18061763. Semiconductor package with an antenna substrate simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Semiconductor package with an antenna substrate
Organization Name
Inventor(s)
Myungsam Kang of Hwaseong-si (KR)
Semiconductor package with an antenna substrate - A simplified explanation of the abstract
This abstract first appeared for US patent application 18061763 titled 'Semiconductor package with an antenna substrate
Simplified Explanation
The abstract describes a semiconductor package that includes a front redistribution structure, a dielectric layer, an antenna substrate, a semiconductor chip, a conductive core structure, and a rear redistribution structure.
- The front redistribution structure has a first and second surface.
- The dielectric layer is present in the package.
- The antenna substrate contains multiple antenna members within the dielectric layer.
- The semiconductor chip has a connection pad that is connected to the antenna members.
- The conductive core structure has a first through-hole accommodating the antenna substrate and a second through-hole accommodating the semiconductor chip.
- The rear redistribution structure includes a conductive cover layer that exposes the upper portion of the antenna substrate and covers the upper portion of the semiconductor chip.
- A conductive via connects the conductive cover layer to the conductive core structure.
Potential Applications
- This semiconductor package can be used in various electronic devices such as smartphones, tablets, and IoT devices.
- It can be utilized in wireless communication systems, enabling efficient transmission and reception of signals.
Problems Solved
- The package provides a compact and integrated solution for incorporating antenna functionality into a semiconductor chip.
- It simplifies the manufacturing process by reducing the number of components and interconnections required.
Benefits
- The front redistribution structure and antenna substrate allow for improved signal transmission and reception.
- The conductive core structure and rear redistribution structure provide structural support and protection for the semiconductor chip and antenna substrate.
- The package offers a smaller form factor, making it suitable for miniaturized electronic devices.
Original Abstract Submitted
A semiconductor package includes a front redistribution structure having a first surface and a second surface, opposite to the first surface, a dielectric layer, an antenna substrate including a plurality of antenna members in the dielectric layer, a semiconductor chip having a connection pad connected to the plurality of antenna members, a conductive core structure having a first through-hole accommodating the antenna substrate and a second through-hole accommodating the semiconductor chip, and a rear redistribution structure including a conductive cover layer exposing an upper portion of the antenna substrate and covering an upper portion of the semiconductor chip, and a conductive via connecting the conductive cover layer to the conductive core structure.
