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Category:H01L23/58
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Pages in category "H01L23/58"
The following 200 pages are in this category, out of 214 total.
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- 17480329. ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENNA INTEGRATED WITH THROUGH SILICON VIA simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17581251. SEAL RING STRUCTURES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17693027. GUARD RING STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17703668. SEAL STRUCTURES INCLUDING PASSIVATION STRUCTURES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17708852. DUAL SIDE SEAL RINGS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17809432. SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17839946. Wafer Level Multi-Die Structure Formation simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17900804. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17958040. SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18091616. TECHNOLOGIES FOR PACKAGE SUBSTRATES WITH ASYMMETRIC PLATING simplified abstract (Intel Corporation)
- 18103676. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18151556. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18161778. SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18173039. PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18181731. SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18186545. STRUCTURE TO MITIGATE VERTICAL INTERCONNECT ACCESS INDUCED METAL CORROSION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18211084. BACKSIDE CONTACT BASED DIE EDGE GUARD RINGS (Intel Corporation)
- 18216887. DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE (International Business Machines Corporation)
- 18216923. DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING (International Business Machines Corporation)
- 18217008. THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL (International Business Machines Corporation)
- 18222057. System and Method for Die Crack Detection in Wafer-to-Wafer Bonding simplified abstract (Western Digital Technologies, Inc.)
- 18298956. SEMICONDUCTOR DEVICE INCLUDING GUARD RING simplified abstract (SK hynix Inc.)
- 18304527. THROUGH VIA WITH GUARD RING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18321817. INTEGRATED CIRCUIT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18339132. DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES simplified abstract (APPLE INC.)
- 18341818. SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTION STRUCTURE AND METHOD OF DETECTING PROGRESSIVE CRACK IN SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18343892. MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FOR HYBRID BONDING AND DIE ENCAPSULATION (Intel Corporation)
- 18367881. SEMICONDUCTOR DEVICE AND HIGH FREQUENCY SWITCH simplified abstract (Kabushiki Kaisha Toshiba)
- 18367881. SEMICONDUCTOR DEVICE AND HIGH FREQUENCY SWITCH simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18375327. SEMICONDUCTOR DESIGN LITHOGRAPHIC SEAM IMPLEMENTATION METHODOLOGY FOR ADVANCED TECHNOLOGIES (INTEL CORPORATION)
- 18381630. Tsv structure and fabricating method of the same (UNITED MICROELECTRONICS CORP.)
- 18403146. SEMICONDUCTOR DEVICE AND METHOD (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18416410. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18424871. SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD LINE DISPOSED SPACED APART FROM EACH OTHER (SK hynix Inc.)
- 18440671. DELAMINATION DETECTION STRUCTURE (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18440975. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (SK hynix Inc.)
- 18458122. INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME simplified abstract (Kabushiki Kaisha Toshiba)
- 18458122. INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18462049. INTEGRATED CIRCUIT DEVICES INCLUDING VIA CAPACITORS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18474259. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18481244. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18481961. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18482663. SEMICONDUCTOR DEVICE HAVING DIE RING CONDUCTOR simplified abstract (Micron Technology, Inc.)
- 18485291. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18485709. Structure and Method for Sealing a Silicon IC simplified abstract (Apple Inc.)
- 18488561. Selectable Monolithic or External Scalable Die-to-Die Interconnection System Methodology simplified abstract (Apple Inc.)
- 18493187. SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMING THE SAME (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18506641. DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18508766. INTEGRATED CIRCUIT WITH GUARD RING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18514054. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18521264. APPARATUS INCLUDING AIR GAP IN SCRIBE REGION OF SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
- 18527618. HIGH PERFORMANCE HIGH-VOLTAGE ISOLATORS simplified abstract (Texas Instruments Incorporated)
- 18536751. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (SK hynix Inc.)
- 18585834. Edge Recess Design for Molded and Fusion or Hybrid Bonded Integrated Circuit (Apple Inc.)
