INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME

Organization Name

Inventor(s)

Kazumichi Tsumura of Shinagawa Tokyo (JP)

INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18458122 titled 'INTERCONNECTION MEMBER AND METHOD OF MANUFACTURING THE SAME

The abstract describes a patent application where the width of a first through hole is greater than the width of a second through hole in a direction orthogonal to a first direction. The first through hole extends to a part of an interconnection portion in the first direction, with a side surface that includes a first side surface portion on a substrate and a second side surface portion on the interconnection portion. The interconnection portion consists of various faces, including a third face facing a first face of the substrate, a fourth face on the opposite side in the first direction, and a fifth face continuous with the second side surface portion of the first through hole and a side surface of a conductive film.

The width of the first through hole is greater than the width of the second through hole in a direction orthogonal to a first direction.
The first through hole extends to a part of an interconnection portion in the first direction.
The side surface of the first through hole includes a first side surface portion on a substrate and a second side surface portion on the interconnection portion.
The interconnection portion consists of various faces, including a third face, a fourth face, and a fifth face continuous with the second side surface portion of the first through hole and a conductive film.
The fifth face includes an end surface of the conductive film in the first direction.

Potential Applications: - This technology could be used in electronic devices where precise interconnections are required. - It may find applications in the manufacturing of circuit boards and semiconductor devices.

Problems Solved: - Provides a method for creating through holes with different widths in electronic components. - Ensures a secure and reliable interconnection between components.

Benefits: - Improved precision in interconnection design. - Enhanced reliability of electronic devices.

Commercial Applications: - This technology could be valuable in the electronics manufacturing industry for creating high-quality interconnections in circuit boards and semiconductor devices.

Questions about the technology: 1. How does the width difference between the first and second through holes impact the overall performance of the electronic component? 2. What are the specific advantages of having the interconnection portion with different faces in electronic devices?

Original Abstract Submitted

A width of a first through hole is greater than a width of a second through hole in a direction orthogonal to a first direction. The first through hole also extends to a part of an interconnection portion in the first direction. A side surface of the first through hole includes a first side surface portion positioned on a substrate and a second side surface portion positioned on the part of the interconnection portion. The interconnection portion includes a third face facing a first face of the substrate, a fourth face positioned on an opposite side with respect to the third face in the first direction, and a fifth face. The fifth face is continuous with the second side surface portion of the first through hole and a side surface of a conductive film, and includes an end surface of the conductive film in the first direction.