SUBSTRATE PROCESSING APPARATUS

Organization Name

samsung electronics co., ltd.

Inventor(s)

Junho Im of Suwon-si KR

Younseon Wang of Suwon-si KR

Keonwoo Kim of Suwon-si KR

Youngjin Noh of Suwon-si KR

Dougyong Sung of Suwon-si KR

Wonhee Lee of Suwon-si KR

Sungwook Jung of Suwon-si KR

SUBSTRATE PROCESSING APPARATUS

This abstract first appeared for US patent application 20250149311 titled 'SUBSTRATE PROCESSING APPARATUS

Original Abstract Submitted

a substrate processing apparatus may include a chucking member configured to support a substrate, a base plate configured to support the chucking member, a bonding layer located between the chucking member and the base plate, the bonding layer configured to adhere the chucking member to the base plate, a coating layer on an outer side surface of the bonding layer, and a bonding protective member surrounding an outer side surface of the coating layer, wherein the coating layer conformally covers the outer side surface of the bonding layer.