18298956. SEMICONDUCTOR DEVICE INCLUDING GUARD RING simplified abstract (SK hynix Inc.)
SEMICONDUCTOR DEVICE INCLUDING GUARD RING
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICE INCLUDING GUARD RING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18298956 titled 'SEMICONDUCTOR DEVICE INCLUDING GUARD RING
Simplified Explanation
The semiconductor device described in the abstract includes a semiconductor substrate and a guard ring with conductive patterns stacked over the substrate and spaced apart from each other, with conductive plugs between adjacent patterns.
- The semiconductor device consists of a semiconductor substrate.
- The guard ring is made up of multiple conductive patterns stacked over the substrate.
- The conductive patterns are spaced apart from each other in a perpendicular direction to the top surface of the semiconductor substrate.
- A conductive plug is placed between two adjacent conductive patterns among the stacked patterns.
- The conductive plug comprises long patterns and short patterns.
Potential Applications
The technology described in this patent application could be applied in:
- Semiconductor manufacturing
- Integrated circuit design
- Electronics industry
Problems Solved
This technology helps in:
- Enhancing the performance of semiconductor devices
- Improving the reliability of electronic components
- Minimizing signal interference in circuits
Benefits
The benefits of this technology include:
- Increased efficiency in semiconductor devices
- Enhanced signal integrity
- Better protection against electrical noise
Potential Commercial Applications
With its advantages, this technology could find applications in:
- Consumer electronics
- Telecommunications
- Automotive electronics
Possible Prior Art
One possible prior art related to this technology is the use of guard rings in semiconductor devices to protect against electrical interference.
Unanswered Questions
How does this technology compare to existing guard ring designs in terms of performance and reliability?
The article does not provide a direct comparison with other guard ring designs to assess its superiority.
What are the specific manufacturing processes involved in implementing this technology in semiconductor devices?
The article does not delve into the detailed manufacturing processes required for incorporating this innovation into semiconductor devices.
Original Abstract Submitted
A semiconductor device includes: a semiconductor substrate; and a guard ring including a plurality of conductive patterns stacked over the semiconductor substrate in a first direction to be spaced apart from each other, and a conductive plug disposed between two adjacent conductive patterns among the plurality of conductive patterns, the first direction being perpendicular to a top surface of the semiconductor substrate, wherein the conductive plug includes a plurality of long patterns and a plurality of short patterns.