18511016. THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hung-Ling Shih of Tainan City (TW)
Wei Chuang Wu of Tainan City (TW)
Shih Kuang Yang of Tainan City (TW)
Hsing-Chih Lin of Tainan City (TW)
Jen-Cheng Liu of Hsin-Chu City (TW)
THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18511016 titled 'THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE
Simplified Explanation
The abstract describes an integrated chip with a through-substrate-via (TSV) that extends through the substrate, separated by a dielectric liner. The TSV includes a horizontally extending surface and a protrusion, with a maximum width along the surface.
- Integrated chip with through-substrate-via (TSV)
- TSV extends through substrate with dielectric liner
- TSV has horizontally extending surface and protrusion
- Maximum width of TSV along the surface
Potential Applications
- Semiconductor industry for advanced chip design
- High-performance computing applications
- Telecommunications for improved signal processing
Problems Solved
- Enhanced connectivity within integrated circuits
- Improved heat dissipation in chips
- Increased efficiency in data transfer
Benefits
- Higher performance capabilities
- Enhanced reliability of integrated chips
- Improved overall functionality of electronic devices
Original Abstract Submitted
The present disclosure, in some embodiments, relates an integrated chip. The integrated chip includes a substrate. A through-substrate-via (TSV) extends through the substrate. A dielectric liner separates the TSV from the substrate. The dielectric liner is along one or more sidewalls of the substrate. The TSV includes a horizontally extending surface and a protrusion extending outward from the horizontally extending surface. The TSV has a maximum width along the horizontally extending surface.
