US Patent Application 18363698. PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract

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PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Yung-Chi Chu of Kaohsiung City (TW)

Hung-Jui Kuo of Hsinchu City (TW)

Yu-Hsiang Hu of Hsinchu City (TW)

Wei-Chih Chen of Taipei City (TW)

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18363698 titled 'PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Simplified Explanation

The patent application describes a package structure that includes a semiconductor die and a first redistribution circuit structure.

  • The package structure is designed to improve the electrical connection between the semiconductor die and other components.
  • The first redistribution circuit structure is placed on and connected to the semiconductor die.
  • The first redistribution circuit structure includes a first build-up layer.
  • The first build-up layer consists of a first metallization layer and a first dielectric layer that wraps around the first metallization layer.
  • A portion of the first metallization layer extends beyond the first dielectric layer.
  • This protrusion allows for better electrical connectivity and integration with other components.
  • The package structure aims to enhance the performance and reliability of the semiconductor die.


Original Abstract Submitted

A package structure includes a semiconductor die and a first redistribution circuit structure. The first redistribution circuit structure is disposed on and electrically connected to the semiconductor die, and includes a first build-up layer. The first build-up layer includes a first metallization layer and a first dielectric layer laterally wrapping the first metallization layer, wherein at least a portion of the first metallization layer is protruded out of the first dielectric layer.

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