17693027. GUARD RING STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

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GUARD RING STRUCTURE

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Min-Feng Ku of Hsinchu City (TW)

Yao-Chun Chuang of Hsinchu City (TW)

Cheng-Chien Li of Hsinchu City (TW)

Ching-Pin Lin of Hsinchu (TW)

GUARD RING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17693027 titled 'GUARD RING STRUCTURE

Simplified Explanation

The abstract describes an integrated circuit (IC) structure and method for forming it. The structure includes a substrate, an interconnect structure, a guard ring structure, a via structure, and a top metal feature. The guard ring structure has multiple layers with vertically aligned sidewalls, creating a smooth inner surface.

  • The IC structure includes a substrate, interconnect structure, guard ring structure, via structure, and top metal feature.
  • The guard ring structure consists of multiple layers with vertically aligned sidewalls.
  • The via structure extends vertically through the guard ring structure.
  • The top metal feature is directly over and in contact with the guard ring structure and via structure.
  • The vertically aligned sidewalls of the guard ring layers create a smooth inner surface.

Potential applications of this technology:

  • Integrated circuit manufacturing
  • Semiconductor industry
  • Electronics manufacturing

Problems solved by this technology:

  • Provides improved protection and isolation for the integrated circuit.
  • Reduces the risk of electrical interference and damage.
  • Enhances the performance and reliability of the IC structure.

Benefits of this technology:

  • Improved protection and isolation for the integrated circuit.
  • Reduced risk of electrical interference and damage.
  • Enhanced performance and reliability of the IC structure.
  • Simplified manufacturing process for the IC structure.


Original Abstract Submitted

Integrated circuit (IC) structures and methods for forming the same are provided. An IC structure according to the present disclosure includes a substrate, an interconnect structure over the substrate, a guard ring structure disposed in the interconnect structure, a via structure vertically extending through the guard ring structure, and a top metal feature disposed directly over and in contact with the guard ring structure and the via structure. The guard ring structure includes a plurality of guard ring layers. Each of the plurality of guard ring layers includes a lower portion and an upper portion disposed over the lower portion. Sidewalls of the lower portions and upper portions of the plurality of guard ring layers facing toward the via structure are substantially vertically aligned to form a smooth inner surface of the guard ring structure.

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