Samsung Electronics Co., Ltd. patent applications on January 16th, 2025
Patent Applications by Samsung Electronics Co., Ltd. on January 16th, 2025
Samsung Electronics Co., Ltd.: 168 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (24), H01L23/498 (12), H01L25/065 (12), H01L23/31 (12), H10B80/00 (10) H04W24/10 (5), H01L23/5283 (3), F24F1/22 (3), H01L25/18 (3), H04W56/0015 (2)
With keywords such as: semiconductor, device, including, layer, substrate, structure, housing, region, based, and surface in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Wooram HONG of Suwon-si KR for samsung electronics co., ltd., Hyun Do CHOI of Yongin-si KR for samsung electronics co., ltd., Dal HEO of Yongin-si KR for samsung electronics co., ltd., Youngchun KWON of Yongin-si KR for samsung electronics co., ltd., Hyukju KWON of Uiwang-si KR for samsung electronics co., ltd., Gahee KIM of Yongin-si KR for samsung electronics co., ltd., Bosung KIM of Suwon-si KR for samsung electronics co., ltd., Jeonghun KIM of Suwon-si KR for samsung electronics co., ltd., Jin Woo KM of Suwon-si KR for samsung electronics co., ltd., Min Sik PARK of Hwaseong-si KR for samsung electronics co., ltd., Youngjin PARK of Seoul KR for samsung electronics co., ltd., Hyungtae SEO of Suwon-si KR for samsung electronics co., ltd., Won Seok OH of Suwon-si KR for samsung electronics co., ltd., Dongseon LEE of Suwon-si KR for samsung electronics co., ltd., Sangyoon LEE of Suwon-si KR for samsung electronics co., ltd., Jaejun CHANG of Gwacheon-si KR for samsung electronics co., ltd., Jun Won JANG of Seoul KR for samsung electronics co., ltd., Hyunjeong JEON of Suwon-si KR for samsung electronics co., ltd., Joon-Kee CHO of Yongin-si KR for samsung electronics co., ltd., Byung-Kwon CHOI of Seongnam-si KR for samsung electronics co., ltd., Won Je CHOI of Suwon-si KR for samsung electronics co., ltd., Younsuk CHOI of Seongnam-si KR for samsung electronics co., ltd., Taesin HA of Seongnam-si KR for samsung electronics co., ltd.
IPC Code(s): B65D51/00, B65D51/20
CPC Code(s): B65D51/002
Abstract: a sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.
20250019889. CLOTHES CARE APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungho CHANG of Suwon-si KR for samsung electronics co., ltd., Hyeonjoo KIM of Suwon-si KR for samsung electronics co., ltd., Yongpil PARK of Suwon-si KR for samsung electronics co., ltd., Sangho SHIN of Suwon-si KR for samsung electronics co., ltd., Kwonchul YUN of Suwon-si KR for samsung electronics co., ltd., Kyonghui JEON of Suwon-si KR for samsung electronics co., ltd., Jungsang CHOI of Suwon-si KR for samsung electronics co., ltd., Hankyu CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): D06F58/10, D06F73/02
CPC Code(s): D06F58/10
Abstract: a clothes care apparatus including a support device with an improved structure to transmit the physical force of air to clothes. the clothes care apparatus includes a main body including a clothes care chamber with a plurality of outlets and a support device disposed in the clothes care chamber and configured to support clothes, wherein the support device includes a first member with a plurality of dischargers corresponding to the plurality of outlets to guide air into the clothes care chamber, and a second member disposed below the first member and including a plurality of supporters, where the plurality of supporters are between the plurality of dischargers whereby one supporter among the plurality of supporters is between one discharger and another discharger adjacent to the one discharger among the plurality of dischargers.
20250020010. WASHING MACHINE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jin Ho LEE of Suwon-si KR for samsung electronics co., ltd., Hwa Shik KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): E05D3/12, D06F34/20, D06F39/14, E05D7/00, E05D11/00
CPC Code(s): E05D3/12
Abstract: a washing machine having a structure to electrically connect electronic parts inside a door of the washing machine to different electronic parts inside a cabinet of the washing machine. the washing machine includes: the cabinet which is equipped with a first electronic part therein, the cabinet having an opening to put in laundry; the door which is equipped with a second electronic part therein and is configured to open or close the opening of the cabinet; a hinge assembly configured to pivotally connect the door with the cabinet; and a wire configured to be inserted through the hinge assembly to electrically connect the electronic parts of the cabinet and the electronic parts of the door.
Inventor(s): Kwangnam SHIN of Suwon-si KR for samsung electronics co., ltd., Jungwon KIM of Suwon-si KR for samsung electronics co., ltd., Hyeongju KIM of Suwon-si KR for samsung electronics co., ltd., Yukyoung ROH of Suwon-si KR for samsung electronics co., ltd., Jaechan PARK of Suwon-si KR for samsung electronics co., ltd., Woong SUN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F24F1/22
CPC Code(s): F24F1/22
Abstract: the present disclosure relates to an air conditioner including an indoor unit and an outdoor unit connected to the outdoor unit. the outdoor unit includes: an outdoor unit housing and a refrigerant pipe disposed inside the outdoor unit housing; case holes configured to allow a cable to pass through and electrical equipment cases disposed inside the outdoor unit housing; a cable guide disposed on a cable passage through which the cable passes toward the case holes, wherein the cable guide includes a guide body configured of cover the cable passage to block a leaked refrigerant from being introduced into the case holes along the cable passage when a refrigerant leaks from the refrigerant pipe. in addition, the cable guide includes a guide opening formed in the guide body to allow the cable to pass through, and a cable fixer including a fixer body coupled with the cable and inserted into the guide opening to fix the cable to the guide body and cover the guide opening.
20250020340. OUTDOOR UNIT OF AIR CONDITIONER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chungwan YUK of Suwon-si KR for samsung electronics co., ltd., Jeonguk KOH of Suwon-si KR for samsung electronics co., ltd., Woong SUN of Suwon-si KR for samsung electronics co., ltd., Kwangnam SHIN of Suwon-si KR for samsung electronics co., ltd., Jungho YU of Suwon-si KR for samsung electronics co., ltd., Jongmin LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F24F1/22, F24F13/20
CPC Code(s): F24F1/22
Abstract: an outdoor unit of an air conditioner comprises: a case; a board frame configured to move relative to the case and on which a printed circuit board is mounted; and a frame guide disposed inside the case and configured to support the board frame. the board frame is configured to slide between a first frame position with respect to the frame guide and a second frame position with respect to the frame guide, and to allow a sliding movement of the board frame to be guided by the frame guide. in response to the board frame being at the second frame position with respect to the frame guide, the board frame is configured to rotate about a rotation axis passing through the frame guide.
Inventor(s): Kwangnam SHIN of Suwon-si KR for samsung electronics co., ltd., Jungwon KIM of Suwon-si KR for samsung electronics co., ltd., Hyeongju KIM of Suwon-si KR for samsung electronics co., ltd., Yukyoung ROH of Suwon-si KR for samsung electronics co., ltd., Jaechan PARK of Suwon-si KR for samsung electronics co., ltd., Woong SUN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F24F1/22
CPC Code(s): F24F1/22
Abstract: the present disclosure relates to an air conditioner including an indoor unit and an outdoor unit connected to the outdoor unit. the outdoor unit includes: an outdoor unit housing and a refrigerant pipe disposed inside the outdoor unit housing; case holes configured to allow a cable to pass through and electrical equipment cases disposed inside the outdoor unit housing; a cable guide disposed on a cable passage through which the cable passes toward the case holes, wherein the cable guide includes a guide body configured of cover the cable passage to block a leaked refrigerant from being introduced into the case holes along the cable passage when a refrigerant leaks from the refrigerant pipe. in addition, the cable guide includes a guide opening formed in the guide body to allow the cable to pass through, and a cable fixer including a fixer body coupled with the cable and inserted into the guide opening to fix the cable to the guide body and cover the guide opening.
20250020343. OUTDOOR UNIT OF AIR CONDITIONER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Woong SUN of Suwon-si KR for samsung electronics co., ltd., Jeonguk KOH of Suwon-si KR for samsung electronics co., ltd., Jaechan PARK of Suwon-si KR for samsung electronics co., ltd., Kwangnam SHIN of Suwon-si KR for samsung electronics co., ltd., Chungwan YUK of Suwon-si KR for samsung electronics co., ltd., Seungjin YUN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F24F1/56
CPC Code(s): F24F1/56
Abstract: an outdoor unit of an air conditioner is provided. the outdoor unit includes a case configured to accommodate a printed circuit board therein and including a case opening formed on one side of the case and a frame provided along an edge of the case opening, a case cover configured to cover at least a portion of the frame and the case opening and having a rear surface facing the inside of the case, and a gasket configured to seal a gap between the case cover and the frame. the frame includes a first surface disposed to face the rear surface of the case cover, and a second surface extending from the first surface toward the inside of the case. the gasket includes a first sealing portion configured to be in contact with the rear surface of the case cover and the first surface of the frame, and a second sealing portion configured to be in contact with the second surface of the frame.
Inventor(s): Dongjun SHIN of Suwon-si KR for samsung electronics co., ltd., Kyungjae KIM of Suwon-si KR for samsung electronics co., ltd., Jooyoo KIM of Suwon-si KR for samsung electronics co., ltd., Tan KIM of Suwon-si KR for samsung electronics co., ltd., Hyungseon SONG of Suwon-si KR for samsung electronics co., ltd., Seolhee JEON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F24F11/63, G05B19/042
CPC Code(s): F24F11/63
Abstract: disclosed are an air conditioner, an air conditioning system, and a control method thereof. the air conditioner includes an input interface, a communication interface configured to communicate with a server, and a processor configured to receive a main setting pattern from the server and operate according to the received main setting pattern, based on a setting value changing, transmit the changed setting value and first environment information at the time when the setting value is changed to the server, based on receiving a selection of an artificial intelligence control operation from a user, transmit current second environment information to the server, control the communication interface to receive the main setting pattern or a sub-setting pattern corresponding to the changed setting value from the server based on the first environment information and the second environment information, and operate according to the received main setting pattern or the received sub-setting pattern.
Inventor(s): Sangyoon HAN of Suwon-si KR for samsung electronics co., ltd., Taeil KIM of Suwon-si KR for samsung electronics co., ltd., Naeseong LEE of Suwon-si KR for samsung electronics co., ltd., Minwoo LEE of Suwon-si KR for samsung electronics co., ltd., Min CHANG of Suwon-si KR for samsung electronics co., ltd., Seokhyun JANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F25B49/02, F25B30/02
CPC Code(s): F25B49/02
Abstract: a heat pump system may include: a compressor configured to compress a refrigerant; a refrigerant-water heat exchanger configured to perform heat exchange between the compressed refrigerant and inlet water; an expansion valve configured to expand the refrigerant condensed in the refrigerant-water heat exchanger; an outdoor heat exchanger configured to perform heat exchange between the refrigerant expanded in the expansion valve and outdoor air; a high pressure sensor configured to detect a high pressure saturation temperature of the refrigerant compressed in the compressor; an inlet water temperature sensor configured to detect a temperature of water flowing into the refrigerant-water heat exchanger; a condensation temperature sensor configured to detect a temperature of the refrigerant condensed in the refrigerant-water heat exchanger; an outdoor temperature sensor configured to detect an outdoor temperature; and a controller including at least one processor, comprising processing circuitry, individually and/or collectively, configured to: determine a reference supercooling degree of the refrigerant based on detection of outdoor temperature by the outdoor temperature sensor and inlet water temperature by the inlet water temperature sensor and an operating frequency of the compressor, determine a current degree of supercooling of the refrigerant based on detection of pressure saturation temperature by the high pressure sensor and condensation temperature by the condensation temperature sensor, and determine whether the refrigerant leaks by comparing the reference supercooling degree and the current degree of supercooling.
Inventor(s): Sagar BHARATHRAJ of Karnataka IN for samsung electronics co., ltd., Shashishekara Parampalli ADIGA of Karnataka IN for samsung electronics co., ltd.
IPC Code(s): G01R31/3842, G01R31/367
CPC Code(s): G01R31/3842
Abstract: a processor-implemented method including generating a voltage slope based on monitored cell voltage and current data of a battery, the cell voltage and current data being taken during a charging window or discharging window of the battery, determining a change in a sign of the voltage slope by comparing the voltage slope with a reference voltage slope of a reference battery, determining, based on the change in the sign of the voltage slope, a deviation in a magnitude of the voltage slope by comparing the magnitude of the voltage slope with a preset magnitude of the reference voltage slope, and detecting an intermittent short in the battery based on a determination that a deviation in the magnitude of the voltage slope is greater than a preset threshold value.
Inventor(s): Chilsung Choi of Suwon-si KR for samsung electronics co., ltd., Hoon Song of Yongin-si KR for samsung electronics co., ltd., Hongseok Lee of Seoul KR for samsung electronics co., ltd.
IPC Code(s): G02B27/01, F21V8/00, G02B5/18, G02B5/30, G02B6/27, G02B30/25, G02B30/33
CPC Code(s): G02B27/0103
Abstract: provided is a waveguide structure including an output grating, a polarization conversion element provided parallel to the output grating, and a polarization separation element provided between the output grating and the polarization conversion element, wherein the polarization separation element is configured to transmit, to the output grating, light having a first polarization direction among light incident on the polarization separation element, and reflect, to the polarization conversion element, light having a second polarization direction different from the light having the first polarization direction among the light incident on the polarization separation element.
Inventor(s): Suk Koo Hong of Suwon-si KR for samsung electronics co., ltd., Jaemyoung Kim of Suwon-si KR for samsung electronics co., ltd., Taegeun Seong of Yongin si KR for samsung electronics co., ltd., Minyoung Lee of Yongin si KR for samsung electronics co., ltd., Moohyun Koh of Suwon-si KR for samsung electronics co., ltd., Kyungoh Kim of Suwon-si KR for samsung electronics co., ltd., Minsoo Kim of Yongin si KR for samsung electronics co., ltd., Changsoo Woo of Yongin si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/004, H01L21/027
CPC Code(s): G03F7/0044
Abstract: a photoresist composition including an organometallic compound, which includes at least one metal-ligand bond, a metal core, and at least one organic ligand bonded to the metal core; at least one first organic ligand precursor, which is different in chemical structure from the at least one organic ligand of the organometallic compound, and which includes a sulfonic acid group and has a structure capable of forming a coordination complex with the metal core; and a solvent. a method of manufacturing an integrated circuit device that includes forming a photoresist film on a substrate by use of the photoresist composition and forming a modified organometallic compound by binding an organic ligand including a sulfonic acid group to the organometallic compound through a ligand exchange between the organometallic compound and the at least one first organic ligand precursor based on chemical equilibrium in the photoresist film.
Inventor(s): Kyungoh Kim of Suwon-si KR for samsung electronics co., ltd., Jaemyoung Kim of Suwon-si KR for samsung electronics co., ltd., Seungwook Shin of Yongin si KR for samsung electronics co., ltd., Wanhee Lim of Yongin si KR for samsung electronics co., ltd., Moohyun Koh of Suwon-si KR for samsung electronics co., ltd., Minsoo Kim of Yongin si KR for samsung electronics co., ltd., Seungwoo Jang of Yongin si KR for samsung electronics co., ltd., Suk Koo Hong of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/004, H01L21/027, H01L21/308, H01L21/311, H01L21/3213
CPC Code(s): G03F7/0044
Abstract: a photoresist composition includes an organometallic compound, which includes at least one metal-ligand bond including a metal core and at least one organic ligand bonded to the metal core; at least one first organic ligand precursor, which is different in chemical structure from the at least one organic ligand of the organometallic compound, and which includes a phosphonic acid group and has a structure capable of forming a coordination complex with the metal core; and a solvent. a method of manufacturing an integrated circuit device includes forming a photoresist film on a substrate using the photoresist composition, and forming a modified organometallic compound by binding an organic ligand including a phosphonic acid group to the organometallic compound through a ligand exchange between the organometallic compound and the at least one first organic ligand precursor based on chemical equilibrium in the photoresist film.
Inventor(s): Cheol KANG of Suwon-si KR for samsung electronics co., ltd., Haengdeog KOH of Suwon-si KR for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si KR for samsung electronics co., ltd., Minsang KIM of Suwon-si KR for samsung electronics co., ltd., Beomseok KIM of Suwon-si KR for samsung electronics co., ltd., Hana KIM of Suwon-si KR for samsung electronics co., ltd., Hoyoon PARK of Suwon-si KR for samsung electronics co., ltd., Chanjae AHN of Suwon-si KR for samsung electronics co., ltd., Jaejun LEE of Suwon-si KR for samsung electronics co., ltd., Sungwon CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/039, G03F7/004, G03F7/038
CPC Code(s): G03F7/0397
Abstract: provided are a polymer including a first repeating unit represented by formula 1 below, a resist composition including the same, a method of forming a pattern by using the same, and a monomer represented by formula 10 below.
Inventor(s): Cheol KANG of Suwon-si KR for samsung electronics co., ltd., Haengdeog KOH of Suwon-si KR for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si KR for samsung electronics co., ltd., Minsang KIM of Suwon-si KR for samsung electronics co., ltd., Beomseok KIM of Suwon-si KR for samsung electronics co., ltd., Hana KIM of Suwon-si KR for samsung electronics co., ltd., Hoyoon PARK of Suwon-si KR for samsung electronics co., ltd., Chanjae AHN of Suwon-si KR for samsung electronics co., ltd., Jaejun LEE of Suwon-si KR for samsung electronics co., ltd., Sungwon CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/039, G03F7/004, G03F7/038
CPC Code(s): G03F7/0397
Abstract:
Inventor(s): Cheol KANG of Suwon-si KR for samsung electronics co., ltd., Haengdeog KOH of Suwon-si KR for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si KR for samsung electronics co., ltd., Minsang KIM of Suwon-si KR for samsung electronics co., ltd., Beomseok KIM of Suwon-si KR for samsung electronics co., ltd., Hana KIM of Suwon-si KR for samsung electronics co., ltd., Hoyoon PARK of Suwon-si KR for samsung electronics co., ltd., Chanjae AHN of Suwon-si KR for samsung electronics co., ltd., Jaejun LEE of Suwon-si KR for samsung electronics co., ltd., Sungwon CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/039, G03F7/004, G03F7/038
CPC Code(s): G03F7/0397
Abstract: in formulae 1 and 10, lto l, a11 to a13, x, rf, and rto rare as described in the specification.
Inventor(s): Yebin Nam of Suwon-si KR for samsung electronics co., ltd., Sunghyup Kim of Suwon-si KR for samsung electronics co., ltd., Injae Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/00
CPC Code(s): G03F7/70066
Abstract: a top module of an exposing apparatus may include a reticle stage, a nozzle and a pair of guides. the reticle stage may be configured to support a reticle to which a light is incident. the nozzle may be under the reticle stage and configured to inject a shielding gas in a first horizontal direction. the guides may extend from opposite sides of the nozzle and may be configured to induce the shielding gas in the first horizontal direction. thus, the shielding gas may not diffuse in a second horizontal direction (e.g., perpendicular to the first horizontal direction) to prevent a diffusion of a contaminant in the shielding gas, thereby preventing the reticle from being contaminated. as a result, a pattern of the reticle may be accurately transcribed into a layer on a semiconductor substrate to form a desired pattern.
Inventor(s): Youngho HWANG of Suwon-si KR for samsung electronics co., ltd., Sanghyun LIM of Suwon-si KR for samsung electronics co., ltd., Youngkyun IM of Suwon-si KR for samsung electronics co., ltd., Jaehong LIM of Suwon-si KR for samsung electronics co., ltd., Chulmin CHO of Suwon-si KR for samsung electronics co., ltd., Seok HEO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/00, G03F7/16, G03F7/32
CPC Code(s): G03F7/70875
Abstract: a substrate processing method includes: performing a first post-exposure baking process on a photoresist layer that was previously exposed to for extreme ultraviolet (euv) exposed to euv; developing the photoresist layer using a first developing solution having a first temperature; performing a second post-exposure baking process on the photoresist layer; developing the photoresist layer using a second developing solution having a second temperature, higher than the first temperature; and forming a photoresist pattern by performing a hard baking process on the photoresist layer.
