be aligned with the first vertical channel on the spacer and have a sheet shape extending in a vertical direction.
Inventor(s): Seowoo NAM of Suwon-si KR for samsung electronics co., ltd., Heonjong SHIN of Suwon-si KR for samsung electronics co., ltd., Sunwoo KIM of Suwon-si KR for samsung electronics co., ltd., Sunggyu HAN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L21/768, H01L23/48, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H10D30/6729
Abstract: a semiconductor device may include a base insulation layer, a channel layer on a first surface of the base insulation layer, a first source/drain pattern and a second source/drain pattern spaced apart from each other in a first direction on a first surface of the base insulating layer with the channel layer therebetween, a gate structure on the first surface of the base insulation layer and extending in a second direction crossing the first direction, a lower wire structure on a second surface of the base insulation layer, and a through electrode spaced apart from the gate structure with the first source/drain pattern between the through electrode and the gate structure. the through electrode may penetrate the base insulation layer and electrically connect the first source/drain pattern to the lower wire structure. the first direction may be parallel to the first surface of the base insulation layer.
Inventor(s): Huije RYU of Suwon-si KR for samsung electronics co., ltd., Junyoung KWON of Suwon-si KR for samsung electronics co., ltd., Changhyun KIM of Suwon-si KR for samsung electronics co., ltd., Minsu SEOL of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L21/3115, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H10D30/6757
Abstract: a semiconductor device may include a two-dimensional (2d) material layer extending in a first direction, a source electrode and a drain electrode each electrically connected to the 2d material layer, an insulating layer arranged on the 2d material layer, and a gate electrode arranged apart from the 2d material layer in a second direction perpendicular to the first direction, wherein the insulating layer includes a dopant.
Inventor(s): Kyung-Eun BYUN of Suwon-si KR for samsung electronics co., ltd., Baekwon PARK of Suwon-si KR for samsung electronics co., ltd., Minsu SEOL of Suwon-si KR for samsung electronics co., ltd., Sungil PARK of Hwaseong-si KR for samsung electronics co., ltd., Jaehyun PARK of Hwaseong-si KR for samsung electronics co., ltd., Min seok YOO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/76, H01L21/02, H01L29/06, H01L29/24, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H10D48/362
Abstract: a semiconductor device includes a metal nitride layer, a channel provided in the metal nitride layer and including a two-dimensional (2d) semiconductor material, a source electrode provided on one side of the channel, a drain electrode provided on another side of the channel, a gate insulating layer provided in the channel, and a gate electrode provided on the gate insulating layer.
20250142905. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Duckseoung KANG of Suwon-si KR for samsung electronics co., ltd., Sangdeok KWON of Suwon-si KR for samsung electronics co., ltd., Gibum KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L29/06, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H10D62/151
Abstract: a semiconductor device may include first, second, and third source/drain patterns, semiconductor patterns between the first and third source/drain patterns, a gate dielectric layer in contact with the semiconductor patterns, a gate electrode in contact with the gate dielectric layer, blocking semiconductor patterns between the first and second source/drain patterns, a blocking dielectric layer in contact with the blocking semiconductor patterns, and a blocking electrode in contact with the blocking dielectric layer. the blocking dielectric layer may include a first layer in contact with the first and second source/drain patterns, a second layer in contact with the blocking electrode, and a third layer between the first and second layers. a dielectric material of the third layer may be different than a dielectric material of the first layer and that of the second layer.
20250142906. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SUNGUK JANG of Suwon-si KR for samsung electronics co., ltd., JINBUM KIM of Suwon-si KR for samsung electronics co., ltd., ILYOUNG YOON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H10D62/151
Abstract: a semiconductor device includes a barrier rib separating the source/drain region into a plurality of parts. a first part of the plurality of parts of the source/drain region includes a first epitaxial layer having a lower end disposed on the active pattern and a sidewall part extending from the lower end in a third direction crossing first and second directions and connected to the channel pattern. a second epitaxial layer is disposed on the first epitaxial layer and has a composition different from a composition of the first epitaxial layer. in a cross-section cut from the center of the source/drain region in the first direction to the second and third directions, a lower end of the first epitaxial layer of the first part of the plurality of parts of the source/drain region has an asymmetric shape around an axis extending in the third direction.
