Samsung electronics co., ltd. (20250062252). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Changyeon Song of Suwon-si (KR)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250062252 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes a redistribution insulation layer and a connection structure disposed on the redistribution insulation layer in a first direction and including a base layer, a metal pattern, and a cavity. a semiconductor chip is disposed on the redistribution insulation layer in the first direction. the semiconductor chip is spaced apart from the connection structure by a molding layer. the semiconductor chip and the molding layer are disposed in the cavity. the metal pattern is disposed on the redistribution insulation layer, at least partially between the base layer and the molding layer. the metal pattern includes a first metal pattern extending, in a second direction crossing the first direction, from an inner surface of the connection structure into the base layer and separating at least a portion of the base layer from at least a portion of the redistribution insulation layer.