Inventor(s): Hyunseok NAM of Suwon-si KR for samsung electronics co., ltd., Minshik SEOK of Suwon-si KR for samsung electronics co., ltd., Daehan YU of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G05F1/56
CPC Code(s): G05F1/56
Abstract: a power management device includes a main power management integrated circuit (pmic) and at least one sub pmic that communicates with the main pmic through a dedicated pin. the main pmic includes a first pin, enables first functions associated with a first initial operation based on a battery voltage during a stand-by period before generating first output voltages based on the battery voltage and applies a first sub enable signal to the at least one sub pmic through the first pin based on a power-on signal after completing the first initial operation. the at least one sub pmic includes a second pin, receives the first sub enable signal through the second pin and enables second functions associated with a second initial operation based on the battery voltage, in response to an activation of the first sub enable signal.
Inventor(s): Haejung CHOI of Suwon-si KR for samsung electronics co., ltd., Jooseong KIM of Suwon-si KR for samsung electronics co., ltd., Junhyeok YANG of Suwon-si KR for samsung electronics co., ltd., Sungmin YOO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G05F3/20, G05F1/567, G05F3/26
CPC Code(s): G05F3/205
Abstract: a semiconductor device including a bandgap reference generator that generates a reference voltage; a switch control voltage generator that generates a first reference current based on the reference voltage, and generates an adaptive switch level voltage by distributing the first reference current to a first path and a second path, the first path including a first resistor, and the second path including a second resistor and a first bipolar junction transistor connected in series; and a switch controller that generates a switch control signal for controlling switches included in the bandgap reference generator based on the adaptive switch level voltage. the adaptive switch level voltage has a slope with respect to temperature that is greater than a base-emitter voltage of the first bipolar junction transistor.
Inventor(s): Kwanwoo NOH of Seoul KR for samsung electronics co., ltd., Sungho SEO of Suwon-si KR for samsung electronics co., ltd., Yongwoo JEONG of Seoul KR for samsung electronics co., ltd., Dongwoo NAM of Seongnam-si KR for samsung electronics co., ltd., Myungsub SHIN of Suwon-si KR for samsung electronics co., ltd., Hyunkyu JANG of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): G06F1/08, G06F1/04, G06F3/06, G06F13/42, G11C7/22, G11C16/32, H04L7/00
CPC Code(s): G06F1/08
Abstract: a storage device and a storage system including the same are provided. the storage device includes a reference clock pin configured to receive a reference clock signal from a host, a reference clock frequency determination circuitry configured to determine a reference clock frequency from the reference clock signal received through the reference clock pin, and a device controller circuitry configured to perform a high speed mode link startup between the host and the storage device according to the reference clock frequency.
Inventor(s): Seonghoon KIM of Suwon-si KR for samsung electronics co., ltd., Bummoo RYU of Suwon-si KR for samsung electronics co., ltd., Myeongsil PARK of Suwon-si KR for samsung electronics co., ltd., Jungchul AN of Suwon-si KR for samsung electronics co., ltd., Kwangtai KIM of Suwon-si KR for samsung electronics co., ltd., Donghyun YEOM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F1/16, H04M1/02
CPC Code(s): G06F1/1652
Abstract: according to various embodiments, an electronic device includes a first housing, a second housing, a hinge device, and a flexible display. the hinge device foldably combines the first housing and second housing. the flexible display has a folding region folded through the hinge device, a first bending region located at one side of the folding region, and a second bending region located on other side of the folding region, and includes a window layer, a display panel disposed under the window layer, and a support plate disposed under the display panel and including a pattern having at least one opening and/or at least one recess formed at a position corresponding to at least the folding region. the first bending region is configured to refrain from being attached to the first housing and a first hinge plate, and the second bending region is configured to refrain from being attached to the second housing and a second hinge plate. the support plate maintains a specific thickness in a portion corresponding to the first bending region and the second bending region.
Inventor(s): Sangheon KIM of Suwon-si KR for samsung electronics co., ltd., Yeunwook LIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1652
Abstract: an electronic device according to various embodiments comprises: a first housing; a second housing; a flexible display having a display area configured to change based on movement of the first housing with respect to the second housing; a motor module including a motor at least operatively connected to the first housing and configured to perform driving so that the first housing slides with respect to the second housing; a sensor module including at least one sensor; and at least one processor, comprising processing circuitry, wherein: at least one processor, individually and/or collectively, is configured to: confirm information related to an object and a running application, confirm the movement of the first housing, confirm the movement distance of the first housing, confirm, from the sensor module, the position at which a user holds the electronic device, and determines, to be the position of the object, a position corresponding to the held position in response to the first housing moving a designated distance so that the display area of the flexible display changes; and wherein the object executes a function designated by a designated operation, and can include at least one from among a user interface (ui) that is visible or invisible on a screen, an icon, a figure, and a specific area of the electronic device.
Inventor(s): Kyuhwan LEE of Suwon-si KR for samsung electronics co., ltd., Haejin LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G06F1/20
CPC Code(s): G06F1/1675
Abstract: an electronic apparatus includes: a first housing; a second housing coupled to the first housing such as to be slidable in a first direction away from the first housing and in a second direction opposite to the first direction; a roller including a rotation shaft oriented perpendicular to the first direction and the second direction, the roller being in at least one from among the second housing and the first housing; and a heat transfer sheet including a flexible and thermally conductive material, wherein one end portion of the heat transfer sheet is coupled to the roller, wherein the roller is configured to wind the heat transfer sheet in a case where the second housing slides in the second direction and unwind the heat transfer sheet in a case where the second housing slides in the first direction.
Inventor(s): Sungkoo PARK of Suwon-si KR for samsung electronics co., ltd., Haeyeon KIM of Suwon-si KR for samsung electronics co., ltd., Sewoong KIM of Suwon-si KR for samsung electronics co., ltd., Museok BANG of Suwon-si KR for samsung electronics co., ltd., Soonho HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1698
Abstract: an electronic device is provided. the electronic device includes a display including a display panel, a lateral member which including a conductive material and disposed in a manner that at least a part thereof surrounds the display, a communication module electrically connected to the lateral member to enable the lateral member to function as an antenna, and a support plate disposed below the display panel and including a first region adjacent to the lateral member and a second region excluding the first region, wherein the first and second regions of the support plate comprise different materials.
Inventor(s): Ravi SHARMA of Noida IN for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G06T7/70, G06T7/80, G06V10/26, G06V10/764, G06V20/20, G06V20/50, G06V40/20
CPC Code(s): G06F3/017
Abstract: disclosed is a method, implemented in a visual see through (vst) device, for interpreting user gestures in multi-reality scenarios. the method includes identifying one or more camera view zones based on fields of view of one or more cameras, determining one or more contexts based on an analysis of each of the one or more camera view zones, classifying the one or more camera view zones for each of the determined one or more contexts, and recognizing a user gesture as an input based on the classified one or more camera view zones.
Inventor(s): YOUNGSAM SHIN of SUWON-SI KR for samsung electronics co., ltd., DEOK JAE OH of SUWON-SI KR for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0608
Abstract: a memory management method based on a compressed memory and an apparatus using the same are provided. a memory device includes a memory and a near memory processing unit. the memory includes a normal memory area for storing uncompressed data and a compressed memory area for storing compressed data. the near memory processing unit is configured to receive a first command to frontswap-store a huge page, which is stored in the normal memory area, in the compressed memory area; identify addresses of sub-pages of the huge page based on an address of the huge page; compress the sub-pages using the addresses of the sub-pages to generate compressed sub-pages; and store the compressed sub-pages in the compressed memory area. a size of the huge page is larger than a regular page.
Inventor(s): Sungho YOON of Suwon-si KR for samsung electronics co., ltd., Younsung CHU of Suwon-si KR for samsung electronics co., ltd., Youngmoon KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0619
Abstract: provided are storage devices, methods of operating a storage controller, and universal flash storage (ufs) systems. the storage device includes a memory group configured to store unique device secret (uds) data including a uds, and pre-installed device secret (pds) data including a pds, and a processor configured to receive a first endorsement generated based on the pds and a first firmware image, perform a first integrity check for the first firmware image based on the pds of the pds data, the first firmware image, and the first endorsement, and generate a second endorsement based on the uds and the first firmware image in response to a pass result of the first integrity check.
Inventor(s): Jin-ha LEE of Seoul KR for samsung electronics co., ltd., Ben CERVENY of Los Angeles CA US for samsung electronics co., ltd., Gabriel DUNNE of San Francisco CA US for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06T3/40
CPC Code(s): G06F3/14
Abstract: a display apparatus and a display method thereof are provided. according to an exemplary embodiment, a display method of a display apparatus includes: displaying a plurality of display items corresponding to a plurality of content items comprising a first display item displayed in a first region and remaining display items; displaying the first display item using a first display scheme and displaying the remaining display items using a second display scheme; and in response to sensing a user interaction for moving the display items, changing the display scheme of the first display item while moving the first display item in a direction corresponding to the user interaction, displaying the first display item using the second display scheme and changing the display scheme of second display items of the removing to the first region among the rest display items to the first display scheme.
Inventor(s): Jiwon JEON of Suwon-si KR for samsung electronics co., ltd., Hongsik PARK of Suwon-si KR for samsung electronics co., ltd., Donghee KANG of Suwon-si KR for samsung electronics co., ltd., Youngchan WOO of Suwon-si KR for samsung electronics co., ltd., Joayoung LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06F3/01, G06F3/0482
CPC Code(s): G06F3/14
Abstract: an example electronic device may include a housing, a flexible display at least a portion of which is visible to the outside through the housing, and at least one processor operably connected to the flexible display, wherein the at least one processor may be configured, in response to a sliding operation being performed to make visible a second portion including at least a portion of a first portion of the flexible display to the outside, based on an input, in a state in which the first portion of the flexible display is visible to the outside, to obtain context information in a state in which the second portion is visible, identify one or more workspaces based on the context information, control the display to display a list of the one or more workspaces in a portion of the second portion, and in response to one workspace being selected from the list, control the display to display execution screens of a plurality of applications in the second portion based on the selected workspace, and wherein each of the one or more workspaces may include size information of the second portion, information about a plurality of applications to be executed, and layout information of execution screens of the plurality of applications.
Inventor(s): Seoyoung JIN of Suwon-si KR for samsung electronics co., ltd., Jeonggwan Kang of Suwon-si KR for samsung electronics co., ltd., Sungyup Kim of Suwon-si KR for samsung electronics co., ltd., Jongjin Kim of Suwon-si KR for samsung electronics co., ltd., Byungwoo Min of Suwon-si KR for samsung electronics co., ltd., Changhuyn Sung of Suwon-si KR for samsung electronics co., ltd., Jeongwon Yang of Suwon-si KR for samsung electronics co., ltd., Mijung Park of Suwon-si KR for samsung electronics co., ltd., Jeongmin Park of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06F1/16
CPC Code(s): G06F3/1423
Abstract: an electronic device includes: a first housing including a first surface and a second surface opposite to the first surface; a second housing including a third surface and a fourth surface opposite to the third surface; a first display on the first and third surfaces; a second display on the second surface; a first inertial sensor in the first housing; a second inertial sensor in the second housing; and at least one processor. the at least one processor is configured to: identify, using the first and second inertial sensors, that an angle between a first direction in which the first surface faces and a second direction in which the third surface faces is within a designated range, identify that first data, which is related to a posture of the electronic device and is identified using the second inertial sensor, is within a first range, and change a display mode of the second display.
Inventor(s): Minho HONG of Suwon-si KR for samsung electronics co., ltd., Taegu KIM of Suwon-si KR for samsung electronics co., ltd., Saejung SHIN of Suwon-si KR for samsung electronics co., ltd., Kyungtae KIM of Suwon-si KR for samsung electronics co., ltd., Gajin SONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/16, G06F3/01, G06F3/0484, G06F3/0488
CPC Code(s): G06F3/167
Abstract: an example electronic device may include a display. the electronic device may include a display at least one processor. the electronic device may include a display. the electronic device may include memory for storing instructions. the instructions, when executed by the at least one processor individually or collectively, may cause the electronic device to receive an utterance of a user, obtain information on user interface (ui) components displayed on the display based on context information of the electronic device, map weights to the ui components based on the information on the ui components and gaze information of the user, determine a ui component for which a state is to be updated by the utterance among the ui components based on a weight mapping result and the utterance, and update the state of the determined ui component based on the utterance.
Inventor(s): Xueyang LIU of Atlanta GA US for samsung electronics co., ltd., Jing YANG of Glen Allen VA US for samsung electronics co., ltd., Rekha PITCHUMANI of Oak Hill VA US for samsung electronics co., ltd., Sahand SALAMAT of San Diego CA US for samsung electronics co., ltd., Joseph FINDLEY of San Jose CA US for samsung electronics co., ltd.
IPC Code(s): G06F9/48, G06F11/34
CPC Code(s): G06F9/4881
Abstract: a method may include determining, by at least one processing circuit, a first performance, on a first computational device, of a compute task, determining, by the at least one processing circuit, a second performance, on a second computational device, of the compute task, and assigning, by the at least one processing circuit, based on the first performance and the second performance, to the first computational device, the compute task. the determining the first performance may be based on a data transfer associated with the compute task. a method may include determining a characteristic of a compute task, determining a first configuration of a first computational device, determining a second configuration of a second computational device, and assigning, based on the characteristic of the compute task, the first configuration of the first computational device, and the second configuration of the second computational device, the compute task to the first computational device.
Inventor(s): Hwajeong Kwon of Suwon-si KR for samsung electronics co., ltd., Taeyong Kim of Suwon-si KR for samsung electronics co., ltd., Kwangkyu Bang of Suwon-si KR for samsung electronics co., ltd., Sangkuk Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F11/07, G06F11/14, G06F11/30
CPC Code(s): G06F11/0793
Abstract: an electronic system includes a monitored device and a management device. the monitored device operates according to an operating system and generates a display image. the management device is connected to the monitored device through a communication network. the management device periodically receives, from the monitored device, screen image data corresponding to the display image, determines whether an error that causes the operating system of the monitored device to become inoperable occurs in the operating system of the monitored device based on a network connection state with the monitored device, determines a type of the error based on error determination factors and an analysis result of the screen image data, and transfers, to the monitored device, a request indicating follow-up actions to take to resolve the error, the follow-up actions corresponding to the type of the error.
Inventor(s): Junho SHIN of Suwon-si KR for samsung electronics co., ltd., Hanbyeul NA of Suwon-si KR for samsung electronics co., ltd., Jaehun JANG of Suwon-si KR for samsung electronics co., ltd., Mankeun SEO of Suwon-si KR for samsung electronics co., ltd., Dongmin SHIN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F11/10
CPC Code(s): G06F11/1044
Abstract: a memory controller including: a data formatter receiving first to n-th hard decision data and first to n-th soft decision data, and performing a formatting operation on the first to n-th hard decision data and the first to n-th soft decision data; and an error correction code (ecc) circuit receiving the first to n-th hard decision data and the first to n-th soft decision data from the data formatter and correcting an error on the first page by ecc decoding processing, wherein the data formatter performs the formatting operation such that the first to n-th hard decision data and the first to n-th soft decision data are provided to the ecc circuit in an order different from an order of the first to n-th hard decision data and the first to n-th soft decision data were received from the memory device.
Inventor(s): Sompong Paul Olarig of Pleasanton CA US for samsung electronics co., ltd., David Schwaderer of Saratoga CA US for samsung electronics co., ltd., Oscar Prem Pinto of San Jose CA US for samsung electronics co., ltd., Jason Martineau of Milpitas CA US for samsung electronics co., ltd.
IPC Code(s): G06F12/14, G06F21/10, G06F21/62, G07C5/08, H04N5/445, H04N5/77, H04N5/907, H04N7/18, H04N9/82, H04N23/698
CPC Code(s): G06F12/1425
Abstract: a data storage device includes: a housing integrating a control logic, a data protection logic, and a non-volatile storage; and a network interface connector integrated to the housing and is configured to be directly inserted into a network switch. the control logic is configured to store a vehicle data including a video stream in the non-volatile storage. the video stream is received from a video camera that is connected to the network switch. the data protection logic is configured to detect a vehicle event and change an operating mode of the data storage device to a read-only mode prohibiting the vehicle data stored in the non-volatile storage from being erased or tampered.
Inventor(s): Benixon ARUL DHAS of San Jose CA US for samsung electronics co., ltd., Ramaraj PANDIAN of San Jose CA US for samsung electronics co., ltd., Ronald LEE of San Jose CA US for samsung electronics co., ltd.
IPC Code(s): G06F13/40, G06F3/06, G06F13/37, H04L67/1008, H04L67/141, H04L69/325
CPC Code(s): G06F13/4068
Abstract: provided is a method of packet processing, the method including receiving an input/output (io) request from a host, selecting a drive corresponding to the io request using a hashing algorithm or a round-robin technique, and establishing a connection between the host and the drive.
Inventor(s): Shangqian Gao of Mountain View CA US for samsung electronics co., ltd., Ting Hua of Cupertino CA US for samsung electronics co., ltd., Yen-Chang Hsu of Fremont CA US for samsung electronics co., ltd., Yilin Shen of Mountain View CA US for samsung electronics co., ltd., Hongxia Jin of San Jose CA US for samsung electronics co., ltd.
IPC Code(s): G06N3/0985, G06N3/0495
CPC Code(s): G06N3/0985
Abstract: in one embodiment, a method includes accessing at least a portion of a training dataset for a trained neural network that includes multiple layers, where each layer includes a number of parameters, and where the training dataset includes multiple training samples that each include an input and a ground-truth output used to train the trained neural network. the method further includes training a hypernetwork to generate a layer-specific compression mask for each of one or more of the multiple layers of the trained neural network. the method further includes generating, by the trained hypernetwork, a final layer-specific compression mask for the trained neural network and compressing the trained neural network by reducing, for each of the one or more layers of the neural network, the number of parameters of that layer according to the final layer-specific compression mask.
Inventor(s): Gabriel T. DAGANI of Austin TX US for samsung electronics co., ltd., Christopher P. FRASCATI of Liberty Hill TX US for samsung electronics co., ltd., FNU GURUPAD of San Jose CA US for samsung electronics co., ltd., David TANNENBAUM of Austin TX US for samsung electronics co., ltd., Rama S.B. HARIHARA of San Jose CA US for samsung electronics co., ltd., Keshavan VARADARAJAN of Austin TX US for samsung electronics co., ltd.
IPC Code(s): G06T1/20, G06F9/48
CPC Code(s): G06T1/20
Abstract: a system and a method are disclosed improving forward progress of preempted workloads. a graphics pipeline processes tiles of a first low-priority job. a controller stops the first job by resetting the gpu and preempting the first job with a second job having a higher priority, determine whether the first job has been previously preempted one or more times, and adjust a batch-binning parameter reducing a likelihood that the first job will again be preempted in the current frame. in one embodiment, the controller is configured to stop the first job at a preemption boundary during a draw call or by resetting the gpu. a batch-binning parameter may include postponing sorting primitives into tiles during a binning process, increasing a number of tiles for backend rendering, reducing a quality of anti-aliasing, decreasing a shading rate quality, and/or decreasing input resolution and increasing upscaling of the first job.
Inventor(s): Jiwhan KIM of Seongnam-si KR for samsung electronics co., ltd., Sungjoo SUH of Seoul KR for samsung electronics co., ltd.
IPC Code(s): G06T3/4046, G06F18/214, G06N3/04, G06N3/08, G06T3/4007, G06T3/4053, G06V10/764, G06V10/82
CPC Code(s): G06T3/4046
Abstract: an image processing method includes extracting a first region in a first image by inputting the first image to a pretrained neural network, upscaling a resolution of the first region by performing neural network-based super resolution processing on the first region, and upscaling a resolution of a second region in the first image from which the first region is excluded by performing interpolation on the second region.
Inventor(s): Yahang Li of Champaign IL US for samsung electronics co., ltd., Nguyen Thang Long Le of Garland TX US for samsung electronics co., ltd., Hamid R. Sheikh of Allen TX US for samsung electronics co., ltd.