Inventor(s): Changhyun KIM of Suwon-si KR for samsung electronics co., ltd., Kyung-Eun BYUN of Suwon-si KR for samsung electronics co., ltd., Minsu SEOL of Suwon-si KR for samsung electronics co., ltd., Junyoung KWON of Suwon-si KR for samsung electronics co., ltd., Huije RYU of Suwon-si KR for samsung electronics co., ltd., Eunkyu LEE of Suwon-si KR for samsung electronics co., ltd., Yeonchoo CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/10, H01L29/06
CPC Code(s): H10D62/314
Abstract: a semiconductor device may include a substrate, a vertical channel, a gate electrode, and a conductive layer. the vertical channel may have a tube shape extending in a direction perpendicular to a surface of the substrate. the gate electrode may face the vertical channel with an outer insulating layer therebetween on an outer circumferential surface of the vertical channel. the conductive layer may face the vertical channel with an inner insulating layer therebetween on an inner circumferential surface of the vertical channel.
Inventor(s): Hyungki CHO of Suwon-si KR for samsung electronics co., ltd., Seongjae BYEON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/10, H01L23/31, H01L23/522, H01L27/06, H01L29/24
CPC Code(s): H10D62/314
Abstract: a semiconductor device includes: a mold insulating pattern positioned on a substrate; an upper conductive line extending in a first horizontal direction on the substrate; a channel structure including a vertical channel portion that faces a side surface of the upper conductive line, and is in contact with a first side wall of the mold insulating pattern, wherein the vertical channel portion extends in a vertical direction; a first gate dielectric layer at least partially surround a surface of the channel structure; and a second gate dielectric layer positioned between the upper conductive line and the first gate dielectric layer on the channel structure, wherein the mold insulating pattern includes a body and protrusion, wherein the body extends in the first horizontal direction, and the protrusion protrude in a second horizontal direction that intersects with the first horizontal direction.
20250142929. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyungbin CHUN of Suwon-si KR for samsung electronics co., ltd., Gyeom KIM of Suwon-si KR for samsung electronics co., ltd., Ryong HA of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L29/10, H01L29/167, H01L29/66
CPC Code(s): H10D64/256
Abstract: a semiconductor device includes a substrate; an active pattern on the substrate; a plurality of channel layers stacked on the active pattern to be spaced apart from each other; a gate structure surrounding the plurality of channel layers; source/drain patterns including a first epitaxial layer disposed along side surfaces of the plurality of channel layers on a portion of the active pattern and a second epitaxial layer disposed on the first epitaxial layer and having a trench; contact structures disposed on the source/drain patterns, respectively, and including a first extension portion filling the trench, and a pair of second extension portions extending along both side surfaces of the source/drain patterns in the second direction, respectively; and a metal-semiconductor compound layer disposed between the source/drain patterns and the contact structures.
20250142931. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyun-Kwan YU of Suwon-si KR for samsung electronics co., ltd., Hyun Woo PARK of Suwon-si KR for samsung electronics co., ltd., Sun Young LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H10D64/258
Abstract: a semiconductor device is provided. the semiconductor device includes a substrate, an active pattern extending in a first horizontal direction on the substrate, a plurality of nanosheets stacked to be spaced apart from each other in a vertical direction on the active pattern, a gate electrode extending in a second horizontal direction different from the first horizontal direction on the active pattern, the gate electrode surrounding the plurality of nanosheets, a source/drain region disposed on at least one side of the gate electrode on the active pattern, a first inner spacer disposed between the source/drain region and the gate electrode between the plurality of nanosheets, the first inner spacer being in contact with the source/drain region, and a second inner spacer disposed between the first inner spacer and the gate electrode between the plurality of nanosheets, the second inner spacer including a material different from a material of the first inner spacer, each of an upper surface and a lower surface of the second inner spacer being in contact with the first inner spacer.
