17818722. ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE ELECTRIC DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE ELECTRIC DEVICE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chih-Chieh Liao of HSINCHU CITY (TW)
Yu-Min Sun of HSINCHU CITY (TW)
Chih-Feng Cheng of HSINCHU CITY (TW)
ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE ELECTRIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17818722 titled 'ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE ELECTRIC DEVICE
Simplified Explanation
The patent application describes an electric device that includes a semiconductor assembly, a circuit board, and two types of conductive pads. The circuit board has a rectangular chip-mounted area. The first conductive pads are located in the center zone or all corner zones of the chip-mounted area, while the second conductive pads are located in the remaining area. The first conductive pads are soldered to one part of the semiconductor assembly through first solder-ball portions, and the second conductive pads are soldered to another part of the semiconductor assembly through second solder-ball portions. The second conductive pads are smaller in size than the first conductive pads, and the second solder-ball portions have a greater maximum width than the first solder-ball portions.
- The electric device includes a semiconductor assembly, a circuit board, and two types of conductive pads.
- The circuit board has a rectangular chip-mounted area.
- The first conductive pads are located in the center zone or all corner zones of the chip-mounted area.
- The second conductive pads are located in the remaining area of the chip-mounted area.
- The first conductive pads are soldered to one part of the semiconductor assembly through first solder-ball portions.
- The second conductive pads are soldered to another part of the semiconductor assembly through second solder-ball portions.
- The second conductive pads are smaller in size than the first conductive pads.
- The second solder-ball portions have a greater maximum width than the first solder-ball portions.
Potential Applications
- Electric devices with improved semiconductor assembly connections.
- Circuit boards with optimized layout for efficient soldering.
Problems Solved
- Provides a more efficient and reliable connection between the semiconductor assembly and the circuit board.
- Allows for better utilization of space on the circuit board.
Benefits
- Enhanced performance and reliability of electric devices.
- Improved manufacturing process for circuit boards.
- Cost-effective solution for semiconductor assembly connections.
Original Abstract Submitted
An electric device includes a semiconductor assembly, a circuit board, first conductive pads and second conductive pads. The circuit board has a chip-mounted area with a rectangular shape. The first conductive pads are arranged in a center zone or all corner zones of the chip-mounted area, and the second conductive pads are arranged within the rest in the chip-mounted area. The first conductive pads are respectively soldered to one part of solder joints of the semiconductor assembly through first solder-ball portions, and the second conductive pads are respectively soldered to another part of the solder joints of the semiconductor assembly through second solder-ball portions. Each of the second conductive pads is sized smaller than one of the first conductive pads, and a maximum width of each of the second solder-ball portions is greater than a maximum width of each of the first solder-ball portions.
