TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications published on May 25th, 2023
Summary of the patent applications from TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. on May 25th, 2023
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) has recently filed several patents related to memory devices, magnetic tunneling junction structures, ferroelectric random access memory (FeRAM) devices, semiconductor devices, and nanostructure devices. These patents showcase TSMC's commitment to innovation and advancement in the semiconductor industry.
Summary: TSMC has filed patents for memory devices that include a transistor and various components for connecting and accessing the memory structure. They have also developed a magnetic tunneling junction (MTJ) structure to prevent shorting between metal re-deposition layers. Additionally, TSMC has patented a method for forming FeRAM devices with improved performance and reliability. They have also developed a method for forming semiconductor devices with multiple transistors, enabling more complex circuit designs. Lastly, TSMC has filed a patent for a treatment process to expand sidewall spacer material and close seams in nanostructure devices, resulting in improved performance and efficiency.
Notable Applications: - Memory devices in electronic devices such as smartphones, tablets, and computers. - Magnetic storage devices, magnetic random-access memory (MRAM), and magnetic sensors. - Ferroelectric random access memory (FeRAM) devices for non-volatile memory storage. - Integrated circuits for improved performance and functionality. - Semiconductor devices for various applications in electronics and optoelectronics. - Nanostructure devices for the semiconductor, nanoelectronics, and optoelectronics industries.
Contents
- 1 Patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. on May 25th, 2023
- 1.1 PAD REMOVAL METHOD AND DEVICE (18151943)
- 1.2 POGO PIN-FREE TESTING DEVICE FOR IC CHIP TEST AND TESTING METHOD OF IC CHIP (17571537)
- 1.3 INTERCONNECT STRUCTURES IN INTEGRATED CIRCUIT CHIPS (17832488)
- 1.4 TEST CIRCUIT AND METHOD (18151959)
- 1.5 Package Structure Including Photonic Package and Interposer Having Waveguide (17703374)
- 1.6 MANUFACTURING METHOD OF EUV PHOTO MASKS (17736772)
- 1.7 EXTREME ULTRAVIOLET MASK WITH CAPPING LAYER (17749033)
- 1.8 OPTICAL ASSEMBLY WITH COATING AND METHODS OF USE (17745576)
- 1.9 METHODS AND APPARATUS FOR REDUCING HYDROGEN PERMEATION FROM LITHOGRAPHIC TOOL (18100409)
- 1.10 LITHOGRAPHY SYSTEM AND OPERATION METHOD THEREOF (18151163)
- 1.11 LINEAR VOLTAGE REGULATOR CIRCUIT AND MULTIPLE OUTPUT VOLTAGES (18156317)
- 1.12 COMPUTE-IN-MEMORY DEVICES AND METHODS OF OPERATING THE SAME (17827223)
- 1.13 System and Method for Fabricating a Semiconductor Device (17690058)
- 1.14 MEMORY ARRAY CIRCUITS, MEMORY STRUCTURES, AND METHODS FOR FABRICATING A MEMORY ARRAY CIRCUIT (17575397)
- 1.15 MEMORY DEVICE AND METHOD (17832261)
- 1.16 MEMORY CELL AND METHOD OF OPERATING THE SAME (18156593)
- 1.17 NON-VOLATILE MEMORY BASED COMPUTE-IN-MEMORY CELL (17695578)
- 1.18 MEMORY DEVICE HAVING A NEGATIVE VOLTAGE CIRCUIT (18158076)
- 1.19 Gate Structure Fabrication Techniques for Reducing Gate Structure Warpage (17825798)
- 1.20 HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) HAVING AN INDIUM-CONTAINING LAYER AND METHOD OF MANUFACTURING THE SAME (18151972)
- 1.21 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (17736821)
- 1.22 SEMICONDUCTOR DEVICES WITH METAL INTERCALATED HIGH-K CAPPING (17741270)
- 1.23 Wet Cleaning with Tunable Metal Recess for Via Plugs (18153832)