Inventor(s): Yunseong LEE of Osan-si KR for samsung electronics co., ltd., Jinseong HEO of Seoul KR for samsung electronics co., ltd., Taehwan MOON of Suwon-si KR for samsung electronics co., ltd., Seunggeol NAM of Suwon-si KR for samsung electronics co., ltd., Dukhyun CHOE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10D64/68, H10B51/00, H10B53/00
CPC Code(s): H10D64/689
Abstract: a layer structure including a dielectric layer, a method of manufacturing the layer structure, and an electronic device including the layer structure are disclosed. the layer structure including a lower layer, a dielectric layer, and an upper layer sequentially stacked. the dielectric layer includes sequentially stacked first, second, and third layers, wherein one of the first layer or the third layer is a ferroelectric, the other one is an anti-ferroelectric, and the second layer is an oxide layer. in one example, the dielectric layer may further include a fourth layer on the third layer.
Inventor(s): Sora YOU of Suwon-si KR for samsung electronics co., ltd., Dongyun LEE of Suwon-si KR for samsung electronics co., ltd., Seungmin CHA of Suwon-si KR for samsung electronics co., ltd., Jeewoong KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/06, H01L23/528, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/861
CPC Code(s): H10D84/811
Abstract: a semiconductor device may include a diode pattern including a first conductive region and a second conductive region having opposite conductivity types to each other on a base insulating layer, an insulating layer covering the diode pattern on the base insulating layer, a wiring portion on the insulating layer; and a through connector extending through the insulating layer at a periphery of the diode pattern to electrically connect the diode pattern and the wiring portion.
Inventor(s): Jinhyeok SONG of Incheon KR for samsung electronics co., ltd., Mingeun SONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10D84/83, H01L23/544, H01L23/66
CPC Code(s): H10D84/83
Abstract: an integrated circuit device including an active region; an active cutting region at a side of the active region in a first direction; a fin active pattern extending on the active region in the first direction, the fin active pattern including a source region and a drain region; a gate pattern extending across the active region and the fin active pattern in a second direction perpendicular to the first direction, the gate pattern not being in the active cutting region; and an isolated gate contact region in contact with the gate pattern outside of the active region.
Inventor(s): Haegeon JUNG of Suwon-si KR for samsung electronics co., ltd., Dongkwon Kim of Suwon-si KR for samsung electronics co., ltd., Myeongji Kim of Suwon-si KR for samsung electronics co., ltd., Sangduk Park of Suwon-si KR for samsung electronics co., ltd., Keunhee Bai of Suwon-si KR for samsung electronics co., ltd., Gahyun Lim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/8238, H01L23/528, H01L25/18, H01L29/06, H01L29/08, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H10D84/85
Abstract: a method of manufacturing an integrated circuit device is provided. the method includes: providing a substrate including a base substrate layer, an insulating substrate layer, and a cover substrate layer that are sequentially stacked in a vertical direction; forming, on the substrate, a stacked structure including a plurality of sacrificial semiconductor layers and a plurality of nanosheet semiconductor layers that are alternately stacked one layer at a time; and forming a plurality of trench regions to define a plurality of fin-type active regions by etching the stacked structure and the substrate. the he forming of the plurality of trench regions includes, by using the insulating substrate layer as an etch stop layer, etching portions of the stacked structure and the cover substrate layer in the vertical direction up to an upper surface of the insulating substrate layer.
Inventor(s): Jisoo Park of Suwon-si KR for samsung electronics co., ltd., JUNG HAN LEE of Suwon-si KR for samsung electronics co., ltd., KWANYOUNG CHUN of Suwon-si KR for samsung electronics co., ltd., Kwangmuk LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/822, H01L21/8238, H01L23/528, H01L29/06, H01L29/417, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H10D84/856
Abstract: disclosed is a three-dimensional semiconductor device comprising a substrate including first and second regions, a first active section on the first region and including a first lower channel pattern and a first lower source/drain pattern, a second active section on the first active section and including a first upper channel pattern and a first upper source/drain pattern, a third active section on the second region and including a second lower channel pattern and a second lower source/drain pattern, a fourth active section on the third active section and including a second upper channel pattern and a second upper source/drain pattern, and a gate electrode on the first and second lower channel patterns and the first and second upper channel patterns. a first width in a first direction of the first lower channel pattern is greater than a second width in the first direction of the second lower channel pattern.
