18474259. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Sung-Hui Huang of Yilan County TW
Hsien-Pin Hu of Hsinchu County TW
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
This abstract first appeared for US patent application 18474259 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Original Abstract Submitted
A semiconductor package includes a semiconductor die, an interposer disposed below the semiconductor die, first joints electrically coupling the semiconductor die to the interposer, at least one second joint coupling the semiconductor die to the interposer, and a first underfill disposed between the semiconductor die and the interposer to surround the active and second joints. The semiconductor die includes a first region, a seal ring region surrounding the first region, and a second region between the seal ring region and a die edge. The first joints are located within the first region, and the second joint is disposed at a die corner within the second region and is electrically floating in the semiconductor package.