- 18595532. ELECTRONIC COMPONENT AND CHARGED PARTICLE BEAM IRRADIATION APPARATUS (KABUSHIKI KAISHA TOSHIBA)
- 18598486. TRANSFORMER ARRANGEMENT simplified abstract (Infineon Technologies Austria AG)
- 18598938. Chip Singulation Assisted Structures and Methods for Improving Bonding Interface Quality (Apple Inc.)
- 18602392. INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18605947. Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18610452. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME (SK hynix Inc.)
- 18615303. METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENNA INTEGRATED WITH THROUGH SILICON VIA simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18621138. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18637539. BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663878. DUMMY STACKED STRUCTURES SURROUNDING TSVS AND METHOD FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18675560. SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18676523. SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTING CIRCUIT (SK HYNIX INC.)
- 18700126. MOTOR CONTROL DEVICE AND SEMICONDUCTOR UNIT (Mitsubishi Electric Corporation)
- 18732662. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18741160. ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME (InnoLux Corporation)
- 18817038. INKJET PRINTING DEDICATED TEST PINS (QUALCOMM Incorporated)
- 18896414. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF (Yangtze Memory Technologies Co., Ltd.)
- 18906268. SEMICONDUCTOR DEVICE (Murata Manufacturing Co., Ltd.)
- 18945109. METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES (Intel Corporation)
- 18945966. SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR FORMING THE SAME (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18978920. INTEGRATED HIGH VOLTAGE ELECTRONIC DEVICE WITH HIGH RELATIVE PERMITTIVITY LAYERS (TEXAS INSTRUMENTS INCORPORATED)
- 18981693. ELECTRONIC DEVICE (InnoLux Corporation)
- 18982861. SEAL RING STRUCTURE FOR SEMICONDUCTOR DEVICE AND THE METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18985798. TRENCH STRUCTURE FOR REDUCED WAFER CRACKING (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18986711. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
A
- Apple inc. (20240421013). Edge Recess Design for Molded and Fusion or Hybrid Bonded Integrated Circuit
- Apple inc. (20240421126). Chip Singulation Assisted Structures and Methods for Improving Bonding Interface Quality
- Apple inc. (20250157940). SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Apple Inc. patent applications on December 19th, 2024
- Apple Inc. patent applications on February 1st, 2024
- Apple Inc. patent applications on February 8th, 2024
- Apple Inc. patent applications on January 23rd, 2025
- Apple Inc. patent applications on January 25th, 2024
C
I
- Intel corporation (20240222293). TECHNOLOGIES FOR PACKAGE SUBSTRATES WITH ASYMMETRIC PLATING simplified abstract
- Intel corporation (20240421101). BACKSIDE CONTACT BASED DIE EDGE GUARD RINGS
- Intel corporation (20250006645). MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FOR HYBRID BONDING AND DIE ENCAPSULATION
- Intel corporation (20250070056). METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Intel corporation (20250112167). SEMICONDUCTOR DESIGN LITHOGRAPHIC SEAM IMPLEMENTATION METHODOLOGY FOR ADVANCED TECHNOLOGIES
- Intel Corporation patent applications on April 3rd, 2025
- INTEL CORPORATION patent applications on April 3rd, 2025
- Intel Corporation patent applications on December 19th, 2024
- Intel Corporation patent applications on February 27th, 2025
- Intel Corporation patent applications on January 23rd, 2025
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on July 4th, 2024
- International business machines corporation (20240429178). MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES
- International business machines corporation (20250006590). DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE
- International business machines corporation (20250006663). DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING
- International business machines corporation (20250006664). THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- International Business Machines Corporation patent applications on December 26th, 2024
- International Business Machines Corporation patent applications on January 2nd, 2025
K
- Kabushiki kaisha toshiba (20240321773). SEMICONDUCTOR DEVICE AND HIGH FREQUENCY SWITCH simplified abstract
- Kabushiki kaisha toshiba (20240321779). INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Kabushiki kaisha toshiba (20250095951). ELECTRONIC COMPONENT AND CHARGED PARTICLE BEAM IRRADIATION APPARATUS
- KABUSHIKI KAISHA TOSHIBA patent applications on March 20th, 2025
- Kabushiki Kaisha Toshiba patent applications on September 26th, 2024
M
- Micron technology, inc. (20240243077). APPARATUS INCLUDING AIR GAP IN SCRIBE REGION OF SEMICONDUCTOR DEVICE simplified abstract
- Micron Technology, Inc. patent applications on July 18th, 2024
- Mitsubishi electric corporation (20240421746). MOTOR CONTROL DEVICE AND SEMICONDUCTOR UNIT
- Mitsubishi Electric Corporation patent applications on December 19th, 2024