- 1.24 FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE WITH DUMMY FIN STRUCTURE (18156624)
- 1.25 METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING DEEP VIAS (18156711)
- 1.26 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17725300)
- 1.27 Semiconductor Device and Method (17743849)
- 1.28 GUARD RING STRUCTURE (17693027)
- 1.29 CAPACITOR AND METHOD FOR FORMING THE SAME (18158452)
- 1.30 METHOD OF MAKING A SEMICONDUCTOR DEVICE (18151990)
- 1.31 Transistor Gate Structures and Methods of Forming the Same (17703329)
- 1.32 METHOD OF FORMING AN IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE (18156693)
- 1.33 SEMICONDUCTOR DEVICE WITH INTEGRATED METAL-INSULATOR-METAL CAPACITORS (17717731)
- 1.34 DUAL SIDE CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES (18158148)
- 1.35 Method of Implanting Dopants into a Group III-Nitride Structure and Device Formed (18158192)
- 1.36 EPITAXIAL FEATURES IN SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD OF THE SAME (17832609)
- 1.37 METAL GATE STRUCTURES FOR FIELD EFFECT TRANSISTORS (18151575)
- 1.38 Semiconductor Device and Method of Forming the Same (17713014)
- 1.39 Dummy Hybrid Film for Self-Alignment Contact Formation (17648037)
- 1.40 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18158263)
- 1.41 SEMICONDUCTOR DEVICE WITH FLEXIBLE SHEET STRUCTURE (17834694)
- 1.42 Semiconductor Device and Method of Manufacture (18158641)
- 1.43 NANO-FET SEMICONDUCTOR DEVICE AND METHOD OF FORMING (18151761)
- 1.44 Germanium-Based Sensor with Junction-Gate Field Effect Transistor and Method of Fabricating Thereof (18151828)
- 1.45 METHOD FOR USING RADIATION SOURCE APPARATUS (18151930)
- 1.46 Integrated Circuits With Contacting Gate Structures (18151624)
- 1.47 MEMORY DEVICES INCLUDING TRANSISTORS ON MULTIPLE LAYERS (17743233)
- 1.48 SHARED BIT LINES FOR MEMORY CELLS (18151991)
- 1.49 THREE-DIMENSIONAL STACKABLE FERROELECTRIC RANDOM ACCESS MEMORY DEVICES AND METHODS OF FORMING (18151682)
- 1.50 Highly Physical Ion Resistive Spacer To Define Chemical Damage Free Sub 60nm Mram Devices (18158086)
- 1.51 MEMORY DEVICE AND METHOD OF FORMING THE SAME (17832601)
Patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. on May 25th, 2023
PAD REMOVAL METHOD AND DEVICE (18151943)
Main Inventor
ChunHung CHEN
POGO PIN-FREE TESTING DEVICE FOR IC CHIP TEST AND TESTING METHOD OF IC CHIP (17571537)
Main Inventor
Chih-Chieh Liao
INTERCONNECT STRUCTURES IN INTEGRATED CIRCUIT CHIPS (17832488)
Main Inventor
Meng-Han WANG
TEST CIRCUIT AND METHOD (18151959)
Main Inventor
Hsieh-Hung HSIEH
Package Structure Including Photonic Package and Interposer Having Waveguide (17703374)
Main Inventor
Chen-Hua Yu
MANUFACTURING METHOD OF EUV PHOTO MASKS (17736772)
Main Inventor
Wei-Che HSIEH
EXTREME ULTRAVIOLET MASK WITH CAPPING LAYER (17749033)
Main Inventor
Hsin-Chang LEE
OPTICAL ASSEMBLY WITH COATING AND METHODS OF USE (17745576)
Main Inventor
Wei-Hao LEE
METHODS AND APPARATUS FOR REDUCING HYDROGEN PERMEATION FROM LITHOGRAPHIC TOOL (18100409)
Main Inventor
Chi-Hung LIAO
LITHOGRAPHY SYSTEM AND OPERATION METHOD THEREOF (18151163)
Main Inventor
Chi-Hung LIAO
LINEAR VOLTAGE REGULATOR CIRCUIT AND MULTIPLE OUTPUT VOLTAGES (18156317)
Main Inventor
Yong-Liang JIN
COMPUTE-IN-MEMORY DEVICES AND METHODS OF OPERATING THE SAME (17827223)
Main Inventor
Wei-Chang Zhao
System and Method for Fabricating a Semiconductor Device (17690058)
Main Inventor
Tai-Yi Chen
MEMORY ARRAY CIRCUITS, MEMORY STRUCTURES, AND METHODS FOR FABRICATING A MEMORY ARRAY CIRCUIT (17575397)
Main Inventor
Chun-Ying LEE
MEMORY DEVICE AND METHOD (17832261)
