18484311. DEVICES AND METHODS RELATED TO STACK ASSEMBLY simplified abstract (SKYWORKS SOLUTIONS, INC.)
Contents
- 1 DEVICES AND METHODS RELATED TO STACK ASSEMBLY
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DEVICES AND METHODS RELATED TO STACK ASSEMBLY - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
DEVICES AND METHODS RELATED TO STACK ASSEMBLY
Organization Name
Inventor(s)
Hardik Bhupendra Modi of Irvine CA (US)
Adarsh Karan Jaiswal of Santa Ana CA (US)
Anil K. Agarwal of Ladera Ranch CA (US)
Engin Ibrahim Pehlivanoglu of Costa Mesa CA (US)
DEVICES AND METHODS RELATED TO STACK ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 18484311 titled 'DEVICES AND METHODS RELATED TO STACK ASSEMBLY
Simplified Explanation
The abstract describes a patent application related to stack assembly in radio-frequency modules, where an electro-acoustic device is mounted on a packaging substrate along with an integrated circuit die to form a stack assembly.
- The patent application involves a radio-frequency module with a packaging substrate that receives multiple components, an electro-acoustic device mounted on the substrate, and an integrated circuit die placed over the electro-acoustic device to create a stack assembly.
- The electro-acoustic device can be a filter device like a surface acoustic wave filter, while the die can be an amplifier die such as a low-noise amplifier implemented on a silicon die.
Potential Applications
The technology described in the patent application could be applied in the development of advanced radio-frequency modules for communication devices, radar systems, and other wireless applications.
Problems Solved
This innovation solves the challenge of efficiently integrating multiple components, including an electro-acoustic device and an integrated circuit die, in a compact and reliable manner within a radio-frequency module.
Benefits
The benefits of this technology include improved performance, reduced size, enhanced reliability, and simplified manufacturing processes for radio-frequency modules.
Potential Commercial Applications
The technology has potential commercial applications in the telecommunications industry, aerospace and defense sector, consumer electronics market, and other industries requiring high-performance radio-frequency modules.
Possible Prior Art
One possible prior art could be the use of traditional methods for assembling radio-frequency modules, which may not offer the same level of integration and efficiency as the stack assembly described in the patent application.
Unanswered Questions
How does this technology compare to existing stack assembly methods in terms of cost-effectiveness and performance?
The article does not provide a direct comparison between this technology and existing stack assembly methods in terms of cost-effectiveness and performance.
What specific design considerations are necessary when implementing this technology in different types of radio-frequency modules?
The article does not address the specific design considerations that may be necessary when implementing this technology in various types of radio-frequency modules.
Original Abstract Submitted
Devices and methods related to stack assembly. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.