Q
S
- Samsung electronics co., ltd. (20240194616). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240222205). SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTION STRUCTURE AND METHOD OF DETECTING PROGRESSIVE CRACK IN SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240274593). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20250022859). SEMICONDUCTOR PACKAGE WITH GLASS CORE SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Samsung electronics co., ltd. (20250062252). SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. patent applications on August 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 15th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 16th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 30th, 2025
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 14th, 2024
- Sk hynix inc. (20240162170). SEMICONDUCTOR DEVICE INCLUDING GUARD RING simplified abstract
- Sk hynix inc. (20250070047). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Sk hynix inc. (20250118718). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Sk hynix inc. (20250146967). SEMICONDUCTOR DEVICE INCLUDING CRACK DETECTING CIRCUIT
- SK hynix Inc. patent applications on April 10th, 2025
- SK hynix Inc. patent applications on February 27th, 2025
- SK hynix Inc. patent applications on May 16th, 2024
- SK HYNIX INC. patent applications on May 8th, 2025
T
- Taiwan semiconductor manufacturing co., ltd. (20240249999). Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312798). SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240421077). DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES
- Taiwan semiconductor manufacturing co., ltd. (20250105169). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Taiwan semiconductor manufacturing co., ltd. (20250105174). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Taiwan semiconductor manufacturing co., ltd. (20250118606). SEAL RING STRUCTURE FOR SEMICONDUCTOR DEVICE AND THE METHOD THEREOF
- Taiwan semiconductor manufacturing co., ltd. (20250118665). SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Taiwan semiconductor manufacturing co., ltd. (20250118678). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Taiwan semiconductor manufacturing co., ltd. (20250118684). TRENCH STRUCTURE FOR REDUCED WAFER CRACKING
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 10th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on December 19th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 30th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 27th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240120295). SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240203936). SEMICONDUCTOR STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240213180). INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240234347). METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENNA INTEGRATED WITH THROUGH SILICON VIA simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240243051). PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266304). BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266341). HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282721). PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304571). DUMMY STACKED STRUCTURES SURROUNDING TSVS AND METHOD FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321723). STRUCTURE TO MITIGATE VERTICAL INTERCONNECT ACCESS INDUCED METAL CORROSION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321780). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379584). SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379586). GUARD RING AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379587). SEAL RING REINFORCEMENT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379588). GUARD RING STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240413101). SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Taiwan semiconductor manufacturing company, ltd. (20240413102). FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF
- Taiwan semiconductor manufacturing company, ltd. (20250006700). SEMICONDUCTOR STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Taiwan semiconductor manufacturing company, ltd. (20250062166). DAISY-CHAIN SEAL RING STRUCTURE
- Taiwan semiconductor manufacturing company, ltd. (20250069982). SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR FORMING THE SAME
- Taiwan semiconductor manufacturing company, ltd. (20250069990). SEMICONDUCTOR DEVICE AND METHOD
- Taiwan semiconductor manufacturing company, ltd. (20250070052). SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMING THE SAME
- Taiwan semiconductor manufacturing company, ltd. (20250140684). DELAMINATION DETECTION STRUCTURE
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on December 12th, 2024
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 13th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 27th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 6th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 23rd, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on January 2nd, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024