17809128. Cooling Cover and Packaged Semiconductor Device Including the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

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Cooling Cover and Packaged Semiconductor Device Including the Same

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chung-Jung Wu of Hsinchu (TW)

Sheng-Tsung Hsiao of Taoyuan City (TW)

Jen Yu Wang of Hsinchu (TW)

Tung-Liang Shao of Hsinchu (TW)

Chih-Hang Tung of Hsinchu (TW)

Cooling Cover and Packaged Semiconductor Device Including the Same - A simplified explanation of the abstract

This abstract first appeared for US patent application 17809128 titled 'Cooling Cover and Packaged Semiconductor Device Including the Same

Simplified Explanation

The abstract describes a patent application for cooling covers with trapezoidal cooling chambers for semiconductor devices. The cooling cover includes an inlet, an outlet, and a cooling chamber that has a trapezoidal shape in a cross-sectional view.

  • The patent application is for cooling covers designed specifically for packaged semiconductor devices.
  • The cooling cover includes an inlet and an outlet to allow for the flow of cooling fluid.
  • The cooling chamber within the cover is in fluid communication with the inlet and the outlet.
  • The cooling chamber is designed with a trapezoidal shape in a cross-sectional view.
  • The trapezoidal shape of the cooling chamber is likely to optimize the cooling efficiency for the semiconductor device.

Potential Applications

  • Cooling covers with trapezoidal cooling chambers can be used in various semiconductor devices, such as microprocessors, memory chips, and power electronics.
  • This technology can be applied in industries that heavily rely on semiconductor devices, including consumer electronics, automotive, aerospace, and telecommunications.

Problems Solved

  • Overheating is a common issue in semiconductor devices, which can lead to reduced performance and even failure.
  • Traditional cooling methods may not be efficient enough to adequately cool semiconductor devices.
  • The trapezoidal cooling chambers in the cooling covers aim to solve the problem of inefficient cooling by optimizing the flow of cooling fluid.

Benefits

  • The trapezoidal shape of the cooling chamber is expected to enhance the cooling efficiency of the semiconductor device.
  • Improved cooling can help prevent overheating, prolong the lifespan of the semiconductor device, and maintain optimal performance.
  • The cooling covers can be easily integrated into existing semiconductor device designs, providing a cost-effective cooling solution.


Original Abstract Submitted

Cooling covers including trapezoidal cooling chambers for cooling packaged semiconductor devices and methods of forming the same are disclosed. In an embodiment, a cooling cover for a semiconductor device includes an inlet; an outlet; and a cooling chamber in fluid communication with the inlet and the outlet, the cooling chamber having a trapezoidal shape in a cross-sectional view.

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