18523394. SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION simplified abstract (Applied Materials, Inc.)

SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION

Organization Name

Applied Materials, Inc.

Inventor(s)

Michael Robert Rice of Pleasanton CA (US)

Joseph Aubuchon of San Jose CA (US)

Sanjeev Baluja of Campbell CA (US)

Mandyam Sriram of San Jose CA (US)

SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18523394 titled 'SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION

Simplified Explanation

The patent application describes apparatus and methods to process one or more wafers using a circular configuration of process stations around a rotational axis. A support assembly with a rotatable center base, support arms, and heaters is used to move the heaters among the process stations to perform various process conditions.

• The apparatus includes a support assembly with a rotatable center base and support arms.
• Heaters are positioned on each support arm to perform process conditions.
• The process stations are arranged in a circular configuration around a rotational axis.
• The heaters can be moved among the process stations to process one or more wafers.

Potential Applications

This technology could be applied in semiconductor manufacturing, solar cell production, and other industries requiring precise wafer processing.

Problems Solved

This technology solves the problem of efficiently processing multiple wafers by moving heaters among process stations in a circular configuration.

Benefits

The benefits of this technology include increased efficiency, improved process control, and reduced processing time for wafers.

Potential Commercial Applications

Potential commercial applications of this technology include semiconductor fabrication facilities, solar panel manufacturing plants, and other industries requiring high-precision wafer processing.

Possible Prior Art

One possible prior art could be similar wafer processing systems with rotating support assemblies, although the specific configuration and movement of heaters among process stations may be unique to this patent application.

How does this technology compare to traditional linear wafer processing systems?

This article does not provide a direct comparison between this circular configuration system and traditional linear wafer processing systems.

What are the potential limitations of using a circular configuration for wafer processing?

The article does not address any potential limitations or challenges that may arise from using a circular configuration for wafer processing.

Original Abstract Submitted

Apparatus and methods to process one or more wafers are described. A plurality of process stations are arranged in a circular configuration around a rotational axis. A support assembly with a rotatable center base defining a rotational axis, at least two support arms extending from the center base and heaters on each of the support arms is positioned adjacent the processing stations so that the heaters can be moved amongst the various process stations to perform one or more process condition.