US Patent Application 18232833. METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH AIR SPACER simplified abstract

From WikiPatents
Jump to navigation Jump to search

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH AIR SPACER

Organization Name

NANYA TECHNOLOGY CORPORATION

Inventor(s)

JUNG-HSING Chien of TAOYUAN CITY (TW)

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH AIR SPACER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18232833 titled 'METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH AIR SPACER

Simplified Explanation

The patent application describes a semiconductor device with composite pillars, a dielectric isolation structure, a sealing layer, and air spaces.

  • The composite pillars consist of a conductive pillar and a dielectric cap.
  • The dielectric isolation structure is placed between adjacent composite pillars and includes an air gap enclosed by a liner layer.
  • The sealing layer is in contact with the top portion of the dielectric isolation structure and the top of the dielectric cap.
  • Air spacers are formed between the sealing layer, the dielectric isolation structure, and the conductive pillar.


Original Abstract Submitted

The present disclosure provides a semiconductor device including composite pillars, a dielectric isolation structure, a sealing layer, and air spaces. The composite pillars are disposed over a substrate. Each of the composite pillars include a conductive pillar and a dielectric cap over the conductive pillar. The dielectric isolation structure is disposed between adjacent two of the composite pillars. The dielectric isolation structure includes an air gap and a liner layer enclosing the air gap. The sealing layer is at least in contact with a top portion of the dielectric isolation structure and a top of the dielectric cap. The air spacers are formed between the sealing layer, the dielectric isolation structure and the conductive pillar.