17571537. POGO PIN-FREE TESTING DEVICE FOR IC CHIP TEST AND TESTING METHOD OF IC CHIP simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
POGO PIN-FREE TESTING DEVICE FOR IC CHIP TEST AND TESTING METHOD OF IC CHIP
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Chih-Chieh Liao of Hsinchu (TW)
Chih-Feng Cheng of Hsinchu (TW)
Pei-Shiou Huang of Hsinchu (TW)
POGO PIN-FREE TESTING DEVICE FOR IC CHIP TEST AND TESTING METHOD OF IC CHIP - A simplified explanation of the abstract
This abstract first appeared for US patent application 17571537 titled 'POGO PIN-FREE TESTING DEVICE FOR IC CHIP TEST AND TESTING METHOD OF IC CHIP
Simplified Explanation
The abstract describes a pogo pin-free testing device for IC chip test. It consists of a load board, a ceramic interposer, and copper core balls. The ceramic interposer has connecting points with through holes and a metallization layer. The copper core balls are placed between the load board and the through holes of each connecting point.
- The device is used for testing IC chips without the need for pogo pins.
- The ceramic interposer is placed on the load board and has connecting points with through holes.
- The connecting points have a metallization layer that extends to both surfaces of the ceramic interposer.
- The metallization layer on the second surface is smaller in area compared to the first surface.
- Copper core balls are placed between the load board and the through holes of each connecting point.
Potential Applications
- Testing IC chips without the need for pogo pins.
- Improving the efficiency and accuracy of IC chip testing.
Problems Solved
- Eliminates the need for pogo pins, which can be costly and time-consuming to replace.
- Provides a more efficient and accurate method for testing IC chips.
Benefits
- Simplifies the IC chip testing process.
- Reduces costs associated with pogo pins.
- Improves the accuracy and reliability of IC chip testing.
Original Abstract Submitted
A pogo pin-free testing device for IC chip test includes a load board, a ceramic interposer disposed on the load board, and copper core balls. The ceramic interposer has first and second surfaces and connecting points, and the second surface of the ceramic interposer faces the load board. Each connecting point has through holes penetrating the first and second surfaces, and an inner sidewall surface thereof has a metallization layer. The metallization layer is extended to a portion of the first surface and a portion of the second surface. In each of the connecting points, an area of an extending portion of the metallization layer extended to the second surface is less than an area of an extending portion of the metallization layer extended to the first surface. The copper core balls are disposed between the load board and the through holes of each connecting point of the ceramic interposer.