Inventor(s): LUHING HU of Suwon-si KR for samsung electronics co., ltd., Sangwon KIM of Suwon-si KR for samsung electronics co., ltd., Joonseok Kim of Suwon-si KR for samsung electronics co., ltd., Joonyun Kim of Suwon-si KR for samsung electronics co., ltd., JUNHEE CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/12, H01L25/065, H01L27/15
CPC Code(s): H10D86/60
Abstract: a display panel includes a substrate, a gate electrode disposed on the substrate, a two-dimensional semiconductor material layer overlapping the gate electrode, a source electrode and a drain electrode electrically connected to the two-dimensional semiconductor material layer, a first electrode of a micro light-emitting diode electrically connected to the drain electrode, an active layer electrically connected to the first electrode of the micro light-emitting diode, where the active layer includes a quantum well layer surrounded by an ion-doped insulating partition, and a second electrode of the micro light-emitting diode electrically connected to the active layer.
Inventor(s): Juhyeon BAEK of Suwon-si KR for samsung electronics co., ltd., Dongchan Kim of Suwon-si KR for samsung electronics co., ltd., Beomsuk Lee of Suwon-si KR for samsung electronics co., ltd., Byoungho Kwon of Suwon-si KR for samsung electronics co., ltd., Changkyu Lee of Suwon-si KR for samsung electronics co., ltd., Hwiyoung Jeon of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H10F39/8057
Abstract: an image sensor includes unit pixels respectively including photodiodes in a substrate having frontside and backside surfaces, a sensor array area including at least one isolation structure configured to isolate the unit pixels from each other and vertically penetrating the substrate, and a capacitor area arranged adjacent to the sensor array area in a horizontal direction parallel to the backside surface of the substrate and including at least one capacitor on the frontside surface of the substrate and at least one dummy isolation structure located adjacent to the at least one capacitor to vertically penetrate the substrate, wherein one end surface of each of the at least one capacitor and the at least one dummy isolation structure is coplanar with the backside surface of the substrate, and the at least one isolation structure and the at least one dummy isolation structure include a same material.
20250142995. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Tae Han KIM of Hwaseong-si KR for samsung electronics co., ltd., Dong Min KEUM of Daegu KR for samsung electronics co., ltd., Bum Suk KIM of Hwaseong-si KR for samsung electronics co., ltd., Yun Ki LEE of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): H10F39/00, H04N25/704, H10F39/18
CPC Code(s): H10F39/8063
Abstract: an image sensor includes different first and second focus pixels in a substrate; a first adjacent pixel in the substrate and adjacent to the first focus pixel in a positive first direction, a pixel being absent between the first focus pixel and the first adjacent pixel; a first micro-lens covering the first adjacent pixel; a second adjacent pixel in the substrate and adjacent to the second focus pixel in a positive first direction, a pixel being absent between the second focus pixel and the second adjacent pixel; and a second micro-lens covering the second adjacent pixel, and an area of the first micro-lens being different from an area of the second micro-lens.
20250142996. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Inyong Park of Seongnam-si KR for samsung electronics co., ltd., Minkwan Kim of Hwaseong-si KR for samsung electronics co., ltd., In Sung Joe of Seoul KR for samsung electronics co., ltd., Jinhyung Kim of Hwaseong-si KR for samsung electronics co., ltd., Dhami Park of Suwon-si KR for samsung electronics co., ltd., Kisang Yoon of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10F39/00, H01L23/00, H01L25/065, H04N23/10, H04N23/55, H04N23/67, H04N25/11, H04N25/79, H10F39/18
CPC Code(s): H10F39/8063
Abstract: an image sensor includes a first substrate including a focus pixel region and pixel regions around the focus pixel region, each of the focus pixel region and the pixel regions including at least one photoelectric conversion region, color filters provided on the focus pixel region and the pixel regions, respectively, and on a first surface of the first substrate, and micro lenses provided on the color filters, respectively. the micro lenses include an auto-focus lens on the focus pixel region, a first micro lens adjacent to the auto-focus lens, and a standard micro lens spaced apart from the auto-focus lens.