IPC Code(s): G06T5/50, G06T5/00, G06T7/30, G06T7/579
CPC Code(s): G06T5/50
Abstract: a method includes obtaining, using at least one processing device of an electronic device, raw image frames of a scene. the raw image frames include different sets of raw image frames captured at different viewpoints and different viewing angles relative to the scene. the method also includes performing, using the at least one processing device, blending of each set of raw image frames in order to generate blended image frames of the scene. the method further includes training, using the at least one processing device, a machine learning model using the blended image frames. the machine learning model is trained to generate three-dimensional (3d) information about the scene from viewpoints and viewing angles not captured in the sets of raw image frames.
Inventor(s): Indranil Sinharoy of Richardson TX US for samsung electronics co., ltd., Aditya Dave of Plano TX US for samsung electronics co., ltd., Lianjun Li of McKinney TX US for samsung electronics co., ltd., Hao Chen of Allen TX US for samsung electronics co., ltd.
IPC Code(s): G06T7/246, G06T7/11, G06V10/25, G06V20/40, G06V40/18
CPC Code(s): G06T7/248
Abstract: a method includes receiving, by a processor, a video of an illuminated face. video frames in the video are associated with different time instants of a time series, respectively. the method includes determining a region of interest (roi) that includes a closed eye on the face based on at least one frame in a plurality of video frames in the video. the method includes slicing each roi based on slice parameters for selecting a vertical slice that includes a eye centroid of the closed eye, and selecting a horizontal slice that intersects the vertical slice at a pivot (p) located lpixels from the eye centroid. the method includes determining an eyeball motion signal according to the time series, based on a measured value of a shadow intensity of the eye within at least one of the vertical slice or the horizontal slice at each of the different time instants.
Inventor(s): Yonggonjong Park of Suwon-si KR for samsung electronics co., ltd., Daeul Park of Suwon-si KR for samsung electronics co., ltd., Moonsub BYEON of Suwon-si KR for samsung electronics co., ltd., Seho SHIN of Suwon-si KR for samsung electronics co., ltd., Jaewook YOO of Suwon-si KR for samsung electronics co., ltd., Jaewoo LEE of Suwon-si KR for samsung electronics co., ltd., Sung Hyun CHUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T7/80, G06T7/12, G06V10/40, G06V20/56
CPC Code(s): G06T7/80
Abstract: a method and apparatus for calibrating a camera are provided. the method and apparatus include obtaining a driving image captured by a camera mounted on a vehicle, segmenting line regions including straight lines from the captured driving image, extracting feature points of the straight lines from the line regions, projecting the feature points of the straight lines into a world coordinate system, and estimating an error for a calibration parameter of the camera including at least one of a pitch, a roll, or a yaw so that the feature points projected into the world coordinate system satisfy a line parallel condition.
Inventor(s): Kun Jin of San Jose CA US for samsung electronics co., ltd., Siva Penke of San Jose CA US for samsung electronics co., ltd.
IPC Code(s): G06T11/00, G06F40/58
CPC Code(s): G06T11/00
Abstract: in one embodiment, a method includes accessing, by a computing device, a natural-language input comprising a description of an avatar and generating, from the natural-language input and by a trained avatar-creation model, a set of avatar-attribute feature vectors. the method further includes determining, by a trained avatar-attribute classifier, one or more avatar attributes from the set of avatar-attribute feature vectors; and generating the avatar based on the determined one or more avatar attributes for presentation on a display of a computing device.
20250022205. PRECISION MODULATED SHADING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junmo PARK of Suwon-si KR for samsung electronics co., ltd., Arun RADHAKRISSHNAN of Austin TX US for samsung electronics co., ltd., Seyeong BYEON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T15/00, G06F9/30
CPC Code(s): G06T15/005
Abstract: methods and apparatuses for performing precision-modulated shading (pms) using a graphics processing unit (gpu), including: obtaining a shading instruction corresponding to a floating-point operand; determining a precision mode which applies to the shading instruction from among a plurality of precision modes for processing shading instructions; and based on the determined precision mode, truncating the floating-point operand, and executing the shading instruction using the truncated floating-point operand.
Inventor(s): Hyeoncheon JO of Suwon-si KR for samsung electronics co., ltd., Taegu KIM of Suwon-si KR for samsung electronics co., ltd., Gajin SONG of Suwon-si KR for samsung electronics co., ltd., Hoseon SHIN of Suwon-si KR for samsung electronics co., ltd., Jaeyung YEO of Suwon-si KR for samsung electronics co., ltd., Eunkyung LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06V10/94, G06F3/01, G06F3/16, G10L15/22
CPC Code(s): G06V10/945
Abstract: an electronic device is provided. the electronic device includes memory storing one or more computer programs, and one or more processors communicatively coupled to the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the electronic device to detect, based on a voice command obtained from a user, candidate objects in a viewing region of the user, determine a representative property among candidate properties of the detected candidate objects, output, for each of the detected candidate objects, feedback based on a property value of the representative property of a corresponding candidate object, and determine, based on obtaining an additional command that specifies a property value of the representative property from the user, an object indicated in the voice command as a candidate object having the property value of the representative property specified by the additional command.
Inventor(s): Sungun PARK of Suwon-si KR for samsung electronics co., ltd., Kyuhong KIM of Seoul KR for samsung electronics co., ltd.
IPC Code(s): G06V40/12, G06F18/214, G06F18/22, G06F21/32, G06N3/04, G06N7/01, G06V10/762, G06V10/764
CPC Code(s): G06V40/1388
Abstract: a processor-implemented anti-spoofing method includes: extracting an input embedding vector from input biometric information; obtaining a fake embedding vector of a predetermined fake model based on fake biometric information; obtaining either one or both of a real embedding vector of a predetermined real model and an enrolled embedding vector of an enrollment model the enrollment model being generated based on biometric information of an enrolled user; determining a confidence value of the input embedding vector based on the fake embedding vector and either one or both of the real embedding vector and the enrolled embedding vector; and determining whether the input biometric information is forged, based on the confidence value.
Inventor(s): Sangheon KIM of Suwon-si KR for samsung electronics co., ltd., Yeunwook LIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G09G3/00, G06F1/16
CPC Code(s): G09G3/035
Abstract: an electronic device is disclosed. the electronic device comprises: a first housing; a second housing disposed so as to be movable with respect to the first housing and overlapping at least a portion of the first housing; a flexible display at least partially mounted on the surface of the second housing, at least partially visible to the outside of the electronic device, and at least a portion of which is configured to be slid out from the inside of the first housing based on the second housing moving in a first direction with respect to the first housing, or inserted into the first housing based on the second housing moving in a second direction with respect to the first housing; a driving module comprising a gear disposed inside the first housing or the second housing and configured to move the second housing in the first direction or the second direction based on the operation of a driving source; at least one processor comprising processing circuitry; and at least one memory operably connected to at least one processor, wherein at least one processor, individually and/or collectively, may be configured to receive an input for moving the second housing, and, in response to the second housing moving in the first direction based on the input, or the size of an visible area of the flexible display, based on the moving of the second housing, being a specified value or greater, control the display to display, on a partial area of the visible area, one or more icons corresponding to respective one or more applications which are being executed.
20250022414. DISPLAY DEVICE AND SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hwa Hyun Cho of Suwon-si KR for samsung electronics co., ltd., Yoonho Ko of Suwon-si KR for samsung electronics co., ltd., Hyunwook Lim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G09G3/3225, G09G3/00, G09G3/32
CPC Code(s): G09G3/3225
Abstract: a display device according to an embodiment may include: a plurality of first display pixels disposed in a first region of a substrate; a plurality of image sensing pixels that are disposed in a second region positioned at the periphery of the first region of the substrate, and generate pixel signals; and a driving circuit that is disposed on the substrate, generates a plurality of first data signals based on input image data, provides the plurality of first data signals to the plurality of first display pixels, receives the pixel signal from the plurality of image sensing pixels, and generates image data corresponding to the user's gaze based on the pixel signal.
Inventor(s): Hyunseok KIM of Suwon si KR for samsung electronics co., ltd., Junghyuk KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G09G3/34
CPC Code(s): G09G3/3406
Abstract: an electronic device may include: an image input, a display, memory storing instructions, and at least one processor operatively connected to the image input, the memory, and the display. at least one processor may be configured to execute the instructions to receive data regarding a first frame through the image input, generate first screen data regarding timing control and frame rate control of the first frame and store the first screen data in the memory, based on a difference between a first pixel value of the first frame and a pixel value of a frame contiguous to the first frame being equal to or less than a predetermined value, stop generating new screen data for controlling the display, and control the display to display a screen based on the first screen data.
Inventor(s): Choonghoon Lee of Suwon-si KR for samsung electronics co., ltd., Minsung Kim of Suwon-si KR for samsung electronics co., ltd., Sung-Jin Park of Suwon-si KR for samsung electronics co., ltd., Seung-Hoon Baek of Suwon-si KR for samsung electronics co., ltd., Jeong Cho of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G09G5/12
CPC Code(s): G09G5/12
Abstract: a display device includes a first display driver circuit that outputs a first gamma reference voltage to a first display panel, and a second display driver circuit that outputs a second gamma reference voltage to a second display panel different from the first display panel, and determines the difference between the first gamma reference voltage and the second gamma reference voltage, and keeps outputting the second gamma reference voltage when the difference is smaller than a first reference value, and changes the second gamma reference voltage when the second gamma reference voltage is less than the first gamma reference voltage and the difference is equal to or greater than the first reference value.
Inventor(s): YOON-JOO EOM of Hwaseong-si KR for samsung electronics co., ltd., SEUNGJUN BAE of Hwaseong-si KR for samsung electronics co., ltd., HYE JUNG KWON of Seoul KR for samsung electronics co., ltd., YOUNG-JU KIM of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): G11C11/4093, G11C5/14, G11C7/02, G11C7/10, G11C7/14, G11C7/20, G11C11/4072, G11C11/4074, G11C11/4076, G11C11/408, G11C11/4091, G11C11/4096, G11C29/02, G11C29/50
CPC Code(s): G11C11/4093
Abstract: a memory device may include a first data line driver circuit that generates a first reference voltage set based on a first code and a second code associated with a first data line, and determines bit values of the first input data received through the first data line, based on the first reference voltage set. a second data line driver circuit may similarly generate a second reference voltage set. the reference voltages may have levels based on a decision feedback equalization (dfe) technique to reduce bit errors otherwise caused by inter symbol interference.
Inventor(s): Sungmin Joe of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G11C16/10, G11C16/08, G11C16/20, G11C16/26
CPC Code(s): G11C16/102
Abstract: a method of programming a non-volatile memory device may include; during a first channel initialization period, applying a first voltage to a selected word line and a first word line group proximate to the selected word line, and applying a second voltage lower than the first voltage to a second word line group distal from the selected word line, applying a first program voltage to the selected word line during a first program execution period in order to perform a first program operation for data, during a second channel initialization period, applying the first voltage to the selected word line and the first word line group, and applying the second voltage to the second word line group, and applying a second program voltage to the selected word line during a second program execution period in order to perform a second program operation for the data.
Inventor(s): YOUNGSAN KANG of SUWON-SI KR for samsung electronics co., ltd., UNHO LEE of SUWON-SI KR for samsung electronics co., ltd., JUNGHO JUNG of SUWON-SI KR for samsung electronics co., ltd., JONGKYU CHOI of SUWON-SI KR for samsung electronics co., ltd.
IPC Code(s): G11C29/12, G11C7/04, G11C29/46
CPC Code(s): G11C29/1201
Abstract: a memory device includes: a memory cell array; an input/output circuit controlling inputting and outputting data stored in the memory cell array; an impedance calibration circuit generating an impedance calibration code based on an external resistor connected to an impedance pad for application to the input/output circuit as an applied impedance calibration code; and a calibration control circuit comparing a new impedance calibration code received from the impedance calibration circuit with a calibration code range for generating a calibration code update flag when the new impedance calibration code is included in the calibration code range. the impedance calibration circuit updates the applied impedance calibration code with the new impedance calibration code when receiving the calibration code update flag.
Inventor(s): Iksu BYUN of Suwon-si KR for samsung electronics co., ltd., Songyun KANG of Suwon-si KR for samsung electronics co., ltd., Youngrok KWON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/683
CPC Code(s): H01J37/32724
Abstract: an electrostatic chuck may include a body, a body; an internal electrode in the body, wherein the internal electrode is configured to generate an electrostatic force when a voltage is applied to the internal electrode; and a coating layer on an outer surface of the body, wherein the coating layer comprises a film forming material including a silicon-containing material.
Inventor(s): Joongsuk Oh of Suwon-si KR for samsung electronics co., ltd., Jinuk Byun of Suwon-si KR for samsung electronics co., ltd., Hoyoung Kim of Suwon-si KR for samsung electronics co., ltd., Hyunkyu Moon of Suwon-si KR for samsung electronics co., ltd., Kiho Bae of Suwon-si KR for samsung electronics co., ltd., Boun Yoon of Suwon-si KR for samsung electronics co., ltd., Hojoon Lee of Suwon-si KR for samsung electronics co., ltd., Seunghoon Choi of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/304, G06N3/04, H01L21/66, H01L21/67
CPC Code(s): H01L21/304
Abstract: an offset data correction method includes measuring a measurement target that has undergone a chemical mechanical polishing (cmp) process, generating an offset correction model based on the measurement of the measurement target, and using the offset correction model, correcting measured data obtained from the measurement of the measurement target, wherein the offset correction model is trained by using the measured data and layout data of the measurement target as inputs.
Inventor(s): Eun Jung KIM of SUWON-SI KR for samsung electronics co., ltd., Sung Woo KIM of SUWON-SI KR for samsung electronics co., ltd., Hyun Seo SHIN of SUWON-SI KR for samsung electronics co., ltd., Min Jeong CHO of SUWON-SI KR for samsung electronics co., ltd., Min Su CHOI of SUWON-SI KR for samsung electronics co., ltd.
IPC Code(s): H01L21/308, H01L21/027, H01L21/311, H01L29/66, H10B12/00
CPC Code(s): H01L21/3086
Abstract: a method of fabricating a semiconductor device includes providing a substrate, forming a target film, a first mask film, a second mask film, and an upper mask pattern on the substrate, forming a first spacer pattern that includes a first line portion and a second line portion, and a folding portion that connects the first line portion and the second line portion, forming a slit mask pattern that partially covers the first spacer pattern, forming a first mask pattern by patterning the second mask film using the slit mask pattern and the first spacer pattern as an etching mask, forming a second spacer pattern, forming a second mask pattern by patterning the first mask film using the second spacer pattern as an etching mask, and forming a plurality of target patterns by patterning the target film using the second mask pattern as an etching mask.
20250022758. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yongho KIM of Suwon-si KR for samsung electronics co., ltd., Sunoo KIM of Suwon-si KR for samsung electronics co., ltd., Jinwoo KIM of Suwon-si KR for samsung electronics co., ltd., Boin NOH of Suwon-si KR for samsung electronics co., ltd., Sejun PARK of Suwon-si KR for samsung electronics co., ltd., Jaehee OH of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/66, H01L23/00
CPC Code(s): H01L22/32
Abstract: a semiconductor device includes a semiconductor substrate, a connection pad disposed on an interlayer insulating layer and electrically connected to an interconnection structure, a passivation layer disposed on the connection pad and having a first opening and a second opening, each exposing at least a portion of the connection pad, a first bump that includes a first lower conductive layer in contact with the connection pad within the first opening and a first upper conductive layer on the first lower conductive layer, and a second bump that includes a second lower conductive layer in contact with the connection pad within the second opening and a second upper conductive layer on the second lower conductive layer. the first and second lower conductive layers include the same material, and the first upper conductive layer and the second upper conductive layer include different materials.
Inventor(s): Junghyun ROH of Suwon-si KR for samsung electronics co., ltd., Honggyun KIM of Suwon-si KR for samsung electronics co., ltd., Manhee HAN of Suwon-si KR for samsung electronics co., ltd., Jaeyoung HONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/66
CPC Code(s): H01L22/34
Abstract: a semiconductor chip includes a semiconductor substrate having a first surface and a second surface opposite to the first surface. the semiconductor substrate includes a circuit pattern region and a peripheral region surrounding the circuit pattern region, an activation layer on the second surface of the semiconductor substrate and having a plurality of circuit patterns in the circuit pattern region, and at least one scattering detection pattern in the peripheral region and having a plurality of circuit cells that generate leakage current based on a scattered beam or heat of a laser.
Inventor(s): Minjung KIM of Suwon-si KR for samsung electronics co., ltd., Solji SONG of Suwon-si KR for samsung electronics co., ltd., Jiseok YEO of Suwon-si KR for samsung electronics co., ltd., Hyojun YOON of Suwon-si KR for samsung electronics co., ltd., Dongjin LEE of Suwon-si KR for samsung electronics co., ltd., Yoonseok CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L23/00, H01L25/065
CPC Code(s): H01L23/3142
Abstract: a semiconductor package is provided. the semiconductor package includes a package substrate including bonding pads on a upper surface thereof and external connectors on a lower surface thereof, a first chip structure connected to the package substrate with a bonding wire and disposed on the package substrate, a second chip structure disposed on the package substrate and disposed next to the first chip structure, and a mold layer covering the package substrate, the first chip structure, and the second chip structure, wherein the first chip structure includes a plurality of semiconductor dies that are sequentially stacked, the second chip structure includes a second semiconductor substrate, an oxide layer on the second semiconductor substrate, and an adhesion enhancer layer disposed on the oxide layer and in contact with the mold layer, heights of the first chip structure and the second chip structure are the same.
Inventor(s): Insik HAN of Suwon-si KR for samsung electronics co., ltd., Shle-Ge LEE of Suwon-si KR for samsung electronics co., ltd., Junho LEE of Suwon-si KR for samsung electronics co., ltd., WanSun KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/40, H01L23/00, H01L23/522, H01L25/18, H10B80/00, H01L23/31, H01L23/498
CPC Code(s): H01L23/4006
Abstract: a semiconductor package includes a package substrate. a chip structure is on the package substrate. a stiffener covers the chip structure and the package substrate. screws fix the stiffener to the package substrate. the stiffener includes a main portion that covers an upper surface of the chip structure. a vertical portion that covers lateral side surfaces of the chip structure. the vertical portion extends from an end of the main portion. an edge portion extending laterally from the vertical portion and covering the upper surface of the package substrate. the screws penetrate the edge portion and the package substrate and couple the edge portion to the package substrate.
Inventor(s): PYUNGHWA HAN of SUWON-SI KR for samsung electronics co., ltd., BONG-SOO KIM of SUWON-SI KR for samsung electronics co., ltd., GYUJIN CHOI of SUWON-SI KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/065
CPC Code(s): H01L23/49816
Abstract: a semiconductor chip includes a semiconductor substrate, an insulation layer positioned on the semiconductor substrate and that includes a plurality of via holes, and a bump positioned within the plurality of via holes and on the insulation layer. portions of the bump positioned within the plurality of via holes are connected to each other.
20250022787. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyunsoo CHUNG of Suwon-si KR for samsung electronics co., ltd., Kwang-Soo Kim of Suwon-si KR for samsung electronics co., ltd., Jaesic Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/065
CPC Code(s): H01L23/49838
Abstract: disclosed is a semiconductor package comprising a first semiconductor chip, a second semiconductor chip, and a connection die. a hybrid bonding may be established between the connection die and the first semiconductor chip and between the connection die and the second semiconductor chip. the first semiconductor chip includes a first semiconductor substrate having first and second surfaces. the first surface is closer than the second surface to the connection die. the second semiconductor chip includes a second semiconductor substrate having third and fourth surfaces. the third surface is closer than the fourth surface to the connection die. the first and second semiconductor chips further include a power distribution wiring layer on the second surface of the first semiconductor chip and the fourth surface of the second semiconductor substrate.
Inventor(s): KYOUNG LIM SUK of Suwon-si KR for samsung electronics co., ltd., HYEONJEONG HWANG of Suwon-si KR for samsung electronics co., ltd., Sehoon JANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L21/48, H01L21/768, H01L23/00, H01L23/528, H01L25/10
CPC Code(s): H01L23/49838
Abstract: an embodiment provides a semiconductor package including: a first redistribution layer structure including a plurality of redistribution vias and a plurality of ubm structures; and a first semiconductor die on the first redistribution layer structure, wherein each of the plurality of ubm structures includes a ubm via; and a ubm wire line extending in a horizontal direction on the ubm via and electrically connecting one of the plurality of redistribution vias and the ubm via in the horizontal direction.
