18181077. SEMICONDUCTOR CHAMBER COMPONENTS WITH ADVANCED COATING TECHNIQUES simplified abstract (Applied Materials, Inc.)
SEMICONDUCTOR CHAMBER COMPONENTS WITH ADVANCED COATING TECHNIQUES
Organization Name
Inventor(s)
Laksheswar Kalita of Milpitas CA (US)
Joseph Behnke of San Jose CA (US)
Ryan Pakulski of Brentwood CA (US)
Christopher L. Beaudry of San Jose CA (US)
Jonathan Strahle of San Francisco CA (US)
SEMICONDUCTOR CHAMBER COMPONENTS WITH ADVANCED COATING TECHNIQUES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18181077 titled 'SEMICONDUCTOR CHAMBER COMPONENTS WITH ADVANCED COATING TECHNIQUES
The present technology pertains to semiconductor processing systems and methods, involving various chamber components such as a pedestal, a lid stack, a faceplate, electrode, and a showerhead. The faceplate is supported by the lid stack and has multiple first apertures, while the showerhead is positioned between the faceplate and the pedestal with several second apertures. These components may include coatings of yttrium fluoride, yttrium oxyfluoride, or a combination of both with a thickness exceeding 10 μm.
- Chamber components in semiconductor processing systems may have coatings of yttrium fluoride, yttrium oxyfluoride, or a combination of both.
- The coatings are applied to the faceplate, showerhead, lid stack, pedestal, or a combination thereof.
- The coatings have a thickness greater than 10 μm.
- The faceplate is supported by the lid stack and contains multiple first apertures.
- The showerhead is positioned between the faceplate and the pedestal and has several second apertures.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Plasma etching applications
Problems Solved: - Enhanced durability of chamber components - Improved process efficiency - Reduced maintenance requirements
Benefits: - Prolonged lifespan of semiconductor processing systems - Higher quality output - Cost savings due to reduced downtime and maintenance costs
Commercial Applications: Title: Enhanced Semiconductor Processing Systems with Yttrium Coatings This technology can be utilized in semiconductor fabrication facilities to improve the performance and longevity of processing systems. It can also be attractive to companies involved in thin film deposition and plasma etching processes.
Prior Art: Researchers can explore prior studies on yttrium coatings in semiconductor processing equipment to understand the evolution of this technology and potential areas for further innovation.
Frequently Updated Research: Researchers are continuously exploring new materials and coatings to enhance the efficiency and durability of semiconductor processing systems. Stay updated on the latest advancements in yttrium-based coatings for semiconductor applications.
Questions about Semiconductor Processing Systems with Yttrium Coatings: 1. How do yttrium coatings improve the performance of semiconductor processing systems? Yttrium coatings enhance the durability and efficiency of chamber components, leading to improved process outcomes and reduced maintenance needs.
2. What are the potential drawbacks of using yttrium coatings in semiconductor processing systems? While yttrium coatings offer numerous benefits, potential drawbacks may include cost implications and compatibility issues with certain processes or materials.
Original Abstract Submitted
The present technology is generally directed to semiconductor processing systems and methods. Systems and methods include a chamber having a plurality of chamber components, such as a pedestal, a lid stack, a faceplate, electrode, and a showerhead. The faceplate is supported with the lid stack and defines a plurality of first apertures and the showerhead is positioned between the faceplate and the pedestal and defines a plurality of second apertures. In systems and methods, the faceplate, the showerhead, the lid stack, the pedestal, or a combination thereof include an yttrium fluoride, yttrium oxyfluoride, or both yttrium fluoroide and yttrium oxyfluoride coating having a thickness of greater than 10 μm on at least a portion of the respective chamber component or combination thereof.