20250142998. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taemin KIM of Suwon-si KR for samsung electronics co., ltd., Jungsan KIM of Suwon-si KR for samsung electronics co., ltd., Yongsoon PARK of Suwon-si KR for samsung electronics co., ltd., Seungho LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H10F39/807
Abstract: an image sensor includes a substrate including adjacent first and second pixel regions; a photoelectric converter at the substrate; and a pixel isolation portion separating the first and second pixel regions based on penetrating at least a part of the substrate between the first and second pixel regions. the pixel isolation portion includes first and second insulation portions respectively adjacent to the first and second pixel regions, and a conductive layer and an inner layer between the first and second insulation portions and including different materials. the pixel isolation portion includes a first portion including a portion where the conductive layer occupies a space between the first and second insulation portions in an intersection direction that intersects an extension direction of the pixel isolation portion, and a second portion including the conductive layer and the inner layer between the first and second insulation portions in the intersection direction.
20250143002. IMAGE SENSOR MODULE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyungsung CHU of Suwon-si KR for samsung electronics co., ltd., In-Sang SONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H10F39/811
Abstract: an image sensor module according to some example embodiments includes a reinforcement plate; a substrate on the reinforcement plate and defining a cavity; an image sensor chip in the cavity and configured to convert externally collected light to an electrical signal; an adhesive member along an upper edge of the image sensor chip; an optic filter on the adhesive member and defining an open region extending into a center of the optic filter, the optic filter covering an upper surface of the image sensor chip; and a bonding wire of which a first end is connected with the image sensor chip through the adhesive member and a second end is connected with the substrate.
Inventor(s): Jenghun SUH of Suwon-si KR for samsung electronics co., ltd., Kihyung Kang of Suwon-si KR for samsung electronics co., ltd., Jihoon Kang of Suwon-si KR for samsung electronics co., ltd., Sungjun Koh of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L33/50, H01L25/16, H01L33/16
CPC Code(s): H10H20/8514
Abstract: a display apparatus includes: an active layer; a first semiconductor layer positioned on a first side of the active layer; a second semiconductor layer positioned on a second side of the active layer. the first semiconductor layer may include: a plurality of semiconductor regions each comprising a plurality of semiconductors; and a plurality of separation regions between the plurality of semiconductor regions. the second semiconductor layer may include: a plurality