Inventor(s): Jaemyung CHOI of Niskayuna NY US for samsung electronics co., ltd., Janggeun LEE of Delmar NY US for samsung electronics co., ltd., Wonhyuk HONG of Clifton Park NY US for samsung electronics co., ltd., Kang-ill SEO of Springfield VA US for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/3213, H01L21/768, H01L23/522, H01L23/532
CPC Code(s): H01L23/5283
Abstract: a semiconductor device includes: a frontside structure including at least one of a front-end-of-line (feol) structure, a middle-of-line (mol) structure, and a back-end-of-line (beol) structure; a 1metal line on the frontside structure; and a 2metal line on the frontside structure, wherein the 1metal line has a greater width than the 2metal line in a same direction, and the 1metal line and the 2metal line have an equal height.
Inventor(s): HAKSEON KIM of Suwon-si KR for samsung electronics co., ltd., DONGJIN LEE of Suwon-si KR for samsung electronics co., ltd., JAEDUK LEE of Suwon-si KR for samsung electronics co., ltd., KANG-OH YUN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/40, H10B43/10, H10B43/27, H10B43/35, H10B43/40, H10B80/00
CPC Code(s): H01L23/5283
Abstract: according to an aspect of the present disclosure, a semiconductor device includes a peripheral structure, and a cell structure stacked on the peripheral structure. the cell structure includes a first substrate including a pad region and a cell region including a cell array region and an extending region, wherein the first substrate includes a first surface and a second surface opposite to the first surface, and wherein second surface faces the peripheral structure, a gate stacking structure including a plurality of gate electrodes and a plurality of interlayer insulating layers alternately stacked on the second surface of the first substrate, a channel structure disposed on the cell array region and penetrating the plurality of gate electrodes and the plurality of interlayer insulating layers, a plurality of gate contacts disposed on the extending region and connected to the plurality of gate electrodes, respectively, a cell insulation layer positioned over the second surface of the first substrate and covering the gate stacking structure, and an input/output contact disposed on the pad region and penetrating the cell insulation layer. the peripheral structure includes a second substrate electrically connected to the first substrate, a plurality of circuit elements positioned on the second substrate, a first barrier structure positioned over the second substrate and including a plurality of lower barrier layers, a plurality of first via holes disposed on the cell region and the pad region and penetrating at least one of the plurality of lower barrier layers, a plurality of second via holes disposed on the cell region and penetrating at least one of the plurality of lower barrier layers, and a plurality of contact vias positioned within the plurality of first via holes and connected to the plurality of circuit elements. in at least one lower barrier layer of the plurality of lower barrier layers, a sum of areas of at least one of the plurality of first via holes per unit area on the pad region is equal to a sum of areas of at least one of the plurality of first via holes on the cell region and areas of the plurality of second via holes per unit area on the cell region.
Inventor(s): Yong Jin Park of Suwon-si KR for samsung electronics co., ltd., Ji Hwan Hwang of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/3105, H01L23/00, H01L23/48, H01L25/18, H10B80/00
CPC Code(s): H01L23/5283
Abstract: semiconductor package and fabricating method thereof are provided. semiconductor package comprises a buffer die including a semiconductor substrate having a first surface and a second surface, which face each other, and a passivation layer formed on the first surface, a plurality of core chips stacked on the buffer die, including a first core chip, which is disposed at a lowermost end, among the plurality of core chips, an adhesive layer between the buffer die and the first core chip, and a mold layer surrounding an upper surface of the buffer die and the plurality of core chips, wherein a plurality of recesses recessed inward from an upper surface of the passivation layer are formed on the upper surface of the passivation layer, and the plurality of recesses are formed to surround the first core chip and do not overlap the first core chip horizontally.
20250022806. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hong Jin KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/31, H01L23/498, H01L25/065, H10B80/00
CPC Code(s): H01L23/5386
Abstract: a semiconductor package includes a package substrate including a wiring structure, a plurality of external connecting terminals below the package substrate, a first semiconductor chip flip-chip bonded on and above the package substrate, a second semiconductor chip above the package substrate and horizontally spaced apart from the first semiconductor chip, and wire-bonded on the package substrate, a first power/ground pad on an upper face of the second semiconductor chip, an option pad on the package substrate and connected to the first power/ground pad by a wire, an option bump below the first semiconductor chip and connected to the option pad through the wiring structure, and a connecting bump below the first semiconductor chip and connected to a first external connecting terminal of the plurality of external connecting terminals, wherein the option bump is not electrically connected to any external connecting terminal of the plurality of external connecting terminals through only the wiring structure.
20250022811. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Myungyeon Kim of Suwon-si KR for samsung electronics co., ltd., Mihyae Park of Suwon-si KR for samsung electronics co., ltd., Minseob Kim of Suwon-si KR for samsung electronics co., ltd., Woojung Park of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/373, H01L23/538, H01L25/065
CPC Code(s): H01L23/562
Abstract: a semiconductor package includes a substrate including a first interconnection, an interposer disposed on the substrate, the interposer including a second interconnection electrically connected to the first interconnection, first and second semiconductor chips disposed on the interposer, the first and second semiconductor chips electrically connected to each other through the second interconnection, and a stiffener disposed on the substrate to be spaced apart from the interposer, the stiffener including a body portion having a cavity, and a porous thermally conductive portion within the cavity. the body portion includes a first material having a first coefficient of thermal expansion. the porous thermally conductive portion includes a second material having a second coefficient of thermal expansion, greater than the first coefficient of thermal expansion.
20250022812. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hansung Ryu of SUWON-SI KR for samsung electronics co., ltd., Jongbeom Park of SUWON-SI KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/48, H01L25/065, H10B80/00
CPC Code(s): H01L23/562
Abstract: a semiconductor package includes a first semiconductor chip that includes a first semiconductor substrate that includes an active surface and an inactive surface opposite to each other and a plurality of first through silicon vias that penetrate through the first semiconductor substrate, and a plurality of second semiconductor chips that each include a second semiconductor substrate that includes an active surface and an inactive surface opposite to each other and a plurality of second through silicon vias that penetrates through the second semiconductor substrate. each of the plurality of second semiconductor chips is stacked on the first semiconductor chip, such that the active surface of each second semiconductor substrate faces the inactive surface of the first semiconductor substrate, and the plurality of second semiconductor chips have the same vertical height.
Inventor(s): Ju-Il CHOI of Seongnam-si KR for samsung electronics co., ltd., Pil-Kyu KANG of Hwaseong-si KR for samsung electronics co., ltd., Hoechul KIM of Seoul KR for samsung electronics co., ltd., Hoonjoo NA of Seoul KR for samsung electronics co., ltd., Jaehyung PARK of Anyang-si KR for samsung electronics co., ltd., Seongmin SON of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L25/16, H01L27/146
CPC Code(s): H01L24/05
Abstract: a semiconductor device and a semiconductor package, the device including a first buffer dielectric layer on a first dielectric layer; a second dielectric layer and a second buffer dielectric layer sequentially disposed on the first buffer dielectric layer, the second buffer dielectric layer being in contact with the first buffer dielectric layer; and a pad interconnection structure that penetrates the first buffer dielectric layer and the second buffer dielectric layer, wherein the pad interconnection structure includes copper and tin.
Inventor(s): YOUNGBAE KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/48, H01L25/065
CPC Code(s): H01L24/06
Abstract: a semiconductor package includes a first semiconductor chip including a first semiconductor layer including a surface which extends in a first direction; and a first connection pad provided on the surface of the first semiconductor; and a second semiconductor chip including a second semiconductor layer; and a second connection pad provided on a surface of the second semiconductor layer. the first connection pad is directly connected to the second connection pad and a ratio of a width of the second connection pad in the first direction to a width of the first connection pad in the first direction is less than or equal to 1.1 and greater than or equal to 0.5.
Inventor(s): Hyoeun Kim of Suwon-si KR for samsung electronics co., ltd., Haksun Lee of Suwon-si KR for samsung electronics co., ltd., Dohyun Kim of Suwon-si KR for samsung electronics co., ltd., Sunkyoung Seo of Suwon-si KR for samsung electronics co., ltd., Chajea Jo of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/18, H10B80/00
CPC Code(s): H01L24/29
Abstract: the present disclosure relates to semiconductor packages and methods of fabricating the semiconductor packages. an example semiconductor package includes a first semiconductor die including a first substrate and a first bonding layer on the first substrate, a second semiconductor die disposed on the first semiconductor die, the second semiconductor die including a second substrate and a second bonding layer under the second substrate, and a silicon oxide layer interposed between the first semiconductor die and the second semiconductor die, where at least one pore is disposed in the silicon oxide layer, and the at least one pore has a height of 1 Å to 2 nm.
Inventor(s): CHOONGBIN YIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/498, H01L23/528, H01L25/00, H01L25/065, H01L25/18
CPC Code(s): H01L24/48
Abstract: an embodiment of the present invention provides a semiconductor package including: a first redistribution layer structure; a semiconductor stack structure on the first redistribution layer structure, the semiconductor stack structure including a first semiconductor die and a second semiconductor die on the first semiconductor die; a plurality of wires configured to electrically connect the second semiconductor die to the first redistribution layer structure; a substrate on the first redistribution layer structure and around the semiconductor stack structure; a molding material configured to mold the semiconductor stack structure and the wires on the first redistribution layer structure; and forming a second redistribution layer structure on the molding material.
20250022837. WIRE BONDING APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Doojin KIM of Suwon-si KR for samsung electronics co., ltd., Byongjoo KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00
CPC Code(s): H01L24/78
Abstract: a wire bonding apparatus may include a bonder and a common loader/unloader. the bonder may bond a conductive wire to a plurality of package substrates. the common loader/unloader may load the package substrates into the bonder. the common loader/unloader may unload the package substrates from the bonder. thus, an occupying area of the wire bonding apparatus in semiconductor fabrication equipment may be reduced to improve a productivity of the semiconductor fabrication equipment.
20250022842. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ilbok Lee of Suwon si KR for samsung electronics co., ltd., Sungeun Kim of Suwon si KR for samsung electronics co., ltd., Younglyong Kim of Suwon si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/498, H01L23/538, H01L25/16, H10B80/00
CPC Code(s): H01L24/83
Abstract: a semiconductor package includes a package substrate, a sub-package arranged on the package substrate, an underfill material layer arranged between the package substrate and the sub-package, a dam structure spaced apart from the sub-package, on the package substrate, and extending to surround the underfill material layer, and an ejection prevention barrier arranged on one side of the sub-package, on the package substrate, and spaced apart from the sub-package in a first horizontal direction with the dam structure therebetween, wherein a top surface of the dam structure has a first vertical level, and a top surface of the ejection prevention barrier has a second vertical level higher than the first vertical level.
Inventor(s): Hyunsoo Chung of Suwon-si KR for samsung electronics co., ltd., Jaesic Lee of Suwon-si KR for samsung electronics co., ltd., Inhyo Hwang of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/29, H01L23/31, H01L23/367, H01L23/373, H01L25/00, H01L25/18
CPC Code(s): H01L25/0652
Abstract: provided a semiconductor package including a redistribution structure, a semiconductor structure on the redistribution structure, a plurality of semiconductor stacking structures on the redistribution structure, the plurality of semiconductor stacking structures being adjacent to the semiconductor structure, and a height of each of the plurality of semiconductor stacking structures being greater than a height of the semiconductor structure, and a heat dissipation structure on the semiconductor structure, the heat dissipation structure including a plurality of through openings, wherein each semiconductor stacking structure among the plurality of semiconductor stacking structures is positioned within a corresponding through opening among the plurality of through openings, and wherein an upper surface of each of the plurality of semiconductor stacking structures is exposed through the corresponding through opening.
Inventor(s): CHOONGBIN YIM of Suwon-si KR for samsung electronics co., ltd., JONGKOOK KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498, H01L23/522, H01L23/528, H01L25/00, H01L25/18
CPC Code(s): H01L25/0652
Abstract: a semiconductor package according to an embodiment may include, a redistribution layer structure; a first semiconductor stack structure on an upper surface of the redistribution layer structure, wherein the first semiconductor stack structure includes a first chiplet and a second chiplet disposed on the first chiplet; a second semiconductor stack structure on an upper surface of the redistribution layer structure side by side with the first semiconductor stack structure; a bridge die forming an electrical connection between the first semiconductor stack structure and the second semiconductor stack structure, the bridge die being disposed above the first semiconductor stack structure and the second semiconductor stack structure; and a surface mount device (smd) disposed on an upper surface of at least one of the first semiconductor stack structure and the second semiconductor stack structure.
Inventor(s): Junghoon Kang of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L21/48, H01L23/00, H01L23/13, H01L23/31, H01L23/498, H01L23/538, H01L23/58, H01L21/56
CPC Code(s): H01L25/16
Abstract: a semiconductor package includes a wiring substrate and a first semiconductor chip disposed on the wiring substrate. the wiring substrate includes a first core portion including glass and having a cavity that vertically penetrates the first core portion, first core vias that each vertically penetrate the first core portion, a passive device in the cavity of the first core portion, a buried material on the first core portion and the first core vias and filling the cavity and covering a top surface and outer lateral surfaces of the first core portion, and an upper buildup portion disposed on the buried material. the upper buildup portion includes a first dielectric pattern, and a first wiring pattern that penetrates the first dielectric pattern and the buried material and is coupled to the first core vias.
Inventor(s): Chengtar Wu of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L21/56, H01L23/00, H01L23/31, H01L23/498, H01L23/538, H10B80/00
CPC Code(s): H01L25/16
Abstract: a semiconductor package according to an embodiment includes an interposer including a power distribution structure, and a redistribution structure on the power distribution structure; a first semiconductor die on the interposer; and a second semiconductor die on the interposer, wherein the power distribution structure may include a power distribution module connected to the bottom surface of the redistribution structure; a plurality of conductive posts connected to the bottom surface of the redistribution structure; and a molding material for molding the power distribution module and the plurality of conductive posts.
Inventor(s): Kyungwook HWANG of Suwon-si KR for samsung electronics co., ltd., Junsik Hwang of Suwon-si KR for samsung electronics co., ltd., Sanghoon Song of Suwon-si KR for samsung electronics co., ltd., Joonyong Park of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L23/544, H01L33/38, H01L33/62
CPC Code(s): H01L25/167
Abstract: a display device and a method of manufacturing the display device are provided. the display device includes a display substrate including a driving circuit; an array layer provided on the display substrate and including a plurality of grooves; a micro-semiconductor chip provided in a groove of the plurality of grooves, the micro-semiconductor chip including: an n-type semiconductor layer; an active layer provided on the n-type semiconductor layer; a p-type semiconductor layer provided on the active layer; and a first electrode provided on the p-type semiconductor layer; and a second electrode connected to the n-type semiconductor layer from a lower surface of the display substrate; a first wiring connected to the first electrode; and a second wiring connected to the second electrode.
20250022866. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sanghyeon JEONG of Suwon-si KR for samsung electronics co., ltd., Hyunki KIM of Suwon-si KR for samsung electronics co., ltd., Junga LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L23/498, H01L23/00
CPC Code(s): H01L25/18
Abstract: a semiconductor package includes a substrate, a passive element on the substrate, and a connection terminal connecting the substrate to the passive element. the substrate includes a base portion comprising an element pad connected to the connection terminal, and an upper insulating layer on the base portion to expose at least a portion of the base portion. the passive element is in contact with the upper insulating layer, and a thickness of the connection terminal and a thickness of the upper insulating layer are equal to each other.
20250022867. DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dooho JEONG of Suwon-si KR for samsung electronics co., ltd., Taehun KIM of Suwon-si KR for samsung electronics co., ltd., Hanul YOO of Suwon-si KR for samsung electronics co., ltd., Taesung JANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L23/00, H01L27/15
CPC Code(s): H01L25/18
Abstract: a display apparatus includes a circuit board including driving circuits; and a pixel array on the circuit board and including a plurality of pixels, wherein the pixel array includes led cells having a pillar shape and including first and second conductivity-type semiconductor layers and an active layer, wherein a width thereof is 100 �m or less, and a height thereof is greater than the width; a transparent electrode on lower surfaces of the led cells and including a cone or pyramid-shaped inclined portion; a passivation layer disposed on side surfaces of the led cells and extending from a side surface of the led cell to a side surface of the inclined portion of the transparent electrode.
Inventor(s): YOUNG-DEUK KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L23/00, H01L23/31, H01L23/48, H10B80/00
CPC Code(s): H01L25/18
Abstract: a semiconductor package includes: a first base chip including a plurality of first vias; a chip stack disposed on the first base chip; and a second base chip disposed between the first base chip and the chip stack, wherein the second base chip includes a plurality of second vias, wherein the chip stack includes memory chips that are stacked on the second base chip, wherein each of the memory chips includes a plurality of third vias, and wherein the first base chip and the second base chip are logic chips.
Inventor(s): Sunjung Lee of Suwon-si KR for samsung electronics co., ltd., Donggon Yoo of Suwon-si KR for samsung electronics co., ltd., Jeongwon Hwang of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/06, H01L23/522, H01L27/02, H01L27/092
CPC Code(s): H01L27/0688
Abstract: the present disclosure relates to three-dimensional semiconductor devices. an example three-dimensional semiconductor device includes a back-side metal layer, a lower active region on the back-side metal layer, the lower active region including a lower channel pattern and a lower source drain pattern connected with the lower channel pattern, an upper active region on the lower active region, the upper active region including an upper channel pattern and an upper source drain pattern connected with the upper channel pattern, an interlayer insulating layer enclosing the lower and upper source drain patterns, a penetration conductive pattern extending through the interlayer insulating layer in a vertical direction, and an inhibitor covering a side surface of a lower portion of the penetration conductive pattern. the inhibitor includes a carbon atom.
Inventor(s): Sung Min KIM of Incheon KR for samsung electronics co., ltd., Dae Won HA of Seoul KR for samsung electronics co., ltd.
IPC Code(s): H01L27/06, H01L21/768, H01L21/822, H01L23/528, H01L27/088, H01L27/146, H01L29/417, H01L29/78
CPC Code(s): H01L27/0688
Abstract: a semiconductor device including: a lower semiconductor substrate; an upper semiconductor substrate overlapping the lower semiconductor substrate, the upper semiconductor substrate including a first surface and a second surface opposite to the first surface; an upper gate structure on the first surface of the upper semiconductor substrate; a first interlayer insulation film which covers the upper gate structure, wherein the first interlayer insulation film is between the lower semiconductor substrate and the upper semiconductor substrate; and an upper contact connected to the lower semiconductor substrate, wherein the upper contact is on a side surface of the upper gate structure, wherein the upper contact includes a first portion penetrating the upper semiconductor substrate, and a second portion having a side surface adjacent to the side surface of the upper gate structure, and a width of the first portion decreases toward the second surface.
Inventor(s): Seokho YUN of Suwon-si KR for samsung electronics co., ltd., Sookyoung Roh of Suwon-si KR for samsung electronics co., ltd., Daekwan Kim of Suwon-si KR for samsung electronics co., ltd., Yohwan Noh of Suwon-si KR for samsung electronics co., ltd., Jangho Moon of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146, G02B3/00
CPC Code(s): H01L27/14627
Abstract: an image sensor includes a sensor substrate including a plurality of pixels that are two-dimensionally disposed in a first direction and a second direction; and a nano-photonic lens array including a first pixel corresponding region, a second pixel corresponding region, a third pixel corresponding region, and a fourth pixel corresponding region respectively corresponding to the plurality of pixels, wherein each of the first to fourth pixel corresponding regions includes a plurality of nano-structures that are arranged to condense light of a first wavelength, light of a second wavelength, and light of a third wavelength respectively onto the plurality of pixels, and in each of the second pixel corresponding region and the fourth pixel corresponding region, cross-sectional area sizes of the plurality of nano-structures are distributed asymmetrically in the first direction, the second direction, and a first diagonal direction, and are distributed symmetrically in a second diagonal direction that crosses the first diagonal direction.
