18440975. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (SK hynix Inc.)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
Heon Yong Chang of Gyeonggi-do KR
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
This abstract first appeared for US patent application 18440975 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Original Abstract Submitted
A semiconductor device includes a first chip having a first chip body and a first bonding layer which is disposed on the first chip body and includes a first bonding pad; and a second chip bonded on the first bonding layer, and having a second chip body and a second bonding layer which is disposed under the second chip body and includes a second bonding pad bonded to the first bonding pad, wherein a side surface of the first bonding layer and a side surface of the second chip are retracted inward of a side surface of the first chip body.