Taiwan Semiconductor Manufacturing Company, Ltd. patent applications published on December 28th, 2023

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Summary of the patent applications from Taiwan Semiconductor Manufacturing Company, Ltd. on December 28th, 2023

Taiwan Semiconductor Manufacturing Company, Ltd. has recently filed several patents related to various semiconductor devices and technologies. These patents cover a range of applications, including phase change devices, memory devices, and analog-to-digital converters. The company aims to address challenges in heat transfer, thermal management, memory storage, and data processing, while also improving device performance and reliability.

In terms of phase change devices, the company has developed a device with a substrate and a heater structure, along with a phase change element consisting of three connected portions. This device offers efficient heat transfer, improved thermal management, and enhanced cooling capabilities. It has potential applications in thermal management systems, heat transfer devices, and cooling systems.

For memory devices, the company has introduced innovative designs and materials to enhance performance and reliability. These memory devices include resistance variable storage devices, selectors, and ferroelectric or antiferroelectric layers. They offer higher data storage density, faster read and write speeds, lower power consumption, and improved durability. Potential applications include computer memory systems, data storage devices, solid-state drives (SSDs), and Internet of Things (IoT) devices.

In the field of analog-to-digital converters, the company has developed systems and methods to improve accuracy and noise cancellation capabilities. These ADCs consist of multiple quantization stages and noise cancellation filters, resulting in higher precision, reduced noise, and improved signal-to-noise ratio. They can be applied in high-precision measurement devices, audio and video recording equipment, and communication systems.

Overall, Taiwan Semiconductor Manufacturing Company, Ltd. is focused on advancing semiconductor technologies to address various challenges and improve the performance and reliability of electronic devices. Their recent patents demonstrate their commitment to innovation and their efforts to meet the evolving needs of the industry.

Summary of notable applications:

  • Thermal management systems
  • Heat transfer devices
  • Cooling systems
  • Data storage systems
  • Non-volatile memory
  • High-density memory
  • Logic circuits
  • Neuromorphic computing
  • Computer memory systems
  • Solid-state drives (SSDs)
  • Internet of Things (IoT) devices
  • Wearable technology
  • Embedded systems
  • Automotive electronics
  • Integrated circuits
  • Memory devices for electronic devices
  • Non-volatile memory for data storage
  • High-density memory for increased storage capacity
  • Memory storage in electronic devices
  • Efficient memory storage
  • Memory devices with improved performance and reliability
  • Memory devices with increased storage capacity
  • Compact memory storage
  • Improved semiconductor assembly connections
  • Circuit boards with optimized layout for efficient soldering
  • Efficient and reliable connection between semiconductor assembly and circuit board
  • Improved performance and reliability of electric devices
  • Improved memory cell design
  • Enhanced performance and reliability of memory devices
  • Increased data storage capacity
  • Reduced power consumption
  • Enhanced memory capabilities
  • Improved stability and reliability in memory operations
  • Compact and cost-effective memory storage
  • Improved accuracy and noise cancellation capabilities in analog-to-digital conversion
  • Enhanced performance and reliability of semiconductor devices
  • Increased data processing speed
  • Improved memory storage capabilities
  • Enhanced functionality of electronic devices
  • Improved performance and reliability of D flip-flops
  • Efficient use of transistors with different threshold voltages
  • Enhanced functionality and flexibility in circuit design
  • Higher speed and lower power consumption in semiconductor devices
  • Improved stability and robustness of D flip-flops
  • Simplified circuit design and layout.



Contents

Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on December 28th, 2023

WET CLEANING TOOL AND METHOD (17847208)

Main Inventor

Hsu. Tung. Yen


RAIL SYSTEM FOR WAFER TRANSPORTATION (17849038)

Main Inventor

Guancyun Li


Photonic Package and Method of Manufacture (17809122)

Main Inventor

Tsung-Fu Tsai


LIGHT DEFLECTION STRUCTURE TO INCREASE OPTICAL COUPLING (18149325)

Main Inventor

Chih-Wei Tseng


METHOD OF MANUFACTURING PHOTO MASKS AND SEMICONDUCTOR DEVICES (18103289)

Main Inventor

Wen-Hao CHENG


METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING TOOL (18107427)

Main Inventor

Hui-Chun LEE


DATA COMPUTATION CIRCUIT AND METHOD (18157252)

Main Inventor

Chia-Fu LEE


METHOD OF STORING DATA IN MEMORIES (17747318)

Main Inventor

Win-San KHWA


SENSE AMPLIFIER CIRCUIT, MEMORY CIRCUIT, AND SENSING METHOD THEREOF (17846035)

Main Inventor

Jui-Jen Wu


GAS DISTRIBUTION RING FOR PROCESS CHAMBER (17851385)

Main Inventor

Po-Hsiang Wang


SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (17849720)

Main Inventor

Bo-Jiun Lin


ANISOTROPIC WET ETCHING IN PATTERNING (17808175)