Inventor(s): Jinyoung KIM of Suwon-si KR for samsung electronics co., ltd., Junghyun Kim of Suwon-si KR for samsung electronics co., ltd., Junsik Lee of Suwon-si KR for samsung electronics co., ltd., Jonghoon Park of Suwon-si KR for samsung electronics co., ltd., Yun Ki Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/1463
Abstract: an image sensor includes: a substrate including a first side and a second side facing the first side; pixels including a photoelectric conversion layer in the substrate and a transistor on the first side of the substrate; and a pixel separating pattern between the pixels, wherein the pixel separating pattern includes a first separating pattern, a second separating pattern, and a third separating pattern, the second separating pattern is conductive, and the first separating pattern and the third separating pattern are non-conductive, the second separating pattern is nearer the first side of the substrate than is the third separating pattern, and a first end of the first separating pattern, a first end of the second separating pattern, and a first end of the third separating pattern are on the second side of the substrate.
Inventor(s): Mingwan Cho of Daejeon KR for samsung electronics co., ltd., Jonghwa Shin of Daejeon KR for samsung electronics co., ltd., Joonkyo Jung of Daejeon KR for samsung electronics co., ltd., Shin Ho Lee of Suwon-si, Gyeonggi-do KR for samsung electronics co., ltd., Min Sung Heo of Suwon-si, Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H01L31/105
CPC Code(s): H01L27/14647
Abstract: an image sensor pixel includes first, second and third pin photodiodes having respective first, second and third widths, which are unequal to each other, and respective first, second and third absorption spectra associated therewith, which are unequal to each other. the first absorption spectra is a first linear combination of three color matching functions divided by a wavelength of light incident the image sensor, the second absorption spectra is a second linear combination of the three color matching functions divided by a wavelength of light incident the image sensor, and the third absorption spectra is a third linear combination of the three color matching functions divided by a wavelength of light incident the image sensor.
Inventor(s): Youngtek OH of Suwon-si KR for samsung electronics co., ltd., Geonwook Yoo of Seoul KR for samsung electronics co., ltd., Kyungwook Hwang of Suwon-si KR for samsung electronics co., ltd., Changkun Park of Seoul KR for samsung electronics co., ltd., Sanghoon Song of Suwon-si KR for samsung electronics co., ltd., Minjae Yeom of Seoul KR for samsung electronics co., ltd., Gyuhyung Lee of Seoul KR for samsung electronics co., ltd., Junsik Hwang of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L29/20, H01L29/66, H01L29/778, H01L33/00
CPC Code(s): H01L29/41766
Abstract: a semiconductor device includes a channel layer including a first group iii-v semiconductor material; a barrier layer provided on an upper surface of the channel layer, the barrier layer including a second group iii-v semiconductor material that is different than the first group iii-v semiconductor material; a plurality of sources/drains spaced apart from each other on an upper surface of the barrier layer; a gate insulating layer covering the upper surface of the barrier layer and upper surfaces of the plurality of sources/drains; a gate provided on an upper surface of the gate insulating layer, the gate not overlapping the plurality of sources/drains; a plurality of source/drain electrodes electrically connected to corresponding sources/drains among the plurality of sources/drains; and a gate electrode electrically connected to the gate, wherein the plurality of source/drain electrodes has a diagonally symmetrical arrangement.
20250022930. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sunjung Lee of Suwon-si KR for samsung electronics co., ltd., Donggon Yoo of Suwon-si KR for samsung electronics co., ltd., Jeongwon Hwang of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L23/522, H01L23/528, H01L23/532, H01L29/06, H01L29/417, H01L29/49, H01L29/775, H01L29/786
CPC Code(s): H01L29/42392
Abstract: a semiconductor device may include a substrate including an active pattern, a channel pattern on the active pattern, the channel pattern including semiconductor patterns vertically stacked to be spaced apart from each other, a gate electrode on the plurality of semiconductor patterns, a gate contact electrically connected to the gate electrode, a first metal layer on the gate contact, the first metal layer including a first conductive via and a first interconnection pattern on the first conductive via, a second metal layer on the first metal layer, the second metal layer including a second conductive via and a second interconnection pattern on the second conductive via, and a diffusion prevention pattern between the first interconnection pattern and the second conductive via. a level of a bottom surface of the diffusion prevention pattern may be lower than a level of the topmost surface of the first interconnection pattern.
20250022941. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Beomjin PARK of Hwaseong-si KR for samsung electronics co., ltd., Dongwon KIM of Seongnam-si KR for samsung electronics co., ltd., Bongseok SUH of Seoul KR for samsung electronics co., ltd., Daewon KIM of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L29/10, H01L29/417, H01L29/78
CPC Code(s): H01L29/6681
Abstract: a semiconductor device includes a first and second active regions extending in a first direction and having respective first and second widths in a second direction, the second width greater than the first width, a connection region connected to the first and second active regions and having a third width, between the first and second widths in the second direction, first and second gate structures respectively intersecting the first and second active regions and extending in the second direction, and a dummy structure intersecting at least a portion of the connection region, extending in the second direction, and between the first and second gate structures in the first direction. the dummy structure includes first and second pattern portions spaced apart from a side surface of the first gate structure by respective first and second distances in the first direction, the second distance greater than the first distance.
20250022944. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungil Park of Suwon-si KR for samsung electronics co., ltd., Minsu Seol of Suwon-si KR for samsung electronics co., ltd., Minseok Yoo of Suwon-si KR for samsung electronics co., ltd., Jaehyun Park of Suwon-si KR for samsung electronics co., ltd., Kyungeun Byun of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/76, H01L21/02, H01L27/092, H01L29/06, H01L29/24, H01L29/417, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L29/7606
Abstract: a semiconductor device includes a fin-type active region that extends in length in a first horizontal direction on a substrate, a horizontal semiconductor layer on the fin-type active region, a seed layer on the fin-type active region and in contact with the horizontal semiconductor layer, a gate line that surrounds the horizontal semiconductor layer and the seed layer, on the fin-type active region, and that extends in length in a second horizontal direction that intersects the first horizontal direction, and a pair of vertical semiconductor layers respectively on first and second sides of the horizontal semiconductor layer in the first horizontal direction, on the fin-type active region, with the horizontal semiconductor layer therebetween, wherein an inner wall of each of the first and second vertical semiconductor layers contacts the horizontal semiconductor layer, and upper or lower surfaces of the vertical semiconductor layers contact the seed layer.
Inventor(s): Sung Uk JANG of Suwon-si KR for samsung electronics co., ltd., Young Dae CHO of Suwon-si KR for samsung electronics co., ltd., Ki Hwan KIM of Suwon-si KR for samsung electronics co., ltd., Su Jin JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L29/08, H01L29/423, H01L29/786
CPC Code(s): H01L29/7851
Abstract: a semiconductor device includes an active region extending in a first direction on a substrate, channel layers on the active region and spaced apart vertically, a gate structure intersecting the active region and the channel layers, the gate structure extending in a second direction and surrounding the channel layers, and a source/drain region on the active region at a side of the gate structure, the source/drain region contacting the channel layers, the source/drain region including first epitaxial layers having a first composition and including first layers on side surfaces of the channel layers and a second layer on the active region at a lower end of the source/drain region, and a second epitaxial layer having a second composition different from the first composition, the second epitaxial layer being between the first epitaxial layers in the first direction and being between the first epitaxial layers vertically in a third direction.
Inventor(s): Sanghoon SONG of Suwon-si KR for samsung electronics co., ltd., Kyungwook HWANG of Suwon-si KR for samsung electronics co., ltd., Junsik HWANG of Suwon-si KR for samsung electronics co., ltd., Dongho KIM of Suwon-si KR for samsung electronics co., ltd., Joonyong PARK of Suwon-si KR for samsung electronics co., ltd., Youngtek OH of Suwon-si KR for samsung electronics co., ltd., Minchul YU of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L33/00
CPC Code(s): H01L33/0093
Abstract: a chemical lift-off device includes a first chamber including a first bath containing a first chemical solution and configured to receive a semiconductor light-emitting device on a substrate, such that the semiconductor light-emitting device is partially separated from the substrate by being submerged in the first chemical solution, a cleaning bath containing deionized water and configured to receive the semiconductor light-emitting device that is partially separated from the substrate, and a second chamber including a separator including a chemical solution sprayer configured to spray a second chemical solution toward the semiconductor light-emitting device that is partially separated from the substrate, such that the semiconductor light-emitting device is completely separated from the substrate by being sprayed with the second chemical solution and a recovery assembly provided at a lower portion of the separator and configured to recover the semiconductor light-emitting device that is completely separated from the substrate.
20250022995. LIGHT-EMITTING DEVICE PACKAGES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ilseop Won of Suwon-si KR for samsung electronics co., ltd., Changhoon Kwak of Suwon-si KR for samsung electronics co., ltd., Chulsoo Yoon of Suwon-si KR for samsung electronics co., ltd., DONGSOO LEE of Suwon-si KR for samsung electronics co., ltd., Seunggyun Jung of Suwon-si KR for samsung electronics co., ltd., Sujong Han of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L33/60, H01L25/075, H01L33/62
CPC Code(s): H01L33/60
Abstract: a light-emitting device package includes a circuit board, a light-emitting device mounted on the circuit board, a reflective sheet disposed on the circuit board, the reflective sheet including an opening penetrating through the reflective sheet, wherein the light-emitting device is disposed within the opening, an inclined portion surrounding the opening when viewed in a plan view, and being inclined at a first angle with respect to an upper surface of the circuit board, and a flat extension portion surrounding the inclined portion when viewed in a plan view, and being parallel to the upper surface of the circuit board, and a diffuser plate disposed at a first vertical distance from the upper surface of the circuit board. an air gap is disposed between the upper surface of the circuit board and the flat extension portion.
20250022998. FILM PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seunghyun Cho of Suwon-si KR for samsung electronics co., ltd., Jaemin Jung of Suwon-si KR for samsung electronics co., ltd., Jeongkyu Ha of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L33/62, H01L25/075, H01L25/16, H01L33/48
CPC Code(s): H01L33/62
Abstract: a film package includes a film substrate, vias penetrating through the film substrate, interconnection patterns on the film substrate, and a semiconductor chip electrically connected to at least one of the interconnection patterns and to the vias, wherein the interconnection patterns include input patterns, first output patterns, and second output patterns, the film package includes input pads on a surface of the film substrate, and the input patterns extend from the input pads, the film package includes first output pads positioned toward a first edge of the film substrate on a first surface of the film substrate, and the first output patterns extend from the first output pads, and the film package includes second output pads positioned toward a second edge of the film substrate on a second surface of the film substrate opposite to the first surface, and the second output patterns extend from the second output pads.
Inventor(s): Kyunghoon CHO of Yongin-si KR for samsung electronics co., ltd., Hwiyeol PARK of Ansan-si KR for samsung electronics co., ltd., Jin S. HEO of Hwaseong-si KR for samsung electronics co., ltd., Hojung YANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01M10/052, H01M4/04, H01M4/139, H01M4/66, H01M6/40, H01M10/04, H01M10/0562, H01M10/0583
CPC Code(s): H01M10/052
Abstract: a secondary battery includes a first electrode collector layer and a second electrode collector layer, which face each other, a plurality of first active material layers that electrically contact the first electrode collector layer and are substantially perpendicular to the first electrode collector layer, a plurality of second active material layers that electrically contact the second electrode collector layer and are substantially perpendicular to the second electrode collector layer, and a first conductor layer that electrically contacts the first electrode collector layer and is inserted into the plurality of first active material layers.
Inventor(s): Yuntong Zhu of Cambridge MA US for samsung electronics co., ltd., Jesse Hinricher of Pipestone MN US for samsung electronics co., ltd., Zachary Hood of Bolingbrook IL US for samsung electronics co., ltd., Lincoln Miara of Lincoln MA US for samsung electronics co., ltd., Heung Chan Lee of Gyeonggi-do KR for samsung electronics co., ltd., Won Seok Chang of Seoul KR for samsung electronics co., ltd., Jennifer Rupp of Cambridge MA US for samsung electronics co., ltd.
IPC Code(s): H01M10/0562
CPC Code(s): H01M10/0562
Abstract: a multi-phase electrolyte film includes a first phase comprising a metal oxide, wherein the metal oxide is amorphous, crystalline, or a glass; and a second phase comprising a lithium salt having a decomposition temperature in air of greater than 200� c. or a lithium halide. the first phase is dispersed in the second phase and has an average particle size of 5 to 200 nanometers. methods for the manufacture of the electrolyte film are also disclosed.
Inventor(s): Jiho KIM of Suwon-si KR for samsung electronics co., ltd., Yoonjung KIM of Suwon-si KR for samsung electronics co., ltd., Kyungmoon SEOL of Suwon-si KR for samsung electronics co., ltd., Seongyong AN of Suwon-si KR for samsung electronics co., ltd., Minkyung LEE of Suwon-si KR for samsung electronics co., ltd., Kyihyun JANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01Q1/22, H01Q1/24
CPC Code(s): H01Q1/2266
Abstract: an electronic device is provided. the electronic device includes a first housing including a first plate including an opening and a slit formed along a surface of the first plate from a periphery of the opening, a second housing including a second plate spaced apart from the first plate and at least partially overlapping the opening, and coupled to the first housing to be movable along a first direction or a second direction that is opposite to the first direction with respect to the first housing, a wireless communication circuit electrically connected to the second plate, and a first printed circuit board electrically connected to the wireless communication circuit and extending along a periphery of the opening formed in the first plate to feed through an end connected to the slit, wherein the wireless communication circuit is configured to communicate with an external electronic device in a designated frequency band through the first plate and the second plate.
Inventor(s): Seongyong AN of Suwon-si KR for samsung electronics co., ltd., Jiho KIM of Suwon-si KR for samsung electronics co., ltd., Mincheol SEO of Suwon-si KR for samsung electronics co., ltd., Kyungmoon SEOL of Suwon-si KR for samsung electronics co., ltd., Kyihyun JANG of Suwon-si KR for samsung electronics co., ltd., Gyubok PARK of Suwon-si KR for samsung electronics co., ltd., Yoonjae LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q23/00
CPC Code(s): H01Q1/243
Abstract: an electronic device according to an embodiment comprises: a first housing including a first conductive portion and a side including a first non-conductive portion; a second housing including a second non-conductive portion and coupled to the first housing to be movable with respect to the first housing; a display; and a wireless communication circuit. the second non-conductive portion, in a first state, includes a first portion overlapping at least a portion of the first conductive portion and a second portion extending from the first portion to a first lateral surface of the second housing, and the second portion, in a second state, is spaced apart from the first non-conductive portion.
Inventor(s): Sujin CHO of Suwon-si KR for samsung electronics co., ltd., Kihwan KWON of Suwon-si KR for samsung electronics co., ltd., Byungjoon KIM of Suwon-si KR for samsung electronics co., ltd., Heejin PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01Q3/06, H01Q1/22
CPC Code(s): H01Q3/06
Abstract: an electronic device is provided. the electronic device includes a housing including a support, a printed circuit board disposed in the housing, at least one processor disposed on the printed circuit board, a first antenna module spaced apart from the printed circuit board in the housing, a flexible printed circuit board disposed in the housing, and coupled to the printed circuit board and the first antenna module, to electrically connect the printed circuit board and the first antenna module, a second antenna module disposed in the housing, and including a base substrate and a conductive pattern disposed on the base substrate, and a conductive sheet, wherein the flexible printed circuit board is at least partially overlapped with the second antenna module in a direction of a rear surface of the housing, between the printed circuit board and the first antenna module, and wherein at least a portion of the conductive sheet is disposed between the second antenna module and the flexible printed circuit board at a portion where the second antenna module and the flexible printed circuit board overlap.
Inventor(s): Jongsuk KIM of Suwon-si KR for samsung electronics co., ltd., Gyusub KIM of Suwon-si KR for samsung electronics co., ltd., Seho KIM of Suwon-si KR for samsung electronics co., ltd., Seunghwan KIM of Suwon-si KR for samsung electronics co., ltd., Un KIM of Suwon-si KR for samsung electronics co., ltd., Yongjoo SHIN of Suwon-si KR for samsung electronics co., ltd., Myunghun JEONG of Suwon-si KR for samsung electronics co., ltd., Jaewon CHOE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01Q7/00, G04G17/06, H01Q1/27, H04B5/26
CPC Code(s): H01Q7/00
Abstract: a wearable device may include: a metal frame; a display; a printed circuit board (pcb); a wireless charging coil; a conductive member disposed between the wireless charging coil and the pcb, facing the wireless charging coil, and spaced apart from the wireless charging coil; and a wireless communication circuit disposed on the pcb. the wireless communication circuit may be configured to transmit or receive a radio frequency (rf) signal using the metal frame, the conductive member may be coupled to the wireless charging coil, and the conductive member, the wireless charging coil, and the display may be configured to be a ground for the metal frame.
Inventor(s): Jiantong Li of McKinney TX US for samsung electronics co., ltd., Sung-Chul Park of Seoul KR for samsung electronics co., ltd., Jianhua Mo of Allen TX US for samsung electronics co., ltd., Aditya Dave of Plano TX US for samsung electronics co., ltd., Young Han Nam of Plano TX US for samsung electronics co., ltd., Won Suk Choi of McKinney TX US for samsung electronics co., ltd., Gang Xu of Allen TX US for samsung electronics co., ltd.
IPC Code(s): H01Q25/00, H01Q1/38
CPC Code(s): H01Q25/001
Abstract: an apparatus includes a first, second, and third substrates. the first substrate includes a first antenna element supporting a first frequency band and a second frequency band higher than the first frequency band. the first substrate includes a first dielectric material having a first dielectric constant. the second substrate includes a second antenna element supporting the first frequency band and the second frequency band. the second substrate includes the first dielectric material. the third substrate is disposed between the first substrate and the second substrate and includes a third antenna element supporting the second frequency band. the third substrate includes a second dielectric material having a second dielectric constant lower than a first dielectric constant. the first and second antenna elements form a first beam in the first frequency band. the first, second, and third antenna elements form a second beam in the second frequency band.
Inventor(s): Yeunhee HUH of Suwon-si KR for samsung electronics co., ltd., Tae-Hwang KONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H02M3/07
CPC Code(s): H02M3/07
Abstract: there is provided a power converter including a first circuit, a second circuit and a controller. the first circuit includes a switched inductor circuit and outputs a current based on a first voltage as an input. the second circuit includes a switched capacitor circuit and an output capacitor and outputs a second voltage lower than the first voltage, based on the current output by the first circuit as an input. the controller controls the second circuit to output the second voltage.
Inventor(s): Kibaek KWON of Suwon-si KR for samsung electronics co., ltd., Donghyuk LIM of Suwon-si KR for samsung electronics co., ltd., Youngho CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H03F1/42, H03F3/45
CPC Code(s): H03F1/42
Abstract: an amplification circuit includes an amplifier comprising an input terminal and an output terminal, a first inductor unit connected to the input terminal, and a second inductor unit connected to the output terminal. the first inductor unit and the second inductor unit may be inductively coupled to each other so that a change in output voltage of the amplification circuit is positively fed back.
Inventor(s): KYUNGHYUN YOON of Suwon-si KR for samsung electronics co., ltd., JEONGYEOL BAE of Suwon-si KR for samsung electronics co., ltd., JONGSOO LEE of Suwon-si KR for samsung electronics co., ltd., SANGMIN YOO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H03F3/24, H03D7/00, H03F1/56, H04B1/04
CPC Code(s): H03F3/245
Abstract: disclosed is an rf circuit, which includes a mixer that converts a first signal into a second signal using a local oscillator (lo) signal, an amplifier that amplifies the second signal, and an impedance tuner circuit connected between the mixer and an input terminal of the amplifier, and that adjusts a conversion gain of the mixer by presenting a variable impedance.
