Category:H01L21/768
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Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L21/00: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- Subgroup H01L21/768: Processes or apparatus for applying a liquid or other fluent material to semiconductor wafers
This classification involves processes or apparatuses specifically adapted for manufacturing semiconductor devices, focusing on the application of liquids or other fluent materials to semiconductor wafers, crucial in the production of modern electronic components.
Pages in category "H01L21/768"
The following 200 pages are in this category, out of 1,447 total.
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- Taiwan semiconductor manufacturing company, ltd. (20240243178). SELF-ALIGNED BACKSIDE SOURCE CONTACT STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258096). METHOD AND STRUCTURE FOR SEMICONDUCTOR INTERCONNECT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258114). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258117). METHODS OF ETCHING METALS IN SEMICONDUCTOR DEVICES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258122). PACKAGE STRUCTURE HAVING THERMAL DISSIPATION STRUCTURE THEREIN AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258158). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE INTERCONNECTION STRUCTURE HAVING AIR GAP simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258160). AMORPHOUS LAYERS FOR REDUCING COPPER DIFFUSION AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258162). INTERCONNECTION STRUCTURE WITH ANTI-ADHESION LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258166). SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258168). Self Aligned Contact Scheme simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266211). Selective Deposition of Barrier Layer simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266212). SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266216). METAL STRUCTURES WITH SEAMS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266218). INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266219). THROUGH SILICON VIAS AND METHODS OF FABRICATING THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266279). CONDUCTIVE STRUCTURE IN SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266282). SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN VIA simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266292). Semiconductor Structure Having High Breakdown Voltage Etch-Stop Layer simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266439). SEMICONDUCTOR STRUCTURE WITH SOURCE/DRAIN MULTI-LAYER STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282569). Semiconductor Device and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282571). METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282622). SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282623). SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282625). INTERCONNECTION STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282626). PHASE CONTROL IN CONTACT FORMATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282627). Contact Structures In Semiconductor Devices simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282628). SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282629). INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282697). 2D LAYER ON INTERCONNECT CONDUCTIVE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282698). MIDDLE-OF-LINE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282707). METALLIZATION LAYER AND FABRICATION METHOD simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282761). CARRIER STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282837). AIR LINER FOR THROUGH SUBSTRATE VIA simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290652). SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290653). INTEGRATED CIRCUIT INTERCONNECT STRUCTURE HAVING DISCONTINUOUS BARRIER LAYER AND AIR GAP simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290654). Polishing Interconnect Structures In Semiconductor Devices simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290656). REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290712). INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290718). INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290721). METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290824). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240292590). SOURCE/DRAIN CONTACT HAVING A PROTRUDING SEGMENT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297038). DIELECTRIC LAYER, INTERCONNECTION STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297074). Conductive Feature Formation and Structure simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297076). SELF-ALIGNED INTERCONNECT WITH PROTECTION LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297114). METHODS OF FORMING SEMICONDUCTOR PACKAGES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297217). SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297254). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304535). Integrated Circuit Package and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304541). BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304542). METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304544). INTEGRATED CIRCUIT STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304551). ALUMINUM STRUCTURES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304559). CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304571). DUMMY STACKED STRUCTURES SURROUNDING TSVS AND METHOD FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304658). RING STRUCTURE FOR FILM RESISTOR simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304679). SELECTIVE SIN CAPPING ON METAL GATE FOR METAL OXIDATION PREVENTION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321573). Using A Self-Assembly Layer To Facilitate Selective Formation of An Etching Stop Layer simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321582). SOFT ASHING PROCESS FOR FORMING PROTECTIVE LAYER ON CONDUCTIVE CAP LAYER OF SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321629). USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321632). SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321635). ETCH STOP LAYER FOR MEMORY DEVICE FORMATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321637). SEMICONDUCTOR STRUCTURE WITH A LAMINATED LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321691). SEMICONDUCTOR DEVICE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321733). INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321739). TUNABLE W-SHAPED PROFILE FOR STRUCTURES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321746). BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTOR DEVICES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321751). SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321787). SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321870). METHOD OF MAKING AMPHI-FET STRUCTURE AND METHOD OF DESIGNING simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321894). BREAKDOWN VOLTAGE CAPABILITY OF HIGH VOLTAGE DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240322041). LINER FOR A BI-LAYER GATE HELMET AND THE FABRICATION THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339327). METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339355). Air-Replaced Spacer for Self-Aligned Contact Scheme simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339356). INSULATING CAP ON CONTACT STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339396). SELF-ALIGNED VIA STRUCTURES AND METHODS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339406). INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH AIR GAPS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339513). CONTACT AND VIA STRUCTURES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339539). Contact for Semiconductor Device and Method of Forming Thereof simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347340). EPITAXIAL STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347342). METHOD AND STRUCTURE FOR BARRIER-LESS PLUG simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347381). SEMICONDUCTOR DEVICE STRUCTURE WITH INTERCONNECT STRUCTURE HAVING AIR GAP simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347384). METHODS FOR FORMING SELF-ALIGNED INTERCONNECT STRUCTURES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347463). Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347546). METHOD OF FORMING SEMICONDUCTOR DEVICE HAVING SEGMENTED INTERCONNECT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347623). DIELECTRIC SPACER TO PREVENT CONTACTING SHORTING simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on August 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 20th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 27th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 30th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 10th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 5th, 2024
- Texas instruments incorporated (20240112953). METAL FILL STRUCTURES FOR ISOLATORS TO MEET METAL DENSITY AND HIGH VOLTAGE ELECTRIC FIELD REQUIREMENTS simplified abstract
- Texas instruments incorporated (20240178164). SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA simplified abstract
- Texas instruments incorporated (20240312862). THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING simplified abstract
- TEXAS INSTRUMENTS INCORPORATED patent applications on April 4th, 2024
- Texas Instruments Incorporated patent applications on February 29th, 2024
- TEXAS INSTRUMENTS INCORPORATED patent applications on May 30th, 2024
- Texas Instruments Incorporated patent applications on September 19th, 2024
- Tokyo electron limited (20240339328). MULTI LEVEL CONTACT ETCH simplified abstract
- Tokyo Electron Limited patent applications on October 10th, 2024
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- US Patent Application 17664466. METHOD OF FORMING AN INTERCONECT STRUCTURE OF A SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 17664671. ANGLED CONTACT WITH A NEGATIVE TAPERED PROFILE simplified abstract
- US Patent Application 17746381. INTEGRATED CIRCUITS HAVING SIGNAL LINES FORMED WITH DOUBLE PATTERNING simplified abstract
- US Patent Application 17751976. DIELECTRIC SILICON NITRIDE BARRIER DEPOSITION PROCESS FOR IMPROVED METAL LEAKAGE AND ADHESION simplified abstract
- US Patent Application 17752642. MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMBER WITHIN VIA simplified abstract
- US Patent Application 17752737. FIRST METAL STRUCTURE, LAYOUT, AND METHOD simplified abstract
- US Patent Application 17804146. METAL GATE PROCESS AND RELATED STRUCTURE simplified abstract
- US Patent Application 17815623. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 17819341. Semiconductor Package Including Step Seal Ring and Methods Forming Same simplified abstract
- US Patent Application 17819679. Semiconductor Devices Including Backside Power Via and Methods of Forming the Same simplified abstract
- US Patent Application 17824012. SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE simplified abstract
- US Patent Application 17824481. METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE simplified abstract
- US Patent Application 17824889. SELECTIVE METAL REMOVAL WITH FLOWABLE POLYMER simplified abstract
- US Patent Application 17824924. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- US Patent Application 17825307. METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES simplified abstract
- US Patent Application 17825345. INTERCONNECT STRUCTURE INCLUDING CHARGED DIELECTRIC LAYERS simplified abstract
- US Patent Application 17825678. METHOD FOR FORMING A CONTACT PLUG BY BOTTOM-UP METAL GROWTH simplified abstract
- US Patent Application 17825741. SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTS WITH LOWER CONTACT RESISTANCE simplified abstract
- US Patent Application 17827006. NANO THROUGH SUBSTRATE VIAS FOR SEMICONDUCTOR DEVICES AND RELATED SYSTEMS AND METHODS simplified abstract
- US Patent Application 17829132. PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE simplified abstract
