Taiwan semiconductor manufacturing co., ltd. (20250105174). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Cheng-Hsien Hsieh of Kaohsiung City TW
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
This abstract first appeared for US patent application 20250105174 titled 'SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
Original Abstract Submitted
a semiconductor device and method of manufacture are provided wherein semiconductor devices are attached over a semiconductor substrate. a seal ring within the semiconductor device is extended to include a first bond metal within a bonding layer and bonded to a second bond metal over the semiconductor substrate. such a seal ring provided a more complete protection from cracking and delamination.