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Category:H01L21/308
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Pages in category "H01L21/308"
The following 74 pages are in this category, out of 74 total.
1
- 17532423. PROCESSOR DIE ALIGNMENT GUIDES simplified abstract (International Business Machines Corporation)
- 17548913. NANOSHEET DEVICE WITH VERTICAL BLOCKER FIN simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17590863. METHODS OF FORMING FIN-ON-NANOSHEET TRANSISTOR STACKS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17655321. Integration of Multiple Transistors Having Fin and Mesa Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17836452. SELECTIVE ETCHING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17897350. Memory Circuitry And Method Used In Forming Memory Circuitry simplified abstract (Micron Technology, Inc.)
- 18094839. METHODS OF FORMING PHOTONIC DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18123095. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18156123. Reduction of Line Wiggling simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18157395. STRUCTURE OF ISOLATION FEATURE OF SEMICONDUCTOR DEVICE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18190917. PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18355520. METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18359241. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18367292. GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)
- 18402563. METHOD OF BREAKING THROUGH ETCH STOP LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18469111. SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18477290. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18491470. METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES BY ETCHING ACTIVE FINS USING ETCHING MASKS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18511016. THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18511711. EPITAXIAL FIN STRUCTURES OF FINFET HAVING AN EPITAXIAL BUFFER REGION AND AN EPITAXIAL CAPPING REGION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18525131. METHOD FOR NON-RESIST NANOLITHOGRAPHY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18525473. Semiconductor Device and Method simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18531359. ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS ACROSS MULTIPLE FIN PITCH STRUCTURES simplified abstract (Intel Corporation)
- 18543934. Different Isolation Liners for Different Type FinFETs and Associated Isolation Feature Fabrication simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
B
F
I
- Intel corporation (20240105520). TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240120206). ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS ACROSS MULTIPLE FIN PITCH STRUCTURES simplified abstract
- Intel Corporation patent applications on April 11th, 2024
- INTEL CORPORATION patent applications on February 8th, 2024
- Intel Corporation patent applications on March 28th, 2024
M
S
- Samsung electronics co., ltd. (20240105842). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240128145). SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096623). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240128126). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVCE simplified abstract
- Taiwan Semiconductor manufacturing Co., Ltd. patent applications on April 18th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240105518). METHOD FOR FORMING SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240112905). Semiconductor Device and Method simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120409). METHOD FOR NON-RESIST NANOLITHOGRAPHY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240134279). PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136183). METHOD OF BREAKING THROUGH ETCH STOP LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136222). Different Isolation Liners for Different Type FinFETs and Associated Isolation Feature Fabrication simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
U
- US Patent Application 18032786. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract
- US Patent Application 18227231. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18231912. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME simplified abstract
- US Patent Application 18351149. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18357038. PATTERNING MATERIAL INCLUDING SILICON-CONTAINING LAYER AND METHOD FOR SEMICONDUCTOR DEVICE FABRICATION simplified abstract
- US Patent Application 18358508. Forming Low-Stress Silicon Nitride Layer Through Hydrogen Treatment simplified abstract
- US Patent Application 18359051. SEMICONDUCTOR DEVICE WITH REDUCED LOADING EFFECT simplified abstract
- US Patent Application 18360895. Backside Power Rail And Methods Of Forming The Same simplified abstract
- US Patent Application 18361122. Methods for Fabricating FinFETs Having Different Fin Numbers and Corresponding FinFETs Thereof simplified abstract
- US Patent Application 18361464. SEMICONDUCTOR DEVICE WITH FIN ISOLATION simplified abstract
- US Patent Application 18362240. STRAIN RELIEF TRENCHES FOR EPITAXIAL GROWTH simplified abstract
- US Patent Application 18366274. SEMICONDUCTOR FEATURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- US Patent Application 18366763. FinFET Device and Method of Forming Same simplified abstract