Main Inventor
Je-Min Hung
MEMORY CELL AND METHOD OF OPERATING THE SAME (18156593)
Main Inventor
Bo-Feng YOUNG
NON-VOLATILE MEMORY BASED COMPUTE-IN-MEMORY CELL (17695578)
Main Inventor
Zheng-Jun LIN
MEMORY DEVICE HAVING A NEGATIVE VOLTAGE CIRCUIT (18158076)
Main Inventor
Yi-Hsin Nien
Gate Structure Fabrication Techniques for Reducing Gate Structure Warpage (17825798)
Main Inventor
Chandrashekhar Prakash Savant
HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) HAVING AN INDIUM-CONTAINING LAYER AND METHOD OF MANUFACTURING THE SAME (18151972)
Main Inventor
Po-Chun LIU
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (17736821)
Main Inventor
Yu-Fu WANG
SEMICONDUCTOR DEVICES WITH METAL INTERCALATED HIGH-K CAPPING (17741270)
Main Inventor
Chandrashekhar Prakash Savant
Wet Cleaning with Tunable Metal Recess for Via Plugs (18153832)
Main Inventor
Yu Shih Wang
FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE WITH DUMMY FIN STRUCTURE (18156624)
Main Inventor
Tzung-Yi TSAI
METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING DEEP VIAS (18156711)
Main Inventor
Ta-Pen GUO
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17725300)
Main Inventor
Shih-Ming CHANG
Semiconductor Device and Method (17743849)
Main Inventor
Wan-Hsien Lin
GUARD RING STRUCTURE (17693027)
Main Inventor
Min-Feng Ku
CAPACITOR AND METHOD FOR FORMING THE SAME (18158452)
Main Inventor
Meng-Han LIN
METHOD OF MAKING A SEMICONDUCTOR DEVICE (18151990)
Main Inventor
Shu Fang FU
Transistor Gate Structures and Methods of Forming the Same (17703329)
Main Inventor
Hsueh-Ju Chen
METHOD OF FORMING AN IMAGE SENSOR HAVING STRESS RELEASING STRUCTURE (18156693)
Main Inventor
Yun-Wei CHENG
SEMICONDUCTOR DEVICE WITH INTEGRATED METAL-INSULATOR-METAL CAPACITORS (17717731)
Main Inventor
Wei-Zhong Chen
DUAL SIDE CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES (18158148)
Main Inventor
Cheng-Wei CHANG
Method of Implanting Dopants into a Group III-Nitride Structure and Device Formed (18158192)
Main Inventor
Han-Chin Chiu
EPITAXIAL FEATURES IN SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD OF THE SAME (17832609)
Main Inventor
Chung-Chi Wen
METAL GATE STRUCTURES FOR FIELD EFFECT TRANSISTORS (18151575)
Main Inventor
Chih-Wei WANG
Semiconductor Device and Method of Forming the Same (17713014)
Main Inventor
Hsin-Hua Lee
Dummy Hybrid Film for Self-Alignment Contact Formation (17648037)
Main Inventor
Bor Chiuan Hsieh
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18158263)
Main Inventor
Shih-Yao Lin
SEMICONDUCTOR DEVICE WITH FLEXIBLE SHEET STRUCTURE (17834694)
Main Inventor
Chun-Yen Lin
Semiconductor Device and Method of Manufacture (18158641)
Main Inventor
Wan-Yi Kao
NANO-FET SEMICONDUCTOR DEVICE AND METHOD OF FORMING (18151761)
Main Inventor
Li-Chi Yu
Germanium-Based Sensor with Junction-Gate Field Effect Transistor and Method of Fabricating Thereof (18151828)
Main Inventor
Jhy-Jyi Sze
METHOD FOR USING RADIATION SOURCE APPARATUS (18151930)
Main Inventor
Chiao-Hua CHENG
Integrated Circuits With Contacting Gate Structures (18151624)
Main Inventor
Jhon Jhy Liaw
MEMORY DEVICES INCLUDING TRANSISTORS ON MULTIPLE LAYERS (17743233)
Main Inventor
Ken-Ichi Goto
SHARED BIT LINES FOR MEMORY CELLS (18151991)
Main Inventor
Ping-Wei WANG
THREE-DIMENSIONAL STACKABLE FERROELECTRIC RANDOM ACCESS MEMORY DEVICES AND METHODS OF FORMING (18151682)
Main Inventor
Meng-Han Lin
Highly Physical Ion Resistive Spacer To Define Chemical Damage Free Sub 60nm Mram Devices (18158086)
Main Inventor
Yi Yang
MEMORY DEVICE AND METHOD OF FORMING THE SAME (17832601)
Main Inventor
Hsin-Wen Su
