SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Organization Name

Inventor(s)

Yun Cheol Han of Icheon-si Gyeonggi-do KR

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

This abstract first appeared for US patent application 18610452 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Original Abstract Submitted

Provided herein may be a semiconductor device and a method of manufacturing the same. A method of manufacturing a semiconductor device may include forming a stacked body in which first and second material layers are alternately stacked, the stacked body being formed in a chip area and a guard area, wherein the guard area is adjacent to the chip area, forming a plurality of first openings that pass through the stacked body of the guard area, the first openings being spaced apart from each other, forming a second opening from the plurality of first openings by expanding each of the plurality of first openings so that the plurality of first openings are coupled to each other, and forming a chip guard by filling the second opening with an insulating material.