Main Inventor

Tefu Yeh


METHOD FOR FORMING A CONTACT PLUG WITH IMPROVED CONTACT METAL SEALING (17847863)

Main Inventor

Chung-Liang CHENG


Semiconductor Packages and Methods of Forming the Same (17808705)

Main Inventor

Sey-Ping Sun


SEMICONDUCTOR PACKAGE AND METHOD (17809039)

Main Inventor

Ban-Li Wu


Cooling Cover and Packaged Semiconductor Device Including the Same (17809128)

Main Inventor

Chung-Jung Wu


INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD (17929397)

Main Inventor

Chin-Shen LIN


SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING (17809432)

Main Inventor

Yu-Lun LU


SEMICONDUCTOR PACKAGING (17849300)

Main Inventor

Tien-Chung YANG


SEMICONDUCTOR DEVICE AND METHOD (17848605)

Main Inventor

Kai-Qiang Wen


SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17849725)

Main Inventor

Li-Zhen Yu


SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME (17847450)

Main Inventor

Chih-Kuan Yu


DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF (17850477)

Main Inventor

Kai-Yun YANG


MIM CAPACITOR AND METHOD OF FORMING THE SAME (17849930)

Main Inventor

Hsing-Lien LIN


HIGH-VOLTAGE SEMICONDUCTOR DEVICES AND METHODS OF FORMATION (17809099)

Main Inventor

Wan-Jyun SYUE


MULTILAYER GATE ISOLATION STRUCTURE AND METHOD FOR FORMING THE SAME (17846948)

Main Inventor

Hong-Chih CHEN


SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17847075)

Main Inventor

Wei Ju LEE


SEMICONDUCTOR DEVICES AND METHOD OF FORMING THE SAME (17848406)

Main Inventor

Pei Yun Chung


SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME (17849739)

Main Inventor

Chia-Hao Chang


INTEGRATED CIRCUIT WITH BOTTOM DIELECTRIC INSULATORS AND FIN SIDEWALL SPACERS FOR REDUCING SOURCE/DRAIN LEAKAGE CURRENTS (17850811)

Main Inventor

Jung-Hung CHANG


SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (18464839)

Main Inventor

Ka-Hing FUNG


Transistor Source/Drain Regions and Methods of Forming the Same (18150524)

Main Inventor

Tsung-Han Chuang


METHOD FOR FORMING SEMICONDUCTOR DEVICE (17849734)

Main Inventor

Sheng-Tsung Wang


INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF (17850845)

Main Inventor

Yi-Ruei JHAN


SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18153491)

Main Inventor

Chia-Ling Chung


DEVICE WITH MODIFIED WORK FUNCTION LAYER AND METHOD OF FORMING THE SAME (17849154)

Main Inventor

Yu-Chi PAN


METAL LAYER PROTECTION DURING WET ETCHING (17809025)

Main Inventor

Kuo-Ju Chen


SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17809030)

Main Inventor

Chia-Ling Chung


SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF (17849424)

Main Inventor

Wen-Yen CHEN


METHOD FOR FORMING DUAL SILICIDE IN MANUFACTURING PROCESS OF SEMICONDUCTOR STRUCTURE (17847787)

Main Inventor

Ying-Chi SU


SEMICONDUCTOR DEVICE WITH REVERSE-CUT SOURCE/DRAIN CONTACT STRUCTURE AND METHOD THEREOF (17892864)

Main Inventor

Meng-Huan Jao


VOLTAGE AMPLIFIER BASED ON CASCADED CHARGE PUMP BOOSTING (18232526)

Main Inventor

Chin-Ho Chang


FLIP-FLOP WITH TRANSISTORS HAVING DIFFERENT THRESHOLD VOLTAGES, SEMICONDUCTOR DEVICE INCLUDING SAME AND METHODS OF MANUFACTURING SAME (17858844)

Main Inventor

Xing Chao YIN


Pipelined Hybrid Noise-Shaping Analog-To-Digital Converter (17847302)

Main Inventor

Martin Kinyua


ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE ELECTRIC DEVICE (17818722)

Main Inventor

Chih-Chieh LIAO


SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (18169563)

Main Inventor

Meng-Han Lin


3D MEMORY MULTI-STACK CONNECTION METHOD (18362196)

Main Inventor

Chia-En Huang


FERROELECTRIC DEVICE AND METHODS OF FORMING THE SAME (17849608)

Main Inventor

Hung-Wei LI


INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME (17848806)

Main Inventor

Kuo-Yu HSIANG


MEMORY DEVICE (18152122)

Main Inventor

Elia Ambrosi


PHASE-CHANGE MATERIAL (PCM) RADIO FREQUENCY (RF) SWITCHING DEVICE WITH AIR GAP (17851026)

Main Inventor

Kuo-Pin Chang


VERTICAL PHASE CHANGE SWITCH DEVICES AND METHODS (17851036)

Main Inventor

Kuo-Pin Chang

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