Inventor(s): Gunhyuk YOON of Suwon-si KR for samsung electronics co., ltd., Kiwon KIM of Suwon-si KR for samsung electronics co., ltd., Seungnam KIM of Suwon-si KR for samsung electronics co., ltd., Byounghee LEE of Suwon-si KR for samsung electronics co., ltd., Joonrae CHO of Suwon-si KR for samsung electronics co., ltd., Janghoon HONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H03G3/30, H04R1/26, H04R29/00
CPC Code(s): H03G3/30
Abstract: according to an embodiment, an electronic device may include: a first speaker configured to output a first audio signal corresponding to a first frequency band, a second speaker configured to output a second audio signal corresponding to a second frequency band at least partly different from the first frequency band, at least one amplifier configured to provide a first output signal for controlling output of the first speaker and a second output signal for controlling output of the second speaker, and at least one processor, comprising processing circuitry, operatively connected to the at least one amplifier. at least one processor, individually and/or collectively, may be configured to determine the first output signal, at least partly based on a first output control method; output the first audio signal, at least partly based on the first output signal, using the first speaker connected to the at least one amplifier; determine the second output signal, at least partly based on a second output control method; and output the second audio signal, at least partly based on the second output signal, using the second speaker connected to the at least one amplifier.
Inventor(s): WOOSEUK OH of SUWON-SI KR for samsung electronics co., ltd., DONGUK PARK of SUWON-SI KR for samsung electronics co., ltd., KIHWAN SEONG of SUWON-SI KR for samsung electronics co., ltd., BYOUNGJOO YOO of SUWON-SI KR for samsung electronics co., ltd.
IPC Code(s): H03K5/156, G11C7/22, H03K3/037
CPC Code(s): H03K5/1565
Abstract: a duty cycle corrector (dcc) includes a first duty cycle correction circuit, a second duty cycle correction circuit, and overshoot prevention circuit connected between the first duty cycle correction circuit and the second duty cycle correction circuit. each of the duty cycle correction circuits include a capacitor, two inverters, a resister, and two switches.
Inventor(s): Fei Tong of Cambridge GB for samsung electronics co., ltd., Paul Nicholas Fletcher of Cambridge GB for samsung electronics co., ltd.
IPC Code(s): H04B1/04
CPC Code(s): H04B1/0475
Abstract: a method of digital memoryless pre-distortion includes receiving an input digital signal from a signal source, calculating a look-up table (lut) address from the input signal and a power scale, updating an lut value associated with the lut address based on the input signal and an output signal that is output from a power amplifier to a wireless communications channel, linearizing the output signal with the updated lut value, and outputting the output signal to the wireless communications channel. the steps of updating an lut value associated with the lut address and linearizing the output signal with the updated lut value are repeated until a level of linearization is achieved that meets a pre-defined standard.
Inventor(s): Junyoung CHOI of Suwon-si KR for samsung electronics co., ltd., Jonghoe KOO of Suwon-si KR for samsung electronics co., ltd., Hyunseob OH of Suwon-si KR for samsung electronics co., ltd., Mingyu LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04B1/7163, H04W8/00, H04W76/10
CPC Code(s): H04B1/7163
Abstract: an operation method of a first uwb (ultra wide band) device according to an embodiment of the present disclosure may include the steps of: transmitting, through uwb channels, data from a data round in a data block to a plurality of uwb devices; receiving, through nb (narrow band) channels, first feedback information for the data from a second uwb device from among the plurality of uwb devices; and processing the data on the basis of the first feedback information.
Inventor(s): Belkacem MOUHOUCHE of Staines GB for samsung electronics co., ltd.
IPC Code(s): H04B7/0408, H04L5/00, H04W72/044
CPC Code(s): H04B7/0408
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed is a method of performing multicast transmission in a telecommunication system comprising: a base station, gnb, transmitting a message to a plurality of user equipments. ues, on a plurality of beams from the base station; one of the plurality of ues receiving the message via a main beam and one or more additional beams; the one of the plurality of ues combining the messages received via the main beam and the one or more additional beams and decoding the message.
Inventor(s): Doyoung JUNG of Suwon-si KR for samsung electronics co., ltd., Sangkyou RYOU of Suwon-si KR for samsung electronics co., ltd., Junhee JEONG of Bucheon-si KR for samsung electronics co., ltd., Ingil BAEK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04B7/0426, H04B7/0408, H04B7/08
CPC Code(s): H04B7/043
Abstract: the present disclosure relates to a pre-5-generation (5g) or 5g communication system to be provided for supporting higher data rates beyond 4-generation (4g) communication system such as long term evolution (lte). an apparatus of a terminal in a wireless communication system is provided. the apparatus includes at least one transceiver and at least one processor operatively coupled to the at least one transceiver. the at least one processor is configured to control the transceiver to communicate through a cell determined based on information regarding a strength of a received signal for a first cell and a path diversity (pd) for the first cell. the pd comprises information regarding paths associated with the first cell.
Inventor(s): Jeongho Jeon of San Jose CA US for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX US for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04L5/00, H04W72/231
CPC Code(s): H04B7/0626
Abstract: a method for a user equipment (ue) to report channel state information (csi) includes receiving: first information related to a csi reference signal (csi-rs) resource set including one or more non-zero power csi-rss (nzp csi-rss) on a cell, second information related to a csi report including a first number of csi report sub-configurations corresponding to respective csi sub-reports, third information related to association between the one or more nzp csi-rss and the respective first number of csi report sub-configurations, fourth information related to indicating a second number of csi report sub-configurations from the first number of csi report sub-configurations, and the one or more nzp csi-rss based on the first information. the method further includes determining the second number of csi sub-reports and transmitting an ul channel with the csi report including the second number of csi sub-reports.
Inventor(s): Mustafa Furkan Ozkoc of The Colony TX US for samsung electronics co., ltd., Jianhua Mo of Allen TX US for samsung electronics co., ltd., Jeehwan Noh of Suwon-si KR for samsung electronics co., ltd., Hyejin Kim of Suwon-si KR for samsung electronics co., ltd., Young Han Nam of Plano TX US for samsung electronics co., ltd.
IPC Code(s): H04B7/08, H04W24/10
CPC Code(s): H04B7/088
Abstract: a method includes determining a beam measurement periodicity for beam reporting by a user equipment (ue) for use in beam tracking. the method also includes performing beam tracking according to the beam measurement periodicity. the method also includes adaptively increasing or decreasing the beam measurement periodicity based on information related to at least one of a ue measurement report, a current network state, a ue state, or a previously observed network behavior. the method also includes performing additional beam tracking according to the adaptively increased or decreased beam measurement periodicity.
Inventor(s): Jinyong Park of Suwon-si KR for samsung electronics co., ltd., Kyungho Ryu of Suwon-si KR for samsung electronics co., ltd., Yongil Kwon of Suwon-si KR for samsung electronics co., ltd., Alankyongho Kim of Suwon-si KR for samsung electronics co., ltd., Yong-Yun Park of Suwon-si KR for samsung electronics co., ltd., Jung-Pil Lim of Suwon-si KR for samsung electronics co., ltd., Hyunwook Lim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L1/00
CPC Code(s): H04L1/0073
Abstract: provided is a communication system including a first electronic device and a second electronic device connected with each other through first and second channels. the second electronic device includes a reception driver generating a first internal signal based on a first data signal provided by the first electronic device through the first channel, an error detector generating an error detection signal by determining whether an error is included in the first internal signal, and an error adjuster outputting a first feedback signal through the second channel based on the error detection signal, and the first electronic device outputs a second data signal having a voltage swing width determined based on the first feedback signal through the first channel.
Inventor(s): Dalin Zhu of Allen TX US for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX US for samsung electronics co., ltd.
IPC Code(s): H04L5/00
CPC Code(s): H04L5/0051
Abstract: methods and apparatuses for channel state information (csi) resource configuration in a wireless communication system. a method for operating a user equipment includes receiving a first and second configurations for a first and second sets of reference signal (rs) resources, respectively, configured in a csi resource setting, receiving a first set of rss through the first set of rs resources, and receiving a second set of rss through the second set of rs resources. the method further includes measuring at least one rs in the first or second sets of rss, determining, based on the measured at least one rs, one or more resource indicators or one or more beam metrics, determining, based on the first or second configurations, a first csi report or a second csi report; and transmitting, in the first or second csi reports, the one or more resource indicators or the one or more beam metrics.
Inventor(s): Ahmet Can MERT of Graz AT for samsung electronics co., ltd., . AIKATA of Graz AT for samsung electronics co., ltd., Sujoy SINHA ROY of Graz AT for samsung electronics co., ltd., Sunmin KWON of Suwon-si KR for samsung electronics co., ltd., Maksim DERIABIN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L9/00
CPC Code(s): H04L9/008
Abstract: an operation method includes obtaining an input matrix including a coefficient of a polynomial, based on a preprocessing unit (pu), performing a preprocessing operation on the coefficient, based on a first number-theoretic transform (ntt) architecture, performing a first ntt operation on a column element of the input matrix for which the preprocessing operation is completed, performing a hadamard product operation between a result of the first ntt operation and a twiddle factor, and based on a second ntt architecture, performing a second ntt operation on a row element of the input matrix for which the hadamard product operation is completed.
Inventor(s): Aikata AIKATA of Graz AT for samsung electronics co., ltd., Ahmet Can MERT of Graz AT for samsung electronics co., ltd., Sujoy SINHA ROY of Graz AT for samsung electronics co., ltd., Sunmin KWON of Suwon-si KR for samsung electronics co., ltd., Maksim DERIABIN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L9/00, H01L23/498, H01L25/16, H04L9/30
CPC Code(s): H04L9/008
Abstract: an electronic device includes a substrate, an interposer attached to a top of the substrate and comprising a plurality of through-silicon vias (tsvs), a plurality of core chiplets attached to a top of the interposer, and a plurality of memory chiplets attached to the top of the interposer, wherein each of the plurality of core chiplets comprises a number-theoretic transform (ntt) module.
Inventor(s): Qi LI of Beijing CN for samsung electronics co., ltd., Di SU of Beijing CN for samsung electronics co., ltd., Bowen YANG of Beijing CN for samsung electronics co., ltd., Chen QIAN of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04L27/26, H04L1/00, H04W8/22, H04W52/36
CPC Code(s): H04L27/2618
Abstract: the disclosure relates to a 5generation (5g) communication system or a 6generation (6g) communication system for supporting a higher data rate than a 4generation (4g) communication system, such as long term evolution (lte). a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes transmitting a first message to a first network node, wherein the first message indicates whether the ue has a capability related to supporting peak-to-average power ratio (papr) processing, or the first message indicates whether the ue has a capability related to supporting tone reservation (tr) technology, receiving a second message transmitted by the first network node, wherein the second message informs the ue to use or not to use tr technology, determining information of reserved tones when using tr technology according to the second message, wherein the information of reserved tones includes at least one of the proportion, number, or position of reserved tones, determining an uplink signal based on the information of reserved tones, and transmitting the uplink signal.
Inventor(s): Ashok Kumar NAYAK of Bangalore IN for samsung electronics co., ltd., Lalith KUMAR of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): H04L67/143, H04W48/18, H04W76/30, H04W84/12
CPC Code(s): H04L67/143
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by an amf entity in a wireless communication system, the method comprising: identifying whether a first ladn service area for a dnn and s-nssai is removed, and transmitting, to a smf entity, a message for requesting a release of an ongoing pdu session subjected to an ladn in case that the first ladn service area is removed.
Inventor(s): Seoyoung JIN of Suwon-si KR for samsung electronics co., ltd., Oheon KWON of Suwon-si KR for samsung electronics co., ltd., Kyusung KIM of Suwon-si KR for samsung electronics co., ltd., Byungwoo MIN of Suwon-si KR for samsung electronics co., ltd., Jeongwon YANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04M1/02
CPC Code(s): H04M1/0216
Abstract: an electronic device includes a first housing; a second housing, a hinge foldably connecting the first housing and the second housing to each other along a folding axis, a plurality of sensors including a hall sensor and at least one inertial sensor; and at least one processor. the at least one processor is configured to: identify, using the hall sensor, first information indicating that a state of the electronic device is a first state, based on identifying the first information, identify, using the at least one inertial sensor, second information indicating the state of the electronic device, based on identifying that the first information corresponds to the second information, identify the state of the electronic device as the first state, and based on identifying that the first information is different from the second information, identify the state of the electronic device based on the second information.
Inventor(s): Honjeong PARK of Suwon-si KR for samsung electronics co., ltd., Yongwon KIM of Suwon-si KR for samsung electronics co., ltd., Youngjin JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04M1/02, G06F1/16, H05K1/02
CPC Code(s): H04M1/0216
Abstract: a foldable electronic device is provided. the foldable electronic device includes a foldable housing including a first housing, a second housing, and a hinge portion configured to connect the first housing and the second housing, a flexible printed circuit board extending across the hinge portion, a first support member configured to connect the flexible printed circuit board to the first housing, and a second support member configured to connect the flexible printed circuit board to the second housing, wherein the hinge portion includes a first plate and a second plate, wherein the hinge portion is configured such that the first plate and the second plate face each other when the foldable housing is changed from an unfolded state to a folded state, wherein the first support member is positioned between the first plate and the first housing and is disposed in a first recess formed on the first housing, wherein a first fixing area of the flexible printed circuit board is disposed between the first support member and the first housing to surround the first support member in the first recess, wherein the second support member is positioned between the second plate and the second housing and is disposed in a second recess formed on the second housing, and wherein a second fixing area of the flexible printed circuit board is disposed between the second support member and the second housing to surround the second support member in the second recess.
Inventor(s): Jinwook BAIK of Suwon-si KR for samsung electronics co., ltd., Hwamok PAK of Suwon-si KR for samsung electronics co., ltd., Byounguk YOON of Suwon-si KR for samsung electronics co., ltd., Sunggun CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04M1/02
CPC Code(s): H04M1/0235
Abstract: according to an exemplary embodiment of the present disclosure, a slidable electronic device comprises: a flexible display module; a first housing in which a first area of the flexible display module is arranged; a second housing which can slide with respect to the first housing, and supports a second area of the flexible display module; and a hook assembly positioned in the second housing, wherein the hook assembly comprises a block arranged on the second housing, a hook positioned on the block so as to be linearly movable with respect to the block, and a lock positioned on the block so as to be linearly movable, respect to the block, in the direction perpendicular to the movement direction of the hook, and, while in a first state in which the second housing is slid out by a first distance with respect to the first housing, the hook is inserted into a hook coupling groove provided on the first housing, and, while in a second state in which, from the first state, the second housing is slid out further by a second distance with respect to the first housing, the hook escapes the hook coupling groove, and the lock is coupled to a recess provided on the hook and can fix the hook in place.
Inventor(s): Kyungmoon SEOL of Suwon-si KR for samsung electronics co., ltd., Yoonjung KIM of Suwon-si KR for samsung electronics co., ltd., Jiho KIM of Suwon-si KR for samsung electronics co., ltd., Seongyong AN of Suwon-si KR for samsung electronics co., ltd., Minkyung LEE of Suwon-si KR for samsung electronics co., ltd., Kyihyun JANG of Suwon-si KR for samsung electronics co., ltd., Hochul HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H01Q1/24, H01Q1/52
CPC Code(s): H04M1/0268
Abstract: an electronic device is provided. the electronic device includes a first housing including a first space, a second housing slidably coupled to the first housing and including a second space, a flexible display disposed to be supported by the first housing and the second housing, and having a display area that partially changes when the flexible display is converted from a slide-in state to a slide-out state, a first substrate disposed in the first space of the first housing, a second substrate disposed on a first surface of the second housing and including a first antenna pattern, a wireless communication circuit disposed on one of the first substrate or the second substrate and electrically connected to the first antenna pattern, and a hole formed in a portion of the second housing, wherein the first antenna pattern is disposed to overlap the hole.
Inventor(s): Mincheol SEO of Suwon-si KR for samsung electronics co., ltd., Gyubok PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04M1/02, H01Q1/24, H01Q1/38
CPC Code(s): H04M1/0277
Abstract: an electronic device is provided. the electronic device includes a first housing, a second housing slidably coupled to the first housing, a first printed circuit board disposed in the first housing and having a communication module disposed thereon, a second printed circuit board disposed in the second housing, a connection member made of a flexible material to electrically connect the first printed circuit board and the second printed circuit board, a support structure fixed to the connection member and made of a non-conductive material, and an antenna member surrounding at least a portion of the support structure and made of a conductive material to be electrically connected to the connection member, the antenna member being configured to transmit or receive a radio frequency (rf) signal.
Inventor(s): Rajan Laxman Joshi of San Diego CA US for samsung electronics co., ltd., Madhukar Budagavi of Plano TX US for samsung electronics co., ltd.
IPC Code(s): H04N19/52, H04N19/105, H04N19/172, H04N19/70
CPC Code(s): H04N19/52
Abstract: an apparatus directed to improvements to motion coding for vertices in an inter-coded basemesh frame is provided. the apparatus receives a compressed bitstream including deduplicate method information and a syntax element, wherein the deduplicate method information indicates whether duplicate vertex information for identifying duplicate vertices is present in the compressed bitstream, the syntax element indicates whether a flag for a duplicate vertex in a submesh frame is present in the compressed bitstream, and the flag indicates whether motion information for the duplicate vertex in the submesh frame is present in the compressed bitstream. if the syntax element indicates that the flag is present in the compressed bitstream, the deduplicate method information indicates that duplicate vertex information for identifying duplicate vertices is not present in the compressed bitstream.
Inventor(s): Jae-ho JUNG of Yongin-si KR for samsung electronics co., ltd., Yeul-tak SUNG of Anyang-si KR for samsung electronics co., ltd.
IPC Code(s): H04N23/60, H04N1/00, H04N23/45, H04N23/61, H04N23/63, H04N23/71
CPC Code(s): H04N23/64
Abstract: an electronic apparatus and a method by which the electronic apparatus provides recommendation information related to photography are provided. the method includes identifying a subject included in a preview image recognized by a first camera, obtaining information of the identified subject, obtaining information related to light in surroundings of the identified subject, determining a recommended photographing composition based on the information of the identified subject and the information related to the light in the surroundings of the subject, and providing information about the determined recommended photographing composition.
Inventor(s): Chulsoo CHOI of Suwon-si KR for samsung electronics co., ltd., Bumsuk KIM of Suwon-si KR for samsung electronics co., ltd., Junghun KIM of Suwon-si KR for samsung electronics co., ltd., Jonghoon PARK of Suwon-si KR for samsung electronics co., ltd., Yunki LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N25/13, H04N23/55
CPC Code(s): H04N25/134
Abstract: an image sensor includes a sensor substrate including a plurality of first photosensitive cells configured to sense light and a color separating lens array in an upper portion of the sensor substrate and including a plurality of first sub regions respectively corresponding to the plurality of first photosensitive cells, where each of the plurality of first sub regions include a plurality of first nano-posts, where the plurality of first sub regions include at least one first central sub region at a center of the color separating lens array and at least one first peripheral sub region at a periphery of the color separating lens array, and where the plurality of first nano-posts include at least one first nano-post in the at least one first central sub region and at least one second nano-post in the at least one first peripheral sub region and corresponding to the at least one first nano-post.
20250024168. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yunhong KIM of Suwon-si KR for samsung electronics co., ltd., Mooyoung KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N25/583, H04N25/533, H04N25/77
CPC Code(s): H04N25/583
Abstract: an image sensor including: a pixel array including pixels; and a logic circuit including a row decoder to drive selected pixels, a column decoder to vary exposure time periods for a portion of the selected pixels, and a readout circuit to obtain pixel signals from the selected pixels, wherein each of the pixels includes a photodiode, a first transfer transistor connected between the photodiode and a first floating diffusion region, a second transfer transistor connected between the first floating diffusion region and a second floating diffusion region, a first reset transistor and a switch transistor connected to each other in series between a power node and the first floating diffusion region, a second reset transistor connected between the power node and the second floating diffusion region, a source-follower transistor connected to the second floating diffusion region, and a select transistor connected to the source-follower transistor.
Inventor(s): Junseok KIM of Suwon-si KR for samsung electronics co., ltd., Jiwon IM of Suwon-si KR for samsung electronics co., ltd., Junhyuk PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N25/77, H04N25/709
CPC Code(s): H04N25/77
Abstract: disclosed is a dynamic vision sensor. the dynamic vision sensor includes a photodiode configured to generate a first photodiode current in response to a change in light due to a movement of an object, a first transistor; a first node connected to the photodiode and the first transistor; a second node connected to the first transistor and being configured to receive a first voltage and receive a second voltage, a ground, a second transistor connected to the first node and the ground, a third node connected to the first transistor and the second transistor, and a current source connected to the third node, wherein the first voltage has a first level and the second voltage has a second level different from the first level.
