17703374. Package Structure Including Photonic Package and Interposer Having Waveguide simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
Package Structure Including Photonic Package and Interposer Having Waveguide
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Hsing-Kuo Hsia of Jhubei City (TW)
Package Structure Including Photonic Package and Interposer Having Waveguide - A simplified explanation of the abstract
This abstract first appeared for US patent application 17703374 titled 'Package Structure Including Photonic Package and Interposer Having Waveguide
Simplified Explanation
The patent application describes a semiconductor package that includes a first interposer and a photonic package attached to it. The first interposer has a substrate, a redistribution structure, and a waveguide. The photonic package includes an electronic die and a photonic die with multiple dielectric layers and a waveguide.
- The semiconductor package includes a first interposer with a substrate, redistribution structure, and waveguide.
- The photonic package is attached to the first interposer and includes an electronic die and a photonic die.
- The photonic die has multiple dielectric layers and a waveguide.
- The first side of the photonic die is attached to the electronic die, and the second side is attached to the first side of the first interposer.
- The second waveguide is located near the second side of the photonic die.
Potential applications of this technology:
- High-speed data communication systems
- Optical interconnects in computing devices
- Photonic integrated circuits
Problems solved by this technology:
- Integration of electronic and photonic components in a semiconductor package
- Efficient transmission of optical signals within the package
Benefits of this technology:
- Improved performance and speed of data communication
- Compact and integrated design for space-saving applications
- Enhanced reliability and signal integrity
Original Abstract Submitted
A semiconductor package includes a first interposer having a first substrate, a first redistribution structure over a first side of the first substrate, and a first waveguide over the first redistribution structure and proximate to a first side of the first interposer, where the first redistribution structure is between the first substrate and the first waveguide. The semiconductor package further includes a photonic package attached to the first side of the first interposer, where the photonic package includes: an electronic die, and a photonic die having a plurality of dielectric layers and a second waveguide in one of the plurality of dielectric layers, where a first side of the photonic die is attached to the electronic die, and an opposing second side of the photonic die is attached to the first side of the first interposer, where the second waveguide is proximate to the second side of the photonic die.