of first pores disposed as to correspond to the plurality of semiconductor regions; a plurality of second pores disposed as to correspond to the plurality of separation regions; a plurality of color conversion portions positioned in the plurality of first pores and configured to convert light generated from the active layer into lights of different colors; and a plurality of blocking portions positioned in the plurality of second pores and configured to prevent interference between the different colored lights.
Samsung Electronics Co., Ltd. patent applications on May 1st, 2025
- Samsung Electronics Co., Ltd.
- A47J36/32
- G06V10/764
- G06V20/68
- CPC A47J36/32
- Samsung electronics co., ltd.
- A47L9/28
- A47L9/04
- A47L9/24
- CPC A47L9/2821
- A47L11/40
- CPC A47L11/4091
- A61H3/00
- B25J9/00
- G01S17/08
- G01S17/88
- CPC A61H3/00
- A63B24/00
- A63B23/00
- A63B71/06
- CPC A63B24/0006
- B01D46/00
- A61L2/10
- B01D46/42
- B01D46/52
- F24F8/108
- F24F12/00
- CPC B01D46/0028
- B01J38/12
- B01D53/88
- CPC B01J38/12
- B23Q3/08
- B23Q3/06
- CPC B23Q3/084
- B24B37/27
- B24B37/015
- CPC B24B37/27
- B24B49/02
- CPC B24B49/02
- B65G1/04
- CPC B65G1/0464
- B66F11/04
- B66F17/00
- CPC B66F11/042
- B67D1/12
- B67D1/00
- F25D23/12
- CPC B67D1/124
- C08K11/00
- CPC C08K11/005
- C23C16/455
- C23C16/40
- C23C16/44
- H01L27/06
- H10B12/00
- CPC C23C16/45531
- C23C16/458
- C23C16/56
- CPC C23C16/458
- C23C16/48
- CPC C23C16/482
- D06F33/42
- D06F33/34
- D06F33/43
- D06F33/44
- D06F34/30
- D06F34/32
- D06F37/06
- D06F101/20
- D06F103/38
- D06F105/02
- D06F105/08
- CPC D06F33/42
- D06F34/16
- D06F23/02
- D06F23/04
- D06F33/40
- D06F33/48
- D06F34/04
- D06F34/28
- D06F37/22
- D06F37/24
- D06F103/24
- D06F103/26
- D06F103/46
- D06F105/58
- D06F105/62
- G01C19/56
- CPC D06F34/16
- D06F37/26
- CPC D06F37/24
- D06F37/30
- D06F23/06
- D06F105/48
- H02P1/16
- CPC D06F37/304
- F16M11/04
- G09F9/30
- CPC F16M11/041
- F24C7/08
- H05B6/68
- CPC F24C7/087
- F24F11/43
- F25B41/31
- F25B47/02
- F25B49/02
- CPC F24F11/43
- F24F11/86
- F24F11/52
- F24F11/84
- CPC F24F11/86
- F25B21/02
- F25D11/02
- F25D19/00
- F25D23/06
- CPC F25B21/02
- F25D25/02
- A47B88/477
- CPC F25D25/025
- G01C21/16
- G01J1/42
- G06F3/01
- G06T7/70
- CPC G01C21/1652
- G01C21/00
- G06T7/521
- G06T7/73
- G06T11/00
- G06V20/58
- G06V20/70
- CPC G01C21/3811
- G01R1/04
- G01R31/28
- CPC G01R1/0408
- G01R31/317
- G01R1/073
- CPC G01R31/31721
- G01R31/367
- G01R31/3828
- H02J7/00
- CPC G01R31/367
- G01R31/66
- C12M1/34
- H01L27/092
- CPC G01R31/66
- G01S19/34
- G01S19/40
- G01S19/49
- CPC G01S19/34
- G02B1/00
- H04N23/55
- CPC G02B1/002
- G02B27/01
- G06F1/16
- G06F1/20
- H05K7/20
- CPC G02B27/0176
- G03F7/004
- G03F7/20
- G03F7/32
- CPC G03F7/0043
- G03F7/039
- CPC G03F7/039
- G03F7/00
- CPC G03F7/70125
- CPC G03F7/70516
- G03F1/48
- G03F1/54
- G03F1/74
- CPC G03F7/70741
- CPC G03F7/70875
- G09G3/00
- CPC G06F1/1618
- H05K7/14
- CPC G06F1/1641
- E05D3/12
- E05D11/10
- F16C11/04
- CPC G06F1/1681
- G06F1/30
- G06F1/26
- CPC G06F1/30
- G06F3/043
