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Category:Changhua Liu of Chandler AZ US

From WikiPatents

Changhua Liu

Changhua Liu from Chandler AZ US has applied for patents in technology areas such as H01L23/538, H01L23/00, H01L23/15 with intel corporation.

Patents

MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FOR HYBRID BONDING AND DIE ENCAPSULATION (20250006645)

Pages in category "Changhua Liu of Chandler AZ US"

This category contains only the following page.

I

Intel corporation (20250006645). MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FOR HYBRID BONDING AND DIE ENCAPSULATION

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