Fujifilm corporation (20240103374). TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR, PATTERN FORMING METHOD USING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME simplified abstract
Contents
- 1 TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR, PATTERN FORMING METHOD USING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR, PATTERN FORMING METHOD USING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR, PATTERN FORMING METHOD USING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME
Organization Name
Inventor(s)
Tetsuya Shimizu of Shizuoka (JP)
Tetsuya Kamimura of Shizuoka (JP)
TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR, PATTERN FORMING METHOD USING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240103374 titled 'TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR, PATTERN FORMING METHOD USING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME
Simplified Explanation
The present invention relates to a treatment liquid for manufacturing a semiconductor, a pattern forming method using the same, and a method of manufacturing an electronic device using the treatment liquid. The treatment liquid comprises one or more metal atoms selected from Cu, Fe, and Zn, with a total content of particulate metal ranging from 0.01 to 100 mass ppt with respect to the total mass of the treatment liquid.
- Metal atoms (Cu, Fe, Zn) used in treatment liquid
- Total content of particulate metal in treatment liquid is 0.01 to 100 mass ppt
Potential Applications
This technology could be applied in the semiconductor manufacturing industry for producing high-quality electronic devices.
Problems Solved
This innovation helps in enhancing the manufacturing process of semiconductors by providing a treatment liquid with specific metal atoms.
Benefits
- Improved semiconductor manufacturing process - Enhanced electronic device performance
Potential Commercial Applications
The treatment liquid could be utilized by semiconductor manufacturers to optimize their production processes and improve the quality of electronic devices.
Possible Prior Art
Prior art related to treatment liquids for semiconductor manufacturing may exist, but specific examples are not provided in this abstract.
Unanswered Questions
How does the treatment liquid impact the overall efficiency of semiconductor manufacturing processes?
The abstract does not provide details on the specific effects of the treatment liquid on the efficiency of semiconductor manufacturing.
Are there any potential environmental impacts associated with the use of this treatment liquid?
The abstract does not address any environmental considerations or impacts of using the treatment liquid in semiconductor manufacturing processes.
Original Abstract Submitted
an object of the present invention is to provide a treatment liquid for manufacturing a semiconductor, a pattern forming method using the same, and a method of manufacturing an electronic device using the same. the treatment liquid for manufacturing a semiconductor comprising: one kind or two or more kinds of metal atoms selected from cu, fe, and zn, wherein a total content of particulate metal including at least one kind of the metal atoms is 0.01 to 100 mass ppt with respect to a total mass of the treatment liquid for manufacturing a semiconductor.
