Category:Hongxia Feng of Chandler AZ US
Hongxia Feng
Hongxia Feng from Chandler AZ US has applied for patents in technology areas such as H01L23/538, H01L23/00, H01L23/15 with intel corporation.
Patents
Pages in category "Hongxia Feng of Chandler AZ US"
The following 29 pages are in this category, out of 29 total.
1
- 18373457. STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION (Intel Corporation)
- 18374555. DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18374617. THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION (INTEL CORPORATION)
- 18374932. CONTROLLING SUBSTRATE BUMP HEIGHT (INTEL CORPORATION)
- 18374937. GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS (INTEL CORPORATION)
- 18375244. APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES (INTEL CORPORATION)
- 18977572. GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS (Intel Corporation)
- 19005161. POROUS LINERS FOR THROUGH-GLASS VIAS AND ASSOCIATED METHODS (Intel Corporation)
- 19018705. NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW (Intel Corporation)
2
- 20250183182. Microelectronic Assemblie (Unknown Organization)
- 20250218880. Microelectronic Assemblies W (Intel)
- 20250218904. Technologies Power S (Intel)
- 20250218926. Microelectronic Assemblies I (Intel)
- 20250218957. Methods Apparatus Emb (Intel)
- 20250218958. Pedestals Semiconductor (Intel)
- 20250218960. Methods Apparatus Emb (Intel)
- 20250218964. Technologies Connected C (Intel)
- 20250219021. Vertically Embedded Componen (Intel)
- 20250219028. Deep Trench Capacitors Mu (Intel)
I
- Intel corporation (20250006645). MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FOR HYBRID BONDING AND DIE ENCAPSULATION
- Intel corporation (20250105074). GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS
- Intel corporation (20250106983). STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Intel corporation (20250112085). APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Intel corporation (20250112124). DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Intel corporation (20250112136). GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Intel corporation (20250112164). CONTROLLING SUBSTRATE BUMP HEIGHT
- Intel corporation (20250113434). THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION
- Intel corporation (20250132239). POROUS LINERS FOR THROUGH-GLASS VIAS AND ASSOCIATED METHODS
- Intel corporation (20250149433). NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW