17461957. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

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PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Chung-Hao Tsai of Changhua County (TW)

Tzu-Chun Tang of Kaohsiung City (TW)

Chuei-Tang Wang of Taichung City (TW)

Chen-Hua Yu of Hsinchu City (TW)

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17461957 titled 'PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The patent application describes a package structure and a manufacturing method for electronic devices. The structure includes a carrier substrate, an integrated circuit (IC) die, an antenna pattern, a redistribution structure, and an underfill.

  • The carrier substrate is a base material that provides mechanical support for the electronic components.
  • The IC die is a small chip that contains the integrated circuitry of the device.
  • The antenna pattern is a design that allows for wireless communication.
  • The redistribution structure connects the antenna pattern to the IC die.
  • The underfill is a material that fills the space between the carrier substrate and provides thermal coupling.

Potential applications of this technology:

  • Mobile devices such as smartphones and tablets.
  • Internet of Things (IoT) devices.
  • Wireless communication devices.

Problems solved by this technology:

  • Provides a compact and efficient package structure for electronic devices.
  • Ensures proper thermal management to prevent overheating.
  • Enables wireless communication capabilities.

Benefits of this technology:

  • Improved performance and reliability of electronic devices.
  • Enhanced wireless connectivity.
  • Compact and space-saving design.


Original Abstract Submitted

A package structure and a manufacturing method thereof are provided. The package structure includes a carrier substrate, an integrated circuit (IC) die thermally coupled to the carrier substrate through a thermally conductive layer, an antenna pattern disposed over the carrier substrate and the IC die, a redistribution structure disposed between the antenna pattern and the IC die, and an underfill disposed below and thermally coupled to the carrier substrate. The antenna pattern is electrically coupled to the IC die.

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