- G06F3/041
- CPC G06F3/0436
- G06F3/04842
- G06F21/30
- CPC G06F3/04842
- G06F3/04883
- CPC G06F3/04883
- G06F3/06
- CPC G06F3/061
- CPC G06F3/0619
- G06F9/54
- CPC G06F3/0644
- CPC G06F3/0655
- G06F3/14
- G02B27/09
- CPC G06F3/14
- G06F8/41
- CPC G06F8/41
- G06F9/4401
- CPC G06F9/4411
- G06F9/50
- G06F11/34
- CPC G06F9/5022
- CPC G06F9/546
- G06F11/10
- CPC G06F11/1016
- G06F21/79
- G06F11/30
- G06F21/60
- CPC G06F11/3034
- G06F12/02
- G06F13/16
- CPC G06F12/0246
- G06F12/1045
- CPC G06F12/0292
- G06F12/0806
- CPC G06F12/0806
- G06F12/0808
- G06F11/07
- G06F12/0864
- CPC G06F12/0808
- G06F12/084
- G06F12/0891
- CPC G06F12/084
- CPC G06F12/0891
- G06F16/25
- CPC G06F16/254
- G06F17/16
- CPC G06F17/16
- G06F5/01
- H03M7/24
- G06F21/32
- G06F21/44
- G06V40/12
- G06V40/13
- CPC G06F21/32
- G06F40/274
- G06F40/163
- G06F40/268
- G06F40/279
- CPC G06F40/274
- G06N3/0495
- CPC G06N3/0495
- G06N3/08
- G06F13/28
- G06F15/173
- G06N3/10
- CPC G06N3/08
- G06T5/60
- G06T5/20
- G06T5/70
- G06T7/215
- G06T7/246
- G06V10/762
- G06V10/77
- G06V10/82
- CPC G06T5/60
- G06T7/00
- CPC G06T7/0002
- G01N21/95
- CPC G06T7/0004
- H01L21/66
- CPC G06T7/001
- G06V10/774
- G06T5/50
- G06T5/77
- G06V10/26
- CPC G06V10/774
- G06V20/10
- A61H1/02
- G01B7/30
- G01D5/14
- G06T7/50
- G06V10/25
- G06V10/74
- G06V40/10
- CPC G06V20/10
- G06V20/40
- CPC G06V20/49
- CPC G09G3/035
- G09G3/32
- CPC G09G3/32
- G11C11/4099
- G11C5/10
- G11C11/4093
- CPC G11C11/4099
- G11C16/04
- H01L25/065
- H10B41/10
- H10B41/27
- H10B41/35
- H10B41/41
- H10B43/10
- H10B43/27
- H10B43/35
- H10B43/40
- H10B80/00
- CPC G11C16/0483
- G11C29/12
- H01L23/00
- H01L25/18
- CPC G11C29/1201
- H01H36/00
- H04M1/02
- CPC H01H36/004
- H01J37/02
- H01J37/305
- CPC H01J37/026
- H01J37/32
- H01L21/3065
- H01L21/67
- CPC H01J37/32834
- H01L21/033
- G03F7/16
- H01L21/308
- H01L21/311
- H01L21/3213
- CPC H01L21/0337
- H01L21/22
- H01L21/225
- CPC H01L21/2225
- H01L21/3115
- H01L21/02
- CPC H01L21/31155
- H01L21/683
- CPC H01L21/67051
- H01L21/677
- H01L21/68
- CPC H01L21/67709
- H01L21/687
- CPC H01L21/68742
- H01L23/14
- H01L23/31
- H01L23/498
- CPC H01L23/145
- CPC H01L23/49822
- H01L21/48
- H01L21/56
- CPC H01L23/49838
- H01L25/10
- H01L23/522
- H01L23/13
- H01L23/367
- H01L25/11
- H01L25/16
- CPC H01L23/5223
- H01L23/528
- H01L21/768
- H01L21/8234
- H01L27/088
- H01L29/06
- H01L29/08
- CPC H01L23/5286
- H01L23/48
- H01L23/538
- CPC H01L23/5386
- CPC H01L23/5389
- H01L23/544
- CPC H01L23/544
- H01L29/423
- H01L29/775
- H01L29/786
- CPC H01L24/05
- CPC H01L24/06
- CPC H01L24/14
- H01L23/49
- CPC H01L24/20
- G11C11/4091
- CPC H01L25/0657
- CPC H01L25/18
- H01M10/0562
- H01M10/0525
- CPC H01M10/0562
- H01M50/431
- C01D15/00
- C01D17/00
- H02J50/10
- CPC H02J50/10
- H02J50/12
- H02J50/80
- CPC H02J50/12
- H03K17/687
- CPC H03K17/6872
- H04B1/04
- H04B1/00
- CPC H04B1/0458
- H04B1/525
- H04B1/12
- CPC H04B1/525
- H04B7/06
- H04L5/00
- H04W24/10
- CPC H04B7/0626
- H04J14/02
- H04J14/06
- CPC H04J14/0307
- H04L1/1812
- H04W72/232
- H04W72/30
