INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME

Organization Name

Inventor(s)

Kazumichi Tsumura of Shinagawa Tokyo (JP)

INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240321779 titled 'INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME

The abstract describes a patent application where the width of a first through hole is greater than the width of a second through hole in a direction orthogonal to a first direction. The first through hole extends to a part of an interconnection portion in the first direction. The side surface of the first through hole includes a first side surface portion on a substrate and a second side surface portion on the interconnection portion. The interconnection portion consists of a third face facing a first face of the substrate, a fourth face on the opposite side in the first direction, and a fifth face continuous with the second side surface portion of the first through hole and a side surface of a conductive film.

The width of the first through hole is larger than the width of the second through hole in a direction perpendicular to a first direction.
The first through hole extends to a part of an interconnection portion in the first direction.
The side surface of the first through hole includes portions on both the substrate and the interconnection portion.
The interconnection portion comprises different faces, including a third face facing the substrate, a fourth face on the opposite side, and a fifth face continuous with the conductive film.
The fifth face includes an end surface of the conductive film in the first direction.

Potential Applications: - This technology could be used in electronic devices requiring precise interconnections. - It may find applications in the manufacturing of circuit boards and semiconductor devices.

Problems Solved: - Provides a method for creating through holes with different widths for specific applications. - Enables efficient and reliable interconnections between components.

Benefits: - Improved precision in interconnection design. - Enhanced reliability in electronic devices. - Potential for miniaturization of electronic components.

Commercial Applications: Title: Advanced Interconnection Technology for Electronic Devices This technology could be utilized in the production of high-performance electronic devices, such as smartphones, laptops, and medical equipment. The precise interconnections enabled by this innovation can lead to more reliable and efficient electronic systems, appealing to manufacturers looking to enhance the quality of their products.

Questions about the Technology: 1. How does the width difference between the first and second through holes impact the overall performance of electronic devices? 2. What are the potential cost implications of implementing this advanced interconnection technology in mass production?

Frequently Updated Research: Stay updated on the latest advancements in interconnection technologies for electronic devices to ensure you are leveraging the most cutting-edge solutions in your products.

Original Abstract Submitted

a width of a first through hole is greater than a width of a second through hole in a direction orthogonal to a first direction. the first through hole also extends to a part of an interconnection portion in the first direction. a side surface of the first through hole includes a first side surface portion positioned on a substrate and a second side surface portion positioned on the part of the interconnection portion. the interconnection portion includes a third face facing a first face of the substrate, a fourth face positioned on an opposite side with respect to the third face in the first direction, and a fifth face. the fifth face is continuous with the second side surface portion of the first through hole and a side surface of a conductive film, and includes an end surface of the conductive film in the first direction.