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Category:H01L23/66
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Pages in category "H01L23/66"
The following 68 pages are in this category, out of 68 total.
1
- 17461957. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17742862. SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17808221. ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17844802. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17848059. INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE simplified abstract (Intel Corporation)
- 17850187. SEMICONDUCTOR DEVICE WITH MULTIPLE DIES simplified abstract (Texas Instruments Incorporated)
- 17851026. PHASE-CHANGE MATERIAL (PCM) RADIO FREQUENCY (RF) SWITCHING DEVICE WITH AIR GAP simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17856394. PLANAR T-COIL AND INTEGRATED CIRCUIT INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)
- 17932788. ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION simplified abstract (QUALCOMM Incorporated)
- 17937474. PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract (Intel Corporation)
- 17937519. PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17956798. SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17957752. PHOTONICALLY STEERED IMPEDANCE SURFACE ANTENNAS simplified abstract (Intel Corporation)
- 17981176. DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 18061763. Semiconductor package with an antenna substrate simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18253954. DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM simplified abstract (Intel Corporation)
- 18260810. INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS simplified abstract (Intel Corporation)
- 18373357. WIDE BANDGAP TRANSISTOR LAYOUT WITH DRAIN ON OUTER EDGE simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18373358. WIDE BANDGAP TRANSISTOR LAYOUT WITH FOLDED GATE simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18387801. DEVICES AND METHODS FOR ENHANCING INSERTION LOSS PERFORMNCE OF AN ANTENNA SWITCH simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18448045. Antenna Effect Protection and Electrostatic Discharge Protection for Three-Dimensional Integrated Circuit simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18462909. CAPACITORS OF SEMICONDUCTOR DEVICE CAPABLE OF OPERATING IN HIGH FREQUENCY OPERATION ENVIRONMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18484311. DEVICES AND METHODS RELATED TO STACK ASSEMBLY simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18513376. PACKAGED MODULE WITH ANTENNA AND FRONT END INTEGRATED CIRCUIT simplified abstract (Skyworks Solutions, Inc.)
- 18516974. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18519821. Antenna Apparatus and Fabrication Method simplified abstract (Infineon Technologies AG)
- 18523320. SEMICONDUCTOR DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18530179. MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18541878. SEMICONDUCTOR PACKAGES WITH ANTENNAS simplified abstract (Intel Corporation)
2
B
I
- Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract
- Intel corporation (20240113049). PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract
- Intel corporation (20240113052). SEMICONDUCTOR PACKAGES WITH ANTENNAS simplified abstract
- Intel corporation (20240120651). PHOTONICALLY STEERED IMPEDANCE SURFACE ANTENNAS simplified abstract
- Intel Corporation patent applications on April 11th, 2024
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on January 18th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on March 14th, 2024
Q
T
- Taiwan semiconductor manufacturing co., ltd. (20240128635). SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF simplified abstract
- Taiwan Semiconductor manufacturing Co., Ltd. patent applications on April 18th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 25th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240120639). Antenna Effect Protection and Electrostatic Discharge Protection for Three-Dimensional Integrated Circuit simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- Texas instruments incorporated (20240113050). SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS simplified abstract
- Texas instruments incorporated (20240113413). MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE simplified abstract
- TEXAS INSTRUMENTS INCORPORATED patent applications on April 4th, 2024
- Texas Instruments Incorporated patent applications on February 1st, 2024
U
- US Patent Application 17664727. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS simplified abstract
- US Patent Application 17828803. POWER CONVERTER MODULE simplified abstract
- US Patent Application 18231772. RADIO FREQUENCY SWITCH simplified abstract
- US Patent Application 18232312. DUAL-MODE WIRELESS CHARGING DEVICE simplified abstract
- US Patent Application 18232978. SEMICONDUCTOR MODULE simplified abstract
- US Patent Application 18233459. INTEGRATED CIRCUIT, FRONT-END MODULE, AND COMMUNICATION APPARATUS simplified abstract
- US Patent Application 18366282. Antenna Apparatus and Method simplified abstract