- CPC H04L1/1812
- CPC H04L5/0051
- H04W72/0446
- H04W72/23
- CPC H04L5/0055
- H04L12/28
- CPC H04L12/2816
- H04L41/08
- CPC H04L41/08
- H04L41/50
- CPC H04L41/5032
- H04L51/56
- H04L51/216
- H04L51/58
- H04W4/14
- CPC H04L51/56
- H04L65/1089
- H04L65/1016
- H04L65/1104
- CPC H04L65/1089
- H04L67/51
- H04B5/00
- CPC H04L67/51
- H04M1/72415
- H04M1/72469
- CPC H04M1/72415
- H04N9/31
- CPC H04N9/3182
- CPC H04N9/3185
- CPC H04N9/3188
- CPC H04N9/3194
- H04N17/00
- CPC H04N17/002
- H04N19/159
- H04N19/105
- H04N19/176
- H04N19/184
- H04N19/513
- CPC H04N19/159
- H04N19/46
- G06Q10/0631
- G06Q10/0637
- G06Q10/0639
- H04N19/117
- H04N19/18
- H04N19/186
- H04N19/61
- H04N19/82
- CPC H04N19/46
- H04N21/4402
- H04N21/44
- H04N21/466
- CPC H04N21/440272
- H04N23/61
- H04N23/63
- H04N23/69
- H04N23/71
- H04N23/73
- CPC H04N23/61
- H04N25/79
- H01L27/146
- CPC H04N25/79
- H04R1/02
- H04R9/02
- CPC H04R1/02
- H04W4/06
- H04W28/02
- H04W76/12
- H04W76/40
- CPC H04W4/06
- H04W4/50
- CPC H04W4/50
- H04W4/90
- H04W4/12
- H04W60/04
- H04W84/04
- CPC H04W4/90
- H04W8/00
- H04W84/12
- CPC H04W8/005
- H04W8/22
- H04L47/36
- CPC H04W8/22
- H04W12/06
- CPC H04W12/06
- H04W24/04
- H04W28/086
- CPC H04W24/04
- CPC H04W28/0278
- H04W36/06
- H04W72/25
- CPC H04W36/06
- H04W36/24
- H04W36/00
- CPC H04W36/24
- H04W48/04
- H04L1/1822
- H04W24/08
- H04W72/20
- CPC H04W48/04
- H04W48/08
- H04W48/16
- CPC H04W48/08
- H04W48/20
- CPC H04W48/20
- H04W52/02
- CPC H04W52/0229
- H04W56/00
- H04W68/02
- CPC H04W56/0015
- H04W4/02
- CPC H04W60/04
- H04W64/00
- G01S5/00
- G01S5/02
- G01S5/10
- CPC H04W64/00
- CPC H04W64/006
- CPC H04W68/02
- H04W72/0453
- CPC H04W72/0453
- H04W72/1263
- H04L27/26
- H04W92/18
- CPC H04W72/1263
- H04W72/1273
- H04L1/00
- H04W72/044
- CPC H04W72/1273
- H04W72/21
- H04L1/1829
- CPC H04W72/21
- H04W4/44
- CPC H04W72/25
- H04W8/18
- CPC H04W72/30
- H04W76/14
- H04W4/80
- H04W12/0433
- CPC H04W76/14
- H04W76/28
- H04W76/38
- CPC H04W76/28
- H05B6/54
- H05B6/62
- CPC H05B6/54
- H05B6/64
- H05B6/66
- CPC H05B6/6455
- H05K5/00
- H01Q1/22
- H05K5/02
- H05K5/03
- H05K9/00
- CPC H05K5/0017
- CPC H05K5/0217
- CPC H05K5/0226
- CPC H05K5/03
- CPC H10B12/30
- CPC H10B12/34
- CPC H10B12/482
- CPC H10B12/485
- H01L29/51
- CPC H10B12/50
- CPC H10B43/27
- G11C5/06
- G11C16/10
- G11C16/26
- CPC H10B43/40
- H10B51/30
- H10B51/20
- CPC H10B51/30
- CPC H10D1/716
- H01L29/417
- CPC H10D30/6219
- H01L29/78
- H01L29/10
- H01L29/66
- CPC H10D30/63
- CPC H10D30/6729
- CPC H10D30/6757
- H01L29/76
- H01L29/24
- CPC H10D48/362
- CPC H10D62/151
- CPC H10D62/314
- H01L29/167
- CPC H10D64/256
- CPC H10D64/258
- H10D64/68
- H10B51/00
- H10B53/00
- CPC H10D64/689
- H01L29/861
- CPC H10D84/811
- H10D84/83
- H01L23/66
- CPC H10D84/83
- H01L21/8238
- CPC H10D84/85
- H01L21/822
- CPC H10D84/856
- H01L27/12
- H01L27/15
- CPC H10D86/60
- CPC H10F39/8057
- H10F39/00
- H04N25/704
- H10F39/18
- CPC H10F39/8063
- H04N23/10
- H04N23/67
- H04N25/11
- CPC H10F39/807
- CPC H10F39/811
- H01L33/50
- H01L33/16
- CPC H10H20/8514