- US Patent Application 17829154. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 17887775. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18143983. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- US Patent Application 18153686. Trench Isolation Connectors for Stacked Structures simplified abstract
- US Patent Application 18167024. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract
- US Patent Application 18181293. REDISTRIBUTION LAYER METALLIC STRUCTURE AND METHOD simplified abstract
- US Patent Application 18201995. SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18227726. ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES simplified abstract
- US Patent Application 18227858. LANDING METAL ETCH PROCESS FOR IMPROVED OVERLAY CONTROL simplified abstract
- US Patent Application 18230135. SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME simplified abstract
- US Patent Application 18230338. SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 18230712. SURFACE OXIDATION CONTROL OF METAL GATES USING CAPPING LAYER simplified abstract
- US Patent Application 18231254. METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE WITH BONDING STRUCTURE simplified abstract
- US Patent Application 18231912. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME simplified abstract
- US Patent Application 18232200. Through-Circuit Vias In Interconnect Structures simplified abstract
- US Patent Application 18232670. WRAP-AROUND TRENCH CONTACT STRUCTURE AND METHODS OF FABRICATION simplified abstract
- US Patent Application 18232718. Contact Structure For Semiconductor Device simplified abstract
- US Patent Application 18232722. Liner-Free Conductive Structures With Anchor Points simplified abstract
- US Patent Application 18232833. METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH AIR SPACER simplified abstract
- US Patent Application 18232937. METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH AIR GAP simplified abstract
- US Patent Application 18344652. INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC BLOCK simplified abstract
- US Patent Application 18345188. METAL GATE STRUCTURE CUTTING PROCESS simplified abstract
- US Patent Application 18349448. INTEGRATED CIRCUIT WITH SIDEWALL SPACERS FOR GATE STACKS simplified abstract
- US Patent Application 18351226. INTERLAYER DIELECTRIC LAYER simplified abstract
- US Patent Application 18359011. METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL simplified abstract
- US Patent Application 18359036. Conductive Feature Formation and Structure simplified abstract
- US Patent Application 18359070. Low-Resistance Interconnect simplified abstract
- US Patent Application 18359383. GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE simplified abstract
- US Patent Application 18359414. SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER AND METHOD FOR FORMING THE SAME simplified abstract
- US Patent Application 18359486. Methods of Performing Chemical-Mechanical Polishing Process in Semiconductor Devices simplified abstract
- US Patent Application 18359552. INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 18359735. DEPOSITION WINDOW ENLARGEMENT simplified abstract
- US Patent Application 18359747. REPLACEMENT GATE PROCESS FOR SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 18360012. INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT simplified abstract
- US Patent Application 18360085. SEMICONDUCTOR DEVICES WITH BACKSIDE VIA AND METHODS THEREOF simplified abstract
- US Patent Application 18360332. METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18360587. METHOD OF FORMING CONTACT METAL simplified abstract
- US Patent Application 18360617. FINFET STRUCTURE WITH CONTROLLED AIR GAPS simplified abstract
- US Patent Application 18360667. PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME simplified abstract
- US Patent Application 18360814. METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A DUMMY SECTION simplified abstract
- US Patent Application 18360901. Contact Via Formation simplified abstract
- US Patent Application 18361429. SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING STRUCTURES simplified abstract
- US Patent Application 18361560. REDUCING RC DELAY IN SEMICONDUCTOR DEVICES simplified abstract
- US Patent Application 18361592. Semiconductor Device with Reduced Contact Resistance and Methods of Forming the Same simplified abstract
- US Patent Application 18361770. SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES simplified abstract
- US Patent Application 18361917. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18362083. Method of Fabricating Redistribution Circuit Structure simplified abstract
- US Patent Application 18362248. ETCH PROFILE CONTROL OF INTERCONNECT STRUCTURES simplified abstract
- US Patent Application 18362649. System Formed Through Package-In-Package Formation simplified abstract
- US Patent Application 18362739. SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE simplified abstract
- US Patent Application 18362797. IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC ADHESION AND PREVENTING METAL DIFFUSION simplified abstract
- US Patent Application 18362824. CELL REGIONS AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract
- US Patent Application 18362862. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18362968. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE simplified abstract
- US Patent Application 18363515. SEMICONDUCTOR STRUCTURE HAVING VERTICLE CONDUCTIVE GRAPHENE AND METHOD FOR FORMING THE SAME simplified abstract
- US Patent Application 18363692. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 18363698. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- US Patent Application 18363725. MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18363865. DIELECTRIC CAPPING STRUCTURE OVERLYING A CONDUCTIVE STRUCTURE TO INCREASE STABILITY simplified abstract
- US Patent Application 18363987. METAL NITRIDE DIFFUSION BARRIER AND METHODS OF FORMATION simplified abstract
- US Patent Application 18364646. PROFILE OF DEEP TRENCH ISOLATION STRUCTURE FOR ISOLATION OF HIGH-VOLTAGE DEVICES simplified abstract
- US Patent Application 18365315. Liner for A Bi-Layer Gate Helmet and the Fabrication Thereof simplified abstract