Inventor(s): JUNGWOOK LIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N25/772, H10K39/32, H10K39/38
CPC Code(s): H04N25/772
Abstract: an image pixel includes an organic photodiode, a first electrode connected to a first voltage, and a second electrode connected to a second voltage. the first electrode and the second electrode are disposed on a first surface of the organic photodiode, and a read-out circuit is connected to the first electrode and the second electrode. the read-out circuit provides a first data voltage based on a first charge amount provided from the first electrode to a first data line, and provides a second data voltage based on a second charge amount provided from the second electrode to the first data line.
Inventor(s): Wonchul CHOI of Suwon-si KR for samsung electronics co., ltd., HYEONGDONG JO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N25/772, G01J1/44, H04N25/10
CPC Code(s): H04N25/772
Abstract: a pixel array includes: a plurality of unit pixel groups; and one or more columns including four column lines, wherein each unit pixel group of the plurality of unit pixel groups includes a first pixel group and a second pixel group, wherein the each unit pixel group includes a signal line including a drive transistor and a select transistor, wherein two unit pixel groups share a floating diffusion region, and wherein signal lines of the two unit pixel groups are connected to one column line, wherein each of the two unit pixel groups is configured to transfer a pixel signal to the one column line through the signal lines, wherein the floating diffusion region is located between a reset transistor and a dual conversion transistor, and wherein the dual conversion transistor is connected to the reset transistor and the drive transistor.
Inventor(s): Hyejeong KIM of Suwon-si KR for samsung electronics co., ltd., Sohmann KIM of Suwon-si KR for samsung electronics co., ltd., Hong KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W24/08, H04W64/00, H04W76/30, H04W84/04, H04W84/06
CPC Code(s): H04W24/08
Abstract: an electronic device may include: an rf circuit; memory storing instructions; and at least one processor connected to the memory. the at least one processor may be configured to execute the instructions to cause the electronic device to: perform scanning, by using the rf circuit, in a state that the electronic device has not accessed a network; based on a result of the scanning, identify a first cell located around the electronic device; based on identifying that the first cell is associated with satellite communication, monitor whether a trigger requiring a connection to the satellite communication occurs; and based on identifying an occurrence of the trigger, perform at least one first access operation for access to the network based on the first cell.
Inventor(s): June HWANG of Suwon-si KR for samsung electronics co., ltd., David Gutierrez ESTEVEZ of Staines GB for samsung electronics co., ltd., Mythri HUNUKUMBURE of Staines GB for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04W64/00
CPC Code(s): H04W24/10
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. in the present invention, a location-based server delivers, to a terminal, multiple quality-of-service factors by using a certain message, and the terminal performs measurement according to a specific priority and determines whether a given quality-of-service factor is satisfied.
20250024294. UE-INITIATED BEAM MANAGEMENT_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dalin Zhu of Allen TX US for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ US for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX US for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04B7/06, H04B7/08
CPC Code(s): H04W24/10
Abstract: methods and apparatuses for user equipment (ue)-initiated beam management. a method performed by a ue includes receiving first information to enable ue-initiated beam operation, receiving second information related to a measurement reference signal (rs) for the ue-initiated beam operation, and measuring the measurement rs. the method further includes determining, based on the measurement, a report, transmitting a first uplink (ul) channel notifying transmission of the report, and transmitting a second ul channel including the report.
Inventor(s): Minh Duc HOANG of Bac Ninh VN for samsung electronics co., ltd., Duc Doan NGUYEN of Bac Ninh VN for samsung electronics co., ltd., Van Thinh NGUYEN of Bac Ninh VN for samsung electronics co., ltd., The Thoi NGUYEN of Bac Ninh VN for samsung electronics co., ltd., Van Hau TRUONG of Bac Ninh VN for samsung electronics co., ltd.
IPC Code(s): H04W24/10
CPC Code(s): H04W24/10
Abstract: according to an embodiment of the present disclosure, a method performed by a user equipment in a wireless communication system, may include: receiving, from a base station, information for measurement, the information for measurement including frequency information related to at least one cell related to the measurement, or the frequency information and identifier information of the at least one cell; performing the measurement on a standalone (sa) cell excluding a cell matching a cell identified by information of at least one non-standalone (nsa) cell among the at least one cell, based on the information for the measurement and a specified nsa cell list including information of the at least one nsa cell; and transmitting, to the base station, a measurement report of the sa cell.
20250024296. ADVANCED UE BEAM REPORTING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Emad Nader Farag of Flanders NJ US for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX US for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX US for samsung electronics co., ltd., Dalin Zhu of Allen TX US for samsung electronics co., ltd.
IPC Code(s): H04W24/10
CPC Code(s): H04W24/10
Abstract: methods and apparatuses for advanced user equipment (ue) beam reporting in a wireless communication system. a method of operating a ue includes receiving a set of reference signals (rss), measuring a first quantity based on a quality of a rs in the set of rss, determining a second quantity based on a rate of change of the first quantity, preparing a report including n≥1 entries, and transmitting the report. each entry in the n entries includes a rs indicator of the rs, the first quantity, and the second quantity;
Inventor(s): Sangyeob JUNG of Gyeonggi-do KR for samsung electronics co., ltd., Seungbeom JEONG of Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04L41/5067, H04W80/12
CPC Code(s): H04W24/10
Abstract: a method performed by a user equipment (ue) supporting a master cell group (mcg) and a secondary cell group (scg) includes receiving at least one application layer measurement configuration information included in first radio resource control (rrc) reconfiguration information for the mcg or in second rrc reconfiguration information for the scg, transmitting a report message for an application layer measurement report based on the configuration information, receiving a second rrc reconfiguration message for releasing the scg, informing, for first application layer measurement configuration information included in the second rrc reconfiguration information, an upper layer about release of first application layer measurement configuration information, and discarding a first application layer measurement report associated with the first application layer measurement configuration information that is not yet fully submitted to a lower layer for transmission.
Inventor(s): Prakash Reddy Kolan of Plano TX US for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W48/16, H04W48/18
CPC Code(s): H04W28/0268
Abstract: a method includes providing first application flows related to a first application instance via a first device profile, wherein the first device profile corresponds to a first network slice. the method also includes identifying that a quality of service (qos) required for the first application flows is not met by the first device profile. the method further includes, in response to identifying that the qos required for the first application flows is not met, selecting a second device profile corresponding to a second network slice based on (i) a capability of the second device profile to provide the qos required for the first application flows and (ii) a presence of a second application instance corresponding to the first application instance. in addition, the method includes migrating at least one of the first application flows from the first device profile to the second device profile.
Inventor(s): Kyeong Jin Kim of Plano TX US for samsung electronics co., ltd., Abhishek Sehgal of Plano TX US for samsung electronics co., ltd., Bilal Sadiq of Plano TX US for samsung electronics co., ltd., Yuming Zhu of Plano TX US for samsung electronics co., ltd.
IPC Code(s): H04W28/08
CPC Code(s): H04W28/0975
Abstract: a method performed by an apparatus capable of multi-link operations with respect to a plurality of channels, comprising determining a fast channel and a slower channel, transmitting a packet in a packet queue using the fast channel without using the slower channel when a number of data packets waiting in the packet queue is smaller than a first threshold number, and transmitting a packet in the packet queue using both the fast channel and the slower channel when the number of data packets waiting in the packet queue is equal to or greater than the first threshold number.
Inventor(s): Sangyeob JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W48/16, H04W88/06
CPC Code(s): H04W48/16
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a base station, system information block 1 (sib1), determining whether the ue has a temporary capability restriction, and in case that the sib1 comprises information that allows to send an indicator related to the temporary capability restriction, and the ue has the temporary capability restriction, transmitting, to the base station, a first radio resource control (rrc) message including the indicator, wherein the indicator indicates temporary capability restriction associated with multi universal subscriber identity module (musim) operation.
Inventor(s): Hoyeon LEE of Suwon-si KR for samsung electronics co., ltd., Dongeun SUH of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W48/16, H04W60/00
CPC Code(s): H04W48/18
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method performed by an access and mobility management function (amf) in a wireless communication system is provided. the method includes receiving, from a user equipment (ue), a requested network slice selection assistance information (nssai), receiving, from a unified data management (udm), a subscribed single-nssai (s-nssai), determining whether an s-nssai in the requested nssai is either the subscribed s-nssai or an alternative s-nssai in a ue context, and determining whether to update the ue configuration in case that the s-nssai in the requested nssai is neither the subscribed s-nssai nor the alternative s-nssai in the ue context.
Inventor(s): Bilal Sadiq of Plano TX US for samsung electronics co., ltd., Boon Loong Ng of Plano TX US for samsung electronics co., ltd., Junsung Kim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04J3/06
CPC Code(s): H04W56/0015
Abstract: a method includes repeatedly sending, by a first device, sync beacons to a second device in a target network at a first frequency. the method also includes determining that the second device will use beacons received from an unrelated sync provider (usp) device for synchronization of a clock of the second device with the target network. the method further includes repeatedly sending the sync beacons to the second device at a second frequency that is less frequent than the first frequency. the second frequency is determined based on a maximum synchronization error tolerance of the target network.
20250024389. SSB COVERAGE ENHANCEMENTS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Mustafa Furkan Ozkoc of The Colony TX US for samsung electronics co., ltd., Jianhua Mo of Allen TX US for samsung electronics co., ltd., Young Han Nam of Plano TX US for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04B17/318, H04L41/5009
CPC Code(s): H04W56/0015
Abstract: apparatuses and methods for enhancing ssb coverage. a method performed by a base station includes transmitting, in a synchronization signal block (ssb) burst, a first ssb signal and one or more repetitions of the first ssb signal. the first ssb signal and the one or more repetitions of the first ssb signal are distinguished based on an indicative signal.
Inventor(s): Min WU of Beijing CN for samsung electronics co., ltd., Feifei SUN of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04W72/0453, H04W74/0833
CPC Code(s): H04W56/0035
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein provide a method performed by a user equipment (ue), and the method comprises receiving pre-compensated frequency offset configured by a base station and performing an uplink transmission based on the pre-compensated frequency offset.
Inventor(s): Seyed Mohsen HOSSEINIAN of San Diego CA US for samsung electronics co., ltd., Philippe Jean Marc Michel SARTORI of Naperville IL US for samsung electronics co., ltd.
IPC Code(s): H04W56/00, H04W84/06
CPC Code(s): H04W56/0065
Abstract: a system and a method are disclosed for ue operations in an ntn. a method performed by a ue includes receiving, from a base station, a prs in a dl subframe; determining a timestamp or subframe indices of the prs in the dl subframe and a timestamp or subframe indices of a ue ul subframe that is closest in time to the dl subframe; determining, based on the timestamps or the subframe indices, a ue time difference from receiving the prs to a transmission of an srs; generating an auxiliary report including adjustment information for an lmf to calculate the ue time difference; providing the auxiliary report to the lmf; and reporting, to the lmf, the srs based on the ue time difference.
Inventor(s): Hongbo Si of Allen TX US for samsung electronics co., ltd.
IPC Code(s): H04W72/25, H04L5/00
CPC Code(s): H04W72/25
Abstract: a method of a user equipment (ue) in a wireless communication system is provided. the method includes receiving higher layer parameters; determining whether a first higher layer parameter is included in the higher layer parameters; determining, based on the first higher layer parameter, a physical sidelink feedback channel (psfch) transmission type when the first higher layer parameter is included; determining a resource block (rb) set for a transmission of a psfch; determining rbs in the rb set used for the transmission of the psfch based on the psfch transmission type; and transmitting the psfch according to the rbs in the rb set. all rbs in a first interlace are used for the transmission of the psfch when the psfch transmission type is a first type or rbs in a second interlace and rbs in a third interlace are used for the transmission of the psfch when a second type.
Inventor(s): Hyeonsoo KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W72/512, H04W24/10, H04W28/02, H04W72/543
CPC Code(s): H04W72/512
Abstract: the electronic device includes: a communication circuit for transmitting or receiving data to or from a network through cellular communication; an application processor; and a communication processor to: receive, from the application processor, information about one specified application and a first delay time for the specified application to perform one specified service; determine whether to identify an average of delay times while transmitting data related to the specified service, based on comparing a delay time occurring while transmitting the data related to the specified service through at least one data radio bearer (drb) with a first time determined based on the first delay time; identify the average of the delay times on the basis of determining to identify the average; and determine whether to transmit a measurement report including the average of the delay times and information about the drb, based on whether the average satisfies a specified condition.
Inventor(s): Gupil CHEONG of Suwon-si KR for samsung electronics co., ltd., Doosuk KANG of Suwon-si KR for samsung electronics co., ltd., Hocheol SEO of Suwon-si KR for samsung electronics co., ltd., Hyungseoung YOO of Suwon-si KR for samsung electronics co., ltd., Siejoon CHO of Suwon-si KR for samsung electronics co., ltd., Juyeon JIN of Suwon-si KR for samsung electronics co., ltd., Euibum HAN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W72/563, H04W72/0446, H04W72/0453, H04W84/18
CPC Code(s): H04W72/563
Abstract: an electronic device for providing an audio service may comprise a communication circuit and at least one processor. the at least one processor may: determine a first resource available for an audio service on at least one audio communication link; determine, within the determined first resource, a second resource for a first priority and a third resource for a second priority that is lower than the first priority; and provide the audio service to at least one external electronic device via the audio communication link by using at least one of the second resource and the third resource. while providing the audio service, when a first communication task, which uses a frequency band corresponding to a frequency band of the audio communication link and has a third priority higher than the second priority, occurs, the at least one processor may perform the first communication task by using the second resource.
Inventor(s): Aby Kanneath ABRAHAM of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): H04W74/0833
CPC Code(s): H04W74/0833
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. specifically, the disclosure related to method for self-optimization of random access channel (rach) in a wireless network (). the method includes storing, by a user equipment (ue) (), a feature specific rach information corresponding to a feature specific rach applied by the ue (). the feature specific rach is applied for one of a small data transmission (sdt), coverage enhancement, a reduced capacity (redcap), and network slicing. further, the method includes sending, by the ue (), the feature specific rach information to a network device () in the wireless network.
Inventor(s): Beomsik BAE of Suwon-si KR for samsung electronics co., ltd., Jinwoo OCK of Suwon-si KR for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W76/12
CPC Code(s): H04W76/12
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. more particularly, the disclosure relates to a method performed by a control plane (cp) of a base station in a wireless communication system. the method comprises transmitting, to a user plane (up) of the base station, a first message comprising information on a packet data convergence protocol (pdcp) for each data radio bearer (drb). as a response to the first message, the method further comprises receiving, from the up of the base station, a second message. the information on the pdcp for each drb comprises at least one pdcp version.
Inventor(s): Vinay Kumar SHRIVASTAVA of Bangalore IN for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W76/20, H04W28/02, H04W76/30, H04W76/40
CPC Code(s): H04W76/20
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). the method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a base station, configuration information for a radio bearer, the configuration information including information for adding or modifying for a multicast mrb (multicast and broadcast service (mbs) radio bearer; and performing addition or reconfiguration of the multicast mrb, wherein the performing further comprises establishing an service data adaption protocol (sdap) entity based on the information for adding or modifying for the multicast mrb.
Inventor(s): Seungbeom JEONG of Gyeonggi-do KR for samsung electronics co., ltd., Anil AGIWAL of Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H04W76/28, H04W68/00
CPC Code(s): H04W76/28
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher transmission rates. the present disclosure relates to a method of a ue in a wireless communication system, the method comprising receiving a paging message, in case that an extended discontinuous reception (edrx) is configured in the ue, comparing a length of a discontinuous reception (drx) cycle currently used by the ue and a length of a modification period (mp) and in case that the length of the drx cycle is not longer than the length of the mp, and a short message contains an indicator related to a system information update, starting a procedure for acquiring system information from a next mp.
Inventor(s): Sail MIN of Suwon-si KR for samsung electronics co., ltd., Hyojeong LEE of Suwon-si KR for samsung electronics co., ltd., Sooam KIM of Suwon-si KR for samsung electronics co., ltd., Jeongil OH of Suwon-si KR for samsung electronics co., ltd., Youngwoong JOO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05B6/64, H01F7/02, H01J23/02, H01J25/50, H05B6/68
CPC Code(s): H05B6/64
Abstract: a microwave oven is provided. the microwave oven includes a main body including a cooking chamber having an opening that is opened forward, and door coupled to the main body and capable of opening/closing the cooking chamber, a magnetron that generates microwaves and is connected to a second side of the cooking chamber, the second side being opposite to a first side to which the door is coupled, a high-voltage capacitor connected to the magnetron, a high-voltage diode connected to the magnetron, a high-voltage transformer connected to the magnetron, and a magnetic body arranged adjacent to a current path connecting the magnetron to the high-voltage capacitor, the high-voltage diode, and the high-voltage transformer, wherein, along the current path, a current flows from the magnetron to the high-voltage capacitor, the high-voltage diode, and the high-voltage transformer, and wherein the magnetic body surrounds the current path.
Inventor(s): Sunggun CHO of Suwon-si KR for samsung electronics co., ltd., Hwamok PAK of Suwon-si KR for samsung electronics co., ltd., Jinwook BAIK of Suwon-si KR for samsung electronics co., ltd., Byounguk YOON of Suwon-si KR for samsung electronics co., ltd., Joongyeon CHO of Suwon-si KR for samsung electronics co., ltd., Junyoung CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05K5/02, H05K5/00, H05K5/06
CPC Code(s): H05K5/0217
Abstract: an electronic device including a first housing including a first frame and a first cover which faces and is coupled to the first frame, a second housing including a second frame slidable relative to the first frame and a second cover which faces and is coupled to the second frame, a flexible display module including a first area on the first frame and slidable together with the first housing relative to the second housing, and a second area slidable along the second frame and slidable together with the first area, a first waterproof member which is between the first frame and the first cover, and a second waterproof member between the second frame and the second cover.
20250024661. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yong Gun JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor memory device includes a substrate including a first semiconductor film, a buried insulating film, and a second semiconductor film, which are sequentially stacked; bitlines within the buried insulating film and extending in a first direction; a device isolation film in the substrate and defining cell active regions, which extend in a second direction; and bitline contacts connecting the cell active regions and the bitlines, wherein the second direction intersects the first direction at an acute angle.
20250024664. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SEOKJAE WON of Suwon-si KR for samsung electronics co., ltd., JAEHONG PARK of Suwon-si KR for samsung electronics co., ltd., YOONGOO KANG of Suwon-si KR for samsung electronics co., ltd., DONGYOUNG KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/488
Abstract: disclosed is a semiconductor device comprising an active pattern on a substrate and surrounded by a device isolation pattern, a word line that extends in a first direction and is on the active pattern and the device isolation pattern in a first direction parallel to a bottom surface of the substrate, a bit line that extends on the active pattern in a second direction intersecting the first direction, a storage node contact on the active pattern, a landing pad that includes a lower landing pad and an upper landing pad that are sequentially provided on the storage node contact with an interface therebetween, and a fence pattern on the word line and a lateral surface of the landing pad. a top surface of the fence pattern is has a height higher than a height a top surface of the lower landing pad.
20250024665. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yong Jin LEE of Suwon-si KR for samsung electronics co., ltd., Sung Won YOO of Suwon-si KR for samsung electronics co., ltd., Won Sok LEE of Suwon-si KR for samsung electronics co., ltd., Min Hee CHO of Suwon-si KR for samsung electronics co., ltd., Si Yeon CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/488
Abstract: the semiconductor memory device including a bit line in a first direction on a substrate, a channel structure on the bit line, and including a first vertical part in a second direction, and a second vertical part apart from the first vertical part in the first direction and in the second direction, a back-gate electrode on the bit line on a side of the channel structure and in the second direction, a back-gate insulating film between the back-gate electrode and the channel structure, a back-gate capping film on the back-gate electrode and the back-gate insulating film, a first and second word lines between the first and the second vertical parts and in the second direction, the second word line spaced apart from the first word line in the first direction and first and second capacitors connected to the first and second vertical parts, on the first and second vertical parts.
20250024666. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yanghee Lee of Suwon-si KR for samsung electronics co., ltd., Hyukmin Kim of Suwon-si KR for samsung electronics co., ltd., Donghoon Kwon of Suwon-si KR for samsung electronics co., ltd., Jonghyuk Park of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: a semiconductor memory device includes a substrate including a memory cell region in which active regions are defined, a peripheral region in which a logic active region is defined, and a boundary region including a region isolation trench between the memory cell region and the peripheral region, a boundary structure including a boundary isolation layer, a region isolation structure, and a region isolation filling layer sequentially disposed in the region isolation trench, and a word line extending across the active regions, wherein among the active regions, an active region located at an outermost part of the memory cell region and the region isolation structure are spaced apart from each other by a first width, and the word line extends by an extension length less than the first width from an edge of the active region located at the outermost part of the memory cell region towards the region isolation structure.
Inventor(s): Yoongoo KANG of Suwon-si KR for samsung electronics co., ltd., Hyunjung LEE of Suwon-si KR for samsung electronics co., ltd., Jaehong PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: provided is a semiconductor device including a peripheral circuit structure including peripheral circuit transistors, bit lines on the peripheral circuit structure and extending in a first horizontal direction, back gate lines extending in a second horizontal direction at a vertical level higher than the bit lines, word lines extending in the second horizontal direction at a vertical level higher than the bit lines and alternating with the back gate lines, a plurality of vertical channel layers in a matrix form on the bit lines, each of the vertical channel layers including a first sidewall extending in a vertical direction and facing a corresponding back gate line, a second sidewall opposite to the first sidewall and facing a corresponding word line, a part of the second sidewall adjacent to a bit line having a curved shape, contact pads on the vertical channel layers, and storage nodes on the contact pads.
20250024677. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kang Lib Kim of Suwon-si KR for samsung electronics co., ltd., Sungsu Moon of Suwon-si KR for samsung electronics co., ltd., Seahoon Lee of Suwon-si KR for samsung electronics co., ltd., Junhee Lim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B43/35, H10B43/40
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes a gate electrode structure, a memory channel structure, and first and second contact plugs. the gate electrode structure includes gate electrodes spaced apart from each other in a first direction, and each of the gate electrodes extends in a second direction. the gate electrode structure has a staircase shape including step layers each of which includes two gate electrodes. the memory channel structure extends through the gate electrode structure. the first contact plug contacts an upper surface of a first gate electrode of the two gate electrodes at an upper level in a corresponding step layer. the second contact plug contacts a sidewall of a second gate electrode of the two gate electrodes at a lower level in the corresponding step layer. the second contact plug extends in the first direction and is electrically insulated from gate electrodes disposed below the second gate electrode.
20250024682. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Rokgyeong Kim of Suwon-si KR for samsung electronics co., ltd., Myunghun Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/40, G11C16/08, H10B41/27, H10B41/41, H10B43/27
CPC Code(s): H10B43/40
Abstract: a semiconductor device may include a peripheral circuit region including a plurality of elements on a substrate, the plurality of elements providing a page buffer and a row decoder, wherein the peripheral circuit region includes a first well region and a second well region, and at least one of a conductivity-type of impurities or a doping concentration of the first well region is different from that of the second well region, wherein the row decoder includes at least one first element in the first well region, and at least one second element in the second well region, wherein the first well region and the second well region are configured to have a same body bias voltage, and wherein the first well region is in contact with the second well region in a second direction parallel to an upper surface of the substrate.
20250024684. VERTICAL SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sanghyun PARK of Suwon-si KR for samsung electronics co., ltd., Hyuncheol KIM of Suwon-si KR for samsung electronics co., ltd., Suhwan LIM of Suwon-si KR for samsung electronics co., ltd., Siyeon CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B51/20, H10B51/30
CPC Code(s): H10B51/20
Abstract: a vertical semiconductor device includes a substrate, a stacked structure including a plurality of insulation patterns and a plurality of gate electrode structures alternately and repeatedly stacked on the substrate in a vertical direction substantially perpendicular to a surface of the substrate, a channel pattern passing through the stacked structure, a gate insulation layer surrounding an outer wall of the channel pattern, and a gate insulation pattern disposed between the gate insulation layer and the gate electrode structures. the gate insulation layer includes a metal oxide having paraelectricity, and the gate insulation pattern has ferroelectricity. the gate insulation layer includes a first portion contacting one of the insulation patterns and a second portion contacting the gate insulation pattern.
Inventor(s): Jeonil Lee of Suwon si KR for samsung electronics co., ltd.
IPC Code(s): H10B53/20, H10B53/10, H10B53/40
CPC Code(s): H10B53/20
Abstract: provided are a three-dimensional (3d) ferroelectric random access memory (feram) with an increased memory window per unit area and reduced process difficulty and distribution and a method of manufacturing the same. the 3d feram includes a substrate, bit lines extending in a first horizontal direction spaced apart from each other in a second horizontal direction, word lines disposed over the bit line, extending in the second horizontal direction, and spaced apart from each other in the first horizontal direction, semiconductor patterns arranged at certain intervals on corresponding portions of the word lines, and ferroelectric capacitor (fecap) structures disposed over the semiconductor patterns, wherein the fecap structure includes a first electrode including a body portion and at least two horizontal extensions, a ferroelectric layer covering outer walls of the first electrode, and second electrodes covering the ferroelectric layer on the horizontal extensions.
Inventor(s): William San-Hsi HWANG of Seattle WA US for samsung electronics co., ltd., Shan Xiang WANG of Portola Valley CA US for samsung electronics co., ltd., Fen Xue of Palo Alto CA US for samsung electronics co., ltd., Wilman TSAI of Saratoga CA US for samsung electronics co., ltd., Harsono SIMKA of Saratoga CA US for samsung electronics co., ltd.
IPC Code(s): H10B61/00, G01R33/07, G01R33/09, H10N50/10, H10N50/20
CPC Code(s): H10B61/22
Abstract: an magnetoresistive random access memory (mram) device includes a magnetic tunnel junction, and a spin-orbit torque material. based on a current applied to the spin-orbit torque material, the spin-orbit torque material generates spin polarization along one or multiple axes.
Inventor(s): JEON IL LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B80/00, H01L23/00, H01L25/065, H01L25/18
CPC Code(s): H10B80/00
Abstract: a memory chip includes a cell chip and a core-periphery chip, which are vertically stacked and are electrically connected to each other. the cell chip includes cell regions, each of which includes a memory cell layer. the core-periphery chip includes a core group region and a peripheral region which are adjacent to each other in a first direction. the core group region includes core regions arranged in a line in a second direction intersecting the first direction. each of the core regions includes a core bank including a core circuit, and a neural processing unit (npu) block including an npu.
Inventor(s): Youngsun SONG of Suwon-si KR for samsung electronics co., ltd., Seulji Song of Suwon-si KR for samsung electronics co., ltd., Bon Jae Koo of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B99/00
CPC Code(s): H10B99/10
Abstract: a three-dimensional memory device includes a base dielectric layer disposed on a substrate, a stack structure that includes word lines and interlayer dielectric layers that are alternately stacked on the base dielectric layer, a bit line that penetrates the stack structure and extends in a vertical direction perpendicular to a top surface of the substrate, and buried storage patterns interposed between the bit line and the word lines and spaced apart from each other in the vertical direction. each of the buried storage patterns has a width in a horizontal direction parallel to the top surface of the substrate. the widths of the buried storage patterns increase with increasing vertical distance from the substrate.
Inventor(s): Myungsun Sim of Suwon-si KR for samsung electronics co., ltd., Sunghun Lee of Suwon-si KR for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si KR for samsung electronics co., ltd., Yong Joo Lee of Suwon-si KR for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si KR for samsung electronics co., ltd., Sunghun Hong of Suwon-si KR for samsung electronics co., ltd., Youngki Hong of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K85/40
CPC Code(s): H10K85/342
Abstract: a light-emitting device including a first electrode, a second electrode facing the first electrode, and an interlayer arranged between the first electrode and the second electrode, wherein the interlayer includes an emission layer and an emission auxiliary layer, the emission auxiliary layer is arranged between the emission layer the first electrode, the emission layer includes a first host and a first dopant, the emission auxiliary layer includes a second host and a second dopant, and the second dopant is represented by formula 1:
Inventor(s): Myungsun Sim of Suwon-si KR for samsung electronics co., ltd., Sunghun Lee of Suwon-si KR for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si KR for samsung electronics co., ltd., Yong Joo Lee of Suwon-si KR for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si KR for samsung electronics co., ltd., Sunghun Hong of Suwon-si KR for samsung electronics co., ltd., Youngki Hong of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K85/40
CPC Code(s): H10K85/342
Abstract:
Inventor(s): Myungsun Sim of Suwon-si KR for samsung electronics co., ltd., Sunghun Lee of Suwon-si KR for samsung electronics co., ltd., Shingo ISHIHARA of Suwon-si KR for samsung electronics co., ltd., Yong Joo Lee of Suwon-si KR for samsung electronics co., ltd., Yasushi KOISHIKAWA of Suwon-si KR for samsung electronics co., ltd., Sunghun Hong of Suwon-si KR for samsung electronics co., ltd., Youngki Hong of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10K85/30, C07F15/00, C09K11/06, H10K85/40
CPC Code(s): H10K85/342
Abstract: wherein a detailed description of formula 1 is as provided herein.
Samsung Electronics Co., Ltd. patent applications on January 16th, 2025
- Samsung Electronics Co., Ltd.
- B65D51/00
- B65D51/20
- CPC B65D51/002
- Samsung electronics co., ltd.
- D06F58/10
- D06F73/02
- CPC D06F58/10
- E05D3/12
- D06F34/20
- D06F39/14
- E05D7/00
- E05D11/00
- CPC E05D3/12
- F24F1/22
- CPC F24F1/22
- F24F13/20
- F24F1/56
- CPC F24F1/56
- F24F11/63
- G05B19/042
- CPC F24F11/63
- F25B49/02
- F25B30/02
- CPC F25B49/02
- G01R31/3842
- G01R31/367
- CPC G01R31/3842
- G02B27/01
- F21V8/00
- G02B5/18
- G02B5/30
- G02B6/27
- G02B30/25
- G02B30/33
- CPC G02B27/0103
- G03F7/004
- H01L21/027
- CPC G03F7/0044
- H01L21/308
- H01L21/311
- H01L21/3213
- G03F7/039
- G03F7/038
- CPC G03F7/0397
- G03F7/00
- CPC G03F7/70066
- G03F7/16
- G03F7/32
- CPC G03F7/70875
- G05F1/56
- CPC G05F1/56
- G05F3/20
- G05F1/567
- G05F3/26
- CPC G05F3/205
- G06F1/08
- G06F1/04
- G06F3/06
- G06F13/42
- G11C7/22
- G11C16/32
- H04L7/00
- CPC G06F1/08
- G06F1/16
- H04M1/02
- CPC G06F1/1652
- G06F1/20
- CPC G06F1/1675
- CPC G06F1/1698
- G06F3/01
- G06T7/70
- G06T7/80
- G06V10/26
- G06V10/764
- G06V20/20
- G06V20/50
- G06V40/20
- CPC G06F3/017
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- CPC G06F3/0619
- G06F3/14
- G06T3/40
- CPC G06F3/14
- G06F3/0482
- CPC G06F3/1423
- G06F3/16
- G06F3/0484
- G06F3/0488
- CPC G06F3/167
- G06F9/48
- G06F11/34
- CPC G06F9/4881
- G06F11/07
- G06F11/14
- G06F11/30
- CPC G06F11/0793
- G06F11/10
- CPC G06F11/1044
- G06F12/14
- G06F21/10
- G06F21/62
- G07C5/08
- H04N5/445
- H04N5/77
- H04N5/907
- H04N7/18
- H04N9/82
- H04N23/698
- CPC G06F12/1425
- G06F13/40
- G06F13/37
- H04L67/1008
- H04L67/141
- H04L69/325
- CPC G06F13/4068
- G06N3/0985
- G06N3/0495
- CPC G06N3/0985
- G06T1/20
- CPC G06T1/20
- G06T3/4046
- G06F18/214
- G06N3/04
- G06N3/08
- G06T3/4007
- G06T3/4053
- G06V10/82
- CPC G06T3/4046
- G06T5/50
- G06T5/00
- G06T7/30
- G06T7/579
- CPC G06T5/50
- G06T7/246
- G06T7/11
- G06V10/25
- G06V20/40
- G06V40/18
- CPC G06T7/248
- G06T7/12
- G06V10/40
- G06V20/56
- CPC G06T7/80
- G06T11/00
- G06F40/58
- CPC G06T11/00
- G06T15/00
- G06F9/30
- CPC G06T15/005
- G06V10/94
- G10L15/22
- CPC G06V10/945
- G06V40/12
- G06F18/22
- G06F21/32
- G06N7/01
- G06V10/762
- CPC G06V40/1388
- G09G3/00
- CPC G09G3/035
- G09G3/3225
- G09G3/32
- CPC G09G3/3225
- G09G3/34
- CPC G09G3/3406
- G09G5/12
- CPC G09G5/12
- G11C11/4093
- G11C5/14
- G11C7/02
- G11C7/10
- G11C7/14
- G11C7/20
- G11C11/4072
- G11C11/4074
- G11C11/4076
- G11C11/408
- G11C11/4091
- G11C11/4096
- G11C29/02
- G11C29/50
- CPC G11C11/4093
- G11C16/10
- G11C16/08
- G11C16/20
- G11C16/26
- CPC G11C16/102
- G11C29/12
- G11C7/04
- G11C29/46
- CPC G11C29/1201
- H01J37/32
- H01L21/683
- CPC H01J37/32724
- H01L21/304
- H01L21/66
- H01L21/67
- CPC H01L21/304
- H01L29/66
- H10B12/00
- CPC H01L21/3086
- H01L23/00
- CPC H01L22/32
- CPC H01L22/34
- H01L23/31
- H01L25/065
- CPC H01L23/3142
- H01L23/40
- H01L23/522
- H01L25/18
- H10B80/00
- H01L23/498
- CPC H01L23/4006
- CPC H01L23/49816
- CPC H01L23/49838
- H01L21/48
- H01L21/768
- H01L23/528
- H01L25/10
- H01L23/532
- CPC H01L23/5283
- H10B41/10
- H10B41/27
- H10B41/35
- H10B41/40
- H10B43/10
- H10B43/27
- H10B43/35
- H10B43/40
- H01L21/3105
- H01L23/48
- H01L23/538
- CPC H01L23/5386
- H01L23/373
- CPC H01L23/562
- H01L25/16
- H01L27/146
- CPC H01L24/05
- CPC H01L24/06
- CPC H01L24/29
- H01L25/00
- CPC H01L24/48
- CPC H01L24/78
- CPC H01L24/83
- H01L23/29
- H01L23/367
- CPC H01L25/0652
- H01L23/13
- H01L23/58
- H01L21/56
- CPC H01L25/16
- H01L23/544
- H01L33/38
- H01L33/62
- CPC H01L25/167
- CPC H01L25/18
- H01L27/15
- H01L27/06
- H01L27/02
- H01L27/092
- CPC H01L27/0688
- H01L21/822
- H01L27/088
- H01L29/417
- H01L29/78
- G02B3/00
- CPC H01L27/14627
- CPC H01L27/1463
- H01L31/105
- CPC H01L27/14647
- H01L29/20
- H01L29/778
- H01L33/00
- CPC H01L29/41766
- H01L29/423
- H01L29/06
- H01L29/49
- H01L29/775
- H01L29/786
- CPC H01L29/42392
- H01L29/10
- CPC H01L29/6681
- H01L29/76
- H01L21/02
- H01L29/24
- CPC H01L29/7606
- H01L29/08
- CPC H01L29/7851
- CPC H01L33/0093
- H01L33/60
- H01L25/075
- CPC H01L33/60
- H01L33/48
- CPC H01L33/62
- H01M10/052
- H01M4/04
- H01M4/139
- H01M4/66
- H01M6/40
- H01M10/04
- H01M10/0562
- H01M10/0583
- CPC H01M10/052
- CPC H01M10/0562
- H01Q1/22
- H01Q1/24
- CPC H01Q1/2266
- H01Q23/00
- CPC H01Q1/243
- H01Q3/06
- CPC H01Q3/06
- H01Q7/00
- G04G17/06
- H01Q1/27
- H04B5/26
- CPC H01Q7/00
- H01Q25/00
- H01Q1/38
- CPC H01Q25/001
- H02M3/07
- CPC H02M3/07
- H03F1/42
- H03F3/45
- CPC H03F1/42
- H03F3/24
- H03D7/00
- H03F1/56
- H04B1/04
- CPC H03F3/245
- H03G3/30
- H04R1/26
- H04R29/00
- CPC H03G3/30
- H03K5/156
- H03K3/037
- CPC H03K5/1565
- CPC H04B1/0475
- H04B1/7163
- H04W8/00
- H04W76/10
- CPC H04B1/7163
- H04B7/0408
- H04L5/00
- H04W72/044
- CPC H04B7/0408
- H04B7/0426
- H04B7/08
- CPC H04B7/043
- H04B7/06
- H04W72/231
- CPC H04B7/0626
- H04W24/10
- CPC H04B7/088
- H04L1/00
- CPC H04L1/0073
- CPC H04L5/0051
- H04L9/00
- CPC H04L9/008
- H04L9/30
- H04L27/26
- H04W8/22
- H04W52/36
- CPC H04L27/2618
- H04L67/143
- H04W48/18
- H04W76/30
- H04W84/12
- CPC H04L67/143
- CPC H04M1/0216
- H05K1/02
- CPC H04M1/0235
- H01Q1/52
- CPC H04M1/0268
- CPC H04M1/0277
- H04N19/52
- H04N19/105
- H04N19/172
- H04N19/70
- CPC H04N19/52
- H04N23/60
- H04N1/00
- H04N23/45
- H04N23/61
- H04N23/63
- H04N23/71
- CPC H04N23/64
- H04N25/13
- H04N23/55
- CPC H04N25/134
- H04N25/583
- H04N25/533
- H04N25/77
- CPC H04N25/583
- H04N25/709
- CPC H04N25/77
- H04N25/772
- H10K39/32
- H10K39/38
- CPC H04N25/772
- G01J1/44
- H04N25/10
- H04W24/08
- H04W64/00
- H04W84/04
- H04W84/06
- CPC H04W24/08
- CPC H04W24/10
- H04L41/5067
- H04W80/12
- H04W28/02
- H04W48/16
- CPC H04W28/0268
- H04W28/08
- CPC H04W28/0975
- H04W88/06
- CPC H04W48/16
- H04W60/00
- CPC H04W48/18
- H04W56/00
- H04J3/06
- CPC H04W56/0015
- H04B17/318
- H04L41/5009
- H04W72/0453
- H04W74/0833
- CPC H04W56/0035
- CPC H04W56/0065
- H04W72/25
- CPC H04W72/25
- H04W72/512
- H04W72/543
- CPC H04W72/512
- H04W72/563
- H04W72/0446
- H04W84/18
- CPC H04W72/563
- CPC H04W74/0833
- H04W76/12
- CPC H04W76/12
- H04W76/20
- H04W76/40
- CPC H04W76/20
- H04W76/28
- H04W68/00
- CPC H04W76/28
- H05B6/64
- H01F7/02
- H01J23/02
- H01J25/50
- H05B6/68
- CPC H05B6/64
- H05K5/02
- H05K5/00
- H05K5/06
- CPC H05K5/0217
- CPC H10B12/482
- CPC H10B12/488
- CPC H10B12/50
- CPC H10B43/27
- H10B41/41
- CPC H10B43/40
- H10B51/20
- H10B51/30
- CPC H10B51/20
- H10B53/20
- H10B53/10
- H10B53/40
- CPC H10B53/20
- H10B61/00
- G01R33/07
- G01R33/09
- H10N50/10
- H10N50/20
- CPC H10B61/22
- CPC H10B80/00
- H10B99/00
- CPC H10B99/10
- H10K85/30
- C07F15/00
- C09K11/06
- H10K85/40
